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公开(公告)号：US20090239454A1
公开(公告)日：2009-09-24
申请号：US12311226
申请日：2007-09-21
申请人： Tetsuji Yamashita , Naoki Rikita , Takashi Kimura , Masaharu Ogyu , Hiroaki Ashizawa , Hironori Hatono , Masahiro Tokita
发明人： Tetsuji Yamashita , Naoki Rikita , Takashi Kimura , Masaharu Ogyu , Hiroaki Ashizawa , Hironori Hatono , Masahiro Tokita
CPC分类号： B24B53/017 , B24B53/12 , B24D3/08 , B24D18/00
摘要： A CMP conditioner having excellent corrosion resistance around abrasive grains includes a grindstone base having, formed on one side, an abrasive grain layer including abrasive grains fixed in a metallic bonding phase treated to form a first protective layer comprising an oxide on the surface of the metallic bonding phase of the abrasive grain layer by the sol-gel method. Subsequently, an aerosol obtained by dispersing fine particles of a brittle material in a gas is jetted and caused to strike on the surface of the first protective layer to form a second protective layer comprising a thick oxide film.
摘要翻译： 具有优良的磨料颗粒周围耐腐蚀性的CMP调节剂包括：磨石基体，其一侧形成磨料颗粒层，该磨粒层包含固定在金属结合相中的磨粒，所述磨料颗粒层被处理以形成第一保护层，该第一保护层包含金属 通过溶胶 - 凝胶法研磨磨料层的结合相。 随后，将通过将脆性材料的细颗粒分散在气体中而获得的气溶胶被喷射并引起到第一保护层的表面上，形成包含厚氧化膜的第二保护层。
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公开(公告)号：US20090196989A1
公开(公告)日：2009-08-06
申请号：US12365621
申请日：2009-02-04
申请人： Takeshi Katayama , Satoru Katsumata , Takayuki Hanami , Hironori Hatono , Masahiro Tokita , Hiroaki Ashizawa
发明人： Takeshi Katayama , Satoru Katsumata , Takayuki Hanami , Hironori Hatono , Masahiro Tokita , Hiroaki Ashizawa
CPC分类号： B24D99/00 , B26D1/0006 , B26D2001/002 , B28D1/121 , H01L21/67092
摘要： A sharp-edged blade of the invention includes a circular thin-plate-shaped abrasive grain layer 3 in which abrasive grains 2 are held in a bond phase 1. An oxide film manufactured by a sol-gel method is formed on the surface of at least the bond phase 1 of the abrasive grain layer 3 as a first protective layer 4. A thick oxide film which has polycrystals and is structured such that a grain boundary layer composed of a glass layer does not exist at an interface substantially between the crystals is formed on the surface of the first protective layer 4 as a second protective layer 5.
摘要翻译： 本发明的锋利刃片包括圆形的薄板状磨粒层3，磨粒2保持在粘结相1中。通过溶胶 - 凝胶法制造的氧化膜形成在表面上 至少作为第一保护层4的磨粒层3的结合相1.具有多晶体并且被构造成使得由玻璃层组成的晶界层在基本上在晶体之间的界面处不存在的厚氧化膜是 形成在作为第二保护层5的第一保护层4的表面上。
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公开(公告)号：US07897268B2
公开(公告)日：2011-03-01
申请号：US12083065
申请日：2006-10-10
IPC分类号： B32B9/00
CPC分类号： C23C30/00 , B22F2998/00 , C23C24/04 , B22F7/04
摘要： According to the present invention, a structure made of yttrium oxide is formed on a surface of a substrate comprises yttrium oxide polycrystals as a main component, a boundary layer made of hyaline does not substantially exist on a boundary face between crystals which form the structure, and both a cubic system and a monoclinic system exist in the crystal system of the yttrium oxide polycrystals. With this, it is possible to adjust the hardness of the structure made of yttrium oxide formed on a surface of a substrate to be larger than that of an yttrium oxide sintered body.
摘要翻译： 根据本发明，在基板的表面上形成由氧化钇多晶体作为主要成分的结构，在形成该结构的晶体之间的界面上基本上不存在由透明性构成的边界层， 并且在氧化钇多晶体的晶体体系中存在立方体系和单斜晶系。 由此，可以将形成在基板表面上的氧化钇的结构的硬度调整为大于氧化钇烧结体的硬度。
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4.发明申请Method for Producing Coating Film Using Aerosol, Fine Particles for Use Therein, and Coating Film and Composite Material 审中-公开使用气雾剂制造涂膜的方法，其中使用的微粒，以及涂膜和复合材料公开(公告)号：US20080274348A1
公开(公告)日：2008-11-06
申请号：US11547509
申请日：2005-03-18
CPC分类号： C23C24/04 , Y10T428/25 , Y10T428/252 , Y10T428/2982
摘要： There is disclosed a method for producing a film with use of aerosol which is capable of forming a film of satisfactory quality at an extremely high film formation rate. In the method, first, a carrier gas is mixed into fine particles comprising a brittle material as a main component and having a 50% average particle diameter of 100 nm to 300 nm on a number basis to form an aerosol. The aerosol is ejected onto the surface of a substrate to make the fine particles come into collision with the substrate, so that the collision crushes or deforms the fine particles to form a film on the substrate.
