公开(公告)号：US20110308549A1

公开(公告)日：2011-12-22

申请号：US13161714

申请日：2011-06-16

申请人： Teruomi MINAMI ,  Naoyuki Okamura ,  Hirotaka Maruyama ,  Yosuke Kawabuchi

发明人： Teruomi MINAMI ,  Naoyuki Okamura ,  Hirotaka Maruyama ,  Yosuke Kawabuchi

IPC分类号： B08B3/08 ,  B08B7/04

CPC分类号： H01L21/67028 ,  H01L21/02052 ,  H01L21/67051

摘要： In a substrate processing method according to the present invention, a substrate is first processed using a chemical liquid. Next, the substrate is rinsed by supplying a rinsing liquid thereto while the substrate is being rotated. Thereafter, the substrate is dried while the substrate is being rotated. The drying of the substrate includes reducing a rotating speed of the substrate to a first rotating speed lower than that of the substrate during the rinsing of the substrate, while supplying the rinsing liquid to a central portion of the substrate; moving, from the central portion of the substrate toward a peripheral edge portion thereof, a rinsing liquid supply position to which the rinsing liquid is supplied, after the rotating speed of the substrate has been reduced to the first rotating speed; and supplying a drying liquid to the substrate, after the rinsing liquid supply position has been moved.

摘要翻译： 在本发明的基板处理方法中，首先使用化学液处理基板。 接下来，在旋转基板的同时通过供给冲洗液来冲洗基板。 此后，在旋转基板的同时干燥基板。 基板的干燥包括在冲洗衬底期间将衬底的旋转速度降低到低于衬底的旋转速度，同时将冲洗液体供应到衬底的中心部分; 在基板的旋转速度降低到第一旋转速度之后，从基板的中心部朝向其周边部分移动供给冲洗液体的冲洗液体供给位置; 并且在冲洗液体供应位置已经移动之后将干燥液体供应到基底。

公开(公告)号：US08906165B2

公开(公告)日：2014-12-09

申请号：US13161714

申请日：2011-06-16

申请人： Teruomi Minami ,  Naoyuki Okamura ,  Hirotaka Maruyama ,  Yosuke Kawabuchi

发明人： Teruomi Minami ,  Naoyuki Okamura ,  Hirotaka Maruyama ,  Yosuke Kawabuchi

IPC分类号： B08B7/04 ,  H01L21/02 ,  H01L21/67

CPC分类号： H01L21/67028 ,  H01L21/02052 ,  H01L21/67051

摘要： In a substrate processing method according to the present invention, a substrate is first processed using a chemical liquid. Next, the substrate is rinsed by supplying a rinsing liquid thereto while the substrate is being rotated. Thereafter, the substrate is dried while the substrate is being rotated. The drying of the substrate includes reducing a rotating speed of the substrate to a first rotating speed lower than that of the substrate during the rinsing of the substrate, while supplying the rinsing liquid to a central portion of the substrate; moving, from the central portion of the substrate toward a peripheral edge portion thereof, a rinsing liquid supply position to which the rinsing liquid is supplied, after the rotating speed of the substrate has been reduced to the first rotating speed; and supplying a drying liquid to the substrate, after the rinsing liquid supply position has been moved.

摘要翻译： 在本发明的基板处理方法中，首先使用化学液处理基板。 接下来，在旋转基板的同时通过供给冲洗液来冲洗基板。 此后，在旋转基板的同时干燥基板。 基板的干燥包括在冲洗衬底期间将衬底的旋转速度降低到低于衬底的旋转速度，同时将冲洗液体供应到衬底的中心部分; 在基板的旋转速度降低到第一旋转速度之后，从基板的中心部朝向其周边部分移动供给冲洗液体的冲洗液体供给位置; 并且在冲洗液体供应位置已经移动之后将干燥液体供应到基底。

公开(公告)号：US20110315169A1

公开(公告)日：2011-12-29

申请号：US13161721

申请日：2011-06-16

申请人： Teruomi MINAMI ,  Naoyuki Okamura ,  Yosuke Kawabuchi

发明人： Teruomi MINAMI ,  Naoyuki Okamura ,  Yosuke Kawabuchi

IPC分类号： B08B3/00

CPC分类号： H01L21/67028 ,  H01L21/67051

摘要： In a substrate processing method according to the present invention, a cleaning liquid nozzle supplies a rinsing liquid to a central portion of a substrate and thereafter moves from a position corresponding to the central portion of the substrate to a position corresponding to a peripheral, edge portion thereof while supplying the rinsing liquid before stopping at the position corresponding to the peripheral edge portion. Next, a drying liquid nozzle moves from the position corresponding to the peripheral edge portion to the position corresponding to the central portion while supplying a drying liquid. Then, the drying liquid nozzle is kept stationary at the position corresponding to the central portion for a predetermined period of time while supplying the drying liquid.Thereafter, a gas nozzle moves from the position corresponding to the central portion to the position corresponding to the peripheral edge portion while supplying an inert gas.

