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    Semiconductor package having non-ceramic based window frame
    1.
    发明申请
    Semiconductor package having non-ceramic based window frame 有权
    具有非陶瓷窗框的半导体封装

    公开(公告)号：US20040195662A1

    公开(公告)日：2004-10-07

    申请号：US10339834

    申请日：2003-01-10

    申请人： KYOCERA AMERICA, INC.

    发明人： Jeffrey Venegas ,  Paul Garland ,  Joshua Lobsinger ,  Linda Luu

    IPC分类号： H01L021/44 ,  H01L023/12

    CPC分类号： H01L23/047 ,  H01L23/057 ,  H01L23/3675 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48137 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluorethylene, filled with fibers which may be glass fibers or ceramic fibers. The matrix is clad in a metal such as copper or aluminum, and may be coated with nickel and gold to facilitate bonding of the window frame to the flange and the leads with gold/germanium solder. The window frame may also be bonded to the flange using epoxy. Cladding of the window frame may be performed by laminating copper or other cladding metal on the matrix in a sufficient thickness so as to form the flange. The flange may be provided with a pedestal extending upwardly from an upper surface at a central portion thereof to define a die attach area and forming a barrier to brazing material used to join the window frame to the flange.

    摘要翻译： 用于功率晶体管等的半导体封装具有安装在其上的至少一个管芯的散热器法兰，其上安装在其上的非陶瓷基窗口框架，以及安装在窗框上的多个引线并电耦合到 通过电线键 非陶瓷的窗框与通常用于凸缘的铜或其它高导​​电材料热匹配，以便于在高温下组装半导体封装。 非陶瓷型窗框是柔性的，并且与高导电性凸缘热匹配，以便以类似于凸缘的速率膨胀和收缩，以防止在组装半导体封装期间的故障。 窗框的非陶瓷基材料包括主要有机材料的基体，例如聚四氟乙烯，其填充有可以是玻璃纤维或陶瓷纤维的纤维。 该基质包覆金属如铜或铝，并且可以涂覆有镍和金，以便于窗框与凸缘和金/锗焊料的引线接合。 窗框也可以使用环氧树脂粘合到凸缘上。 可以通过以足够的厚度将铜或其它包覆金属层叠在基体上以形成凸缘来执行窗框的包层。 凸缘可以设置有从中心部分的上表面向上延伸的基座，以限定管芯附接区域并且形成用于将窗框架连接到凸缘的钎焊材料的阻挡层。

    Double-packaged multi-chip semiconductor module
    8.
    发明申请
    Double-packaged multi-chip semiconductor module 失效
    双封装多芯片半导体模块

    公开(公告)号：US20030155649A1

    公开(公告)日：2003-08-21

    申请号：US10423122

    申请日：2003-04-25

    发明人： Alan G. Wood ,  Eugene H. Cloud ,  Larry D. Kinsman

    IPC分类号： H01L023/12

    CPC分类号： H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then received by a housing. The conductive leads of the packaged devices are electrically coupled with pads manufactured into the housing. These pads are connected to traces within the housing, which terminate externally to the housing. Input/output leads are then electrically coupled with the traces, or are coupled with the traces as the housing is manufactured. The input/output leads provide means for connecting the housing with the electronic device or system into which it is installed. A lid received by the housing hermetically seals the packaged die in the housing, and prevents moisture or other contaminants which may impede the proper functionality of the die from entering the housing.

    摘要翻译： 将多个半导体管芯封装成一个部件。 本发明的设计包括已经被单一化，封装和彻底测试的功能和遵守所需规格的装置。 然后，多个封装的装置被壳体接收。 封装器件的导电引线与制造在外壳中的焊盘电耦合。 这些焊盘连接到壳体内的迹线，外壳上的迹线终止。 然后，输入/输出引线与迹线电耦合，或者当制造外壳时与引线耦合。 输入/输出引线提供用于将壳体与其所安装的电子设备或系统连接的装置。 由壳体容纳的盖子将封装的模具密封在壳体中，并且防止可能妨碍模具的正常功能的水分或其它污染物进入壳体。

    Wafer-level package with silicon gasket
    9.
    发明申请
    Wafer-level package with silicon gasket 有权
    晶圆级封装带硅垫片

    公开(公告)号：US20030116825A1

    公开(公告)日：2003-06-26

    申请号：US10028058

    申请日：2001-12-20

    发明人： Frank S. Geefay ,  Qing Gan ,  Ann Mattos ,  Domingo A. Figueredo

    IPC分类号： H01L029/06 ,  H01L023/12

    CPC分类号： B81B7/0077 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.

    摘要翻译： 垫圈在盖晶片和基底晶片之间包围密封的环境。 垫圈使用接合材料结合到基底晶片。 接合材料可以是显示可接受的粘合性，密封性和确保密封环境的其它性质的许多物质中的一种或多种。 垫片从盖片材料本身雕刻出来。 盖晶片通常由非常坚固和刚性的材料制成，例如硅。 由于垫片是由盖片制成的，所以垫片本身也非常坚固和坚固。