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    Connection components with frangible leads and bus
    1.
    发明申请
    Connection components with frangible leads and bus 失效
    连接组件采用易碎导线和总线

    公开(公告)号：US20040238922A1

    公开(公告)日：2004-12-02

    申请号：US10872105

    申请日：2004-06-18

    申请人： Tessera, Inc.

    发明人： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

    IPC分类号： H01L023/495

    CPC分类号： H01L24/86 ,  H01L23/3107 ,  H01L23/49572 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  H01L2924/00

    摘要： A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure. A semiconductor chip is disposed beneath the bottom surface of the support structure. The leads are adapted to be bonded to contacts on the semiconductor chip by breaking the frangible sections of the leads so as to disconnect the second ends of the leads from the bus and engage the leads with the contacts of the semiconductor chip.

    摘要翻译： 半导体芯片安装部件包括适于接合半导体芯片的支撑结构。 支撑结构具有顶表面，底表面和延伸穿过支撑结构的间隙，用于限定支撑结构在间隙的相对侧上的第一和第二部分。 支撑结构包括在支撑结构的第二部分上沿着间隙布置的至少一个细长总线。 支撑结构包括多个导电引线，每个引线具有跨越间隙延伸的连接部分，连接部分具有设置在支撑结构的第一部分上的第一端和固定到总线的第二端。 每个引线包括设置在连接部分的第一和第二端之间的易碎部分，该易碎部分的横截面积小于连接部分的横截面面积。 间隙在支撑结构的底部表面开口。 半导体芯片设置在支撑结构的底表面下方。 引线适于通过断开引线的易碎部分而与半导体芯片上的触点接合，从而将引线的第二端与母线断开，并与半导体芯片的触点接合引线。