摘要翻译： 在根据本发明的基板处理方法中，清洗液喷嘴将冲洗液体提供到基板的中心部分，然后从与基板的中心部分相对应的位置移动到对应于周边边缘部分的位置 同时在与周缘部对应的位置停止前供给冲洗液。 接着，在供给干燥液的同时，将干燥液喷嘴从对应于周缘部的位置移动到与中央部对应的位置。 然后，在供给干燥液体的同时，将干燥液喷嘴保持静止在与中央部分对应的位置一段预定的时间。 此后，在供给惰性气体的同时，气体喷嘴从对应于中心部分的位置移动到对应于周边边缘部分的位置。

公开(公告)号：US08545640B2

公开(公告)日：2013-10-01

申请号：US13161721

申请日：2011-06-16

申请人： Teruomi Minami ,  Naoyuki Okamura ,  Yosuke Kawabuchi

发明人： Teruomi Minami ,  Naoyuki Okamura ,  Yosuke Kawabuchi

IPC分类号： B08B3/02

CPC分类号： H01L21/67028 ,  H01L21/67051

摘要： In a substrate processing method according to the present invention, a cleaning liquid nozzle supplies a rinsing liquid to a central portion of a substrate and thereafter moves from a position corresponding to the central portion of the substrate to a position corresponding to a peripheral, edge portion thereof while supplying the rinsing liquid before stopping at the position corresponding to the peripheral edge portion. Next, a drying liquid nozzle moves from the position corresponding to the peripheral edge portion to the position corresponding to the central portion while supplying a drying liquid. Then, the drying liquid nozzle is kept stationary at the position corresponding to the central portion for a predetermined period of time while supplying the drying liquid. Thereafter, a gas nozzle moves from the position corresponding to the central portion to the position corresponding to the peripheral edge portion while supplying an inert gas.

摘要翻译： 在根据本发明的基板处理方法中，清洗液喷嘴将冲洗液体提供到基板的中心部分，然后从与基板的中心部分相对应的位置移动到对应于周边边缘部分的位置 同时在与周缘部对应的位置停止前供给冲洗液。 接着，在供给干燥液的同时，将干燥液喷嘴从对应于周缘部的位置移动到与中央部对应的位置。 然后，在供给干燥液体的同时，将干燥液喷嘴保持静止在与中央部分对应的位置一段预定的时间。 此后，在供给惰性气体的同时，气体喷嘴从对应于中心部分的位置移动到对应于周边边缘部分的位置。

公开(公告)号：US08475668B2

公开(公告)日：2013-07-02

申请号：US12902721

申请日：2010-10-12

申请人： Hiroshi Tanaka ,  Teruomi Minami ,  Yosuke Kawabuchi ,  Norihiro Ito ,  Fumihiro Kamimura ,  Takashi Yabuta ,  Kazuki Kosai ,  Takeshi Uno ,  Kenji Sekiguchi ,  Yasushi Fujii

发明人： Hiroshi Tanaka ,  Teruomi Minami ,  Yosuke Kawabuchi ,  Norihiro Ito ,  Fumihiro Kamimura ,  Takashi Yabuta ,  Kazuki Kosai ,  Takeshi Uno ,  Kenji Sekiguchi ,  Yasushi Fujii

IPC分类号： H01B13/00

CPC分类号： H01L21/02057 ,  H01L21/67051

摘要： Provided are a substrate liquid processing apparatus, a substrate liquid processing method, and a computer readable storage medium having a substrate liquid processing program stored therein that can prevent the occurrence of the electrostatic breakdown caused by the discharge of electric charges in a substrate. The substrate liquid processing apparatus processes a circuit-forming surface of the substrate with a chemical liquid. Furthermore, prior to processing the substrate with the chemical liquid, the substrate liquid processing apparatus performs an anti-static process for an surface opposite to the circuit-forming surface of the substrate by an anti-static liquid, thereby emitting the electric charges on the substrate.

摘要翻译： 提供一种基板液体处理装置，基板液体处理方法以及其中存储有基板液体处理程序的计算机可读存储介质，其可以防止由基板中的电荷放电引起的静电破坏的发生。 基板液体处理装置用化学液体处理基板的电路形成表面。 此外，在用化学液体处理基板之前，基板液体处理装置通过防静电液体对与基板的电路形成面相反的表面进行防静电处理，从而将电荷 基质。