摘要翻译： 公开了一种使用气溶胶制造膜的方法，该方法能够以极高的成膜速度形成令人满意的质量的膜。 在该方法中，首先，将载气以数量为基准混合成以脆性材料为主要成分，平均粒径为100nm〜300nm的微粒子，形成气溶胶。 将气溶胶喷射到基板的表面上，使得微粒与基板发生碰撞，使得碰撞使细颗粒破碎或变形，从而在基板上形成膜。
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5.发明申请Method for Producing Film Using Aerosol, Particles Mixture Therefor, and Film and Composite Material 审中-公开使用气雾剂，其颗粒混合物，薄膜和复合材料制造薄膜的方法公开(公告)号：US20080274347A1
公开(公告)日：2008-11-06
申请号：US11547515
申请日：2005-03-18
CPC分类号： C23C24/04 , Y10T428/25
摘要： There is disclosed a method for producing a film with use of aerosol which is capable of forming a film of satisfactory quality at a high film formation rate. In the method, first, a carrier gas is mixed into a particle mixture which comprises raw fine particles comprising a brittle material as a main component and having a 50% average particle diameter of 0.010 μm to 1.0 μm on a volume basis, and auxiliary particles comprising a brittle material of the same type as or a different type from the brittle material of the raw fine particles as a main component and having a 50% average particle diameter of 3.0 μm to 100 μm on a volume basis, to form an aerosol. The aerosol is ejected onto the surface of a substrate to make the particle mixture come into collision with the substrate, so that the collision crushes or deforms the raw fine particles to form a film on the substrate.
摘要翻译： 公开了一种使用气溶胶制造膜的方法，该方法能够以高的成膜速度形成令人满意的质量的膜。 在该方法中，首先，将载气混合成粒状混合物，该粒子混合物包含以脆性材料为主要成分的原料微粒，其平均粒径为0.010〜1.0μm，辅助粒子 包含与作为主要成分的原料微粒的脆性材料相同类型或不同类型的脆性材料，并且基于体积计平均粒径为3.0μm至100μm，形成气溶胶。 将气溶胶喷射到基板的表面上，使颗粒混合物与基板发生碰撞，使得碰撞使原始细颗粒破碎或变形，从而在基板上形成膜。
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公开(公告)号：US20090233126A1
公开(公告)日：2009-09-17
申请号：US12083065
申请日：2006-10-10
IPC分类号： B32B9/04
CPC分类号： C23C30/00 , B22F2998/00 , C23C24/04 , B22F7/04
摘要： According to the present invention, a structure made of yttrium oxide is formed on a surface of a substrate comprises yttrium oxide polycrystals as a main component, a boundary layer made of hyaline does not substantially exist on a boundary face between crystals which form the structure, and both a cubic system and a monoclinic system exist in the crystal system of the yttrium oxide polycrystals. With this, it is possible to adjust the hardness of the structure made of yttrium oxide formed on a surface of a substrate to be larger than that of an yttrium oxide sintered body.
摘要翻译： 根据本发明，在基板的表面上形成由氧化钇多晶体作为主要成分的结构，在形成该结构的晶体之间的界面上基本上不存在由透明性构成的边界层， 并且在氧化钇多晶体的晶体体系中存在立方体系和单斜晶系。 由此，可以将形成在基板表面上的氧化钇的结构的硬度调整为大于氧化钇烧结体的硬度。
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公开(公告)号：US20090142513A1
公开(公告)日：2009-06-04
申请号：US12352197
申请日：2009-01-12
IPC分类号： C23C16/513 , C23C16/44 , B05C11/00 , B08B5/00 , B08B6/00
CPC分类号： C23C16/08 , C23C16/4405
摘要： A treatment gas is supplied to form a Ti-based film on a predetermined number of wafers W while setting a temperature of a susceptor 2 in a chamber 1 to a predetermined temperature. After this, the interior of the chamber 1 containing no wafers W is cleaned by discharging Cl2 gas as a cleaning gas from a shower head 10 into the chamber 1. During this cleaning, the temperature of each of the susceptor 2, the shower head 10, and the wall portion of the chamber 1 is independently controlled so that the temperature of the susceptor 2 is not lower than the decomposition start temperature of Cl2 gas and the temperature of the shower head 10 and the wall portion of the chamber 1 is not higher than the decomposition start temperature.
摘要翻译： 供给处理气体以在预定数量的晶片W上形成Ti基膜，同时将室1中的基座2的温度设定到预定温度。 之后，通过将作为清洗气体的Cl 2气体从淋浴喷头10排出到室1中来清洁不含晶片W的室1的内部。在该清洁期间，基座2，淋浴头10 ，并且独立地控制室1的壁部，使得基座2的温度不低于Cl 2气体的分解开始温度，并且喷淋头10的温度和室1的壁部分的温度不高 比分解开始温度高。
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公开(公告)号：US07205501B2
公开(公告)日：2007-04-17
申请号：US10927185
申请日：2004-08-27
申请人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
发明人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
IPC分类号： B23K26/38
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2101/42 , B23K2103/12
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
摘要翻译： 激光加工方法和激光加工装置，其孔位精度和孔质量优异。 作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。 将＃1分支光束供给到要加工的部分，以便加工该部分。 在这种情况下，可以控制＃1分支光束与输出光束同步。 当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个 的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。
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公开(公告)号：US20050155958A1
公开(公告)日：2005-07-21
申请号：US10927185
申请日：2004-08-27
申请人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
发明人： Kunio Arai , Kazuhisa Ishii , Hiroaki Ashizawa
IPC分类号： B23K26/04 , B23K26/06 , B23K26/073 , B23K101/40 , B23K101/42 , H05K3/00 , B23K26/40
CPC分类号： H05K3/0038 , B23K26/04 , B23K26/0622 , B23K26/384 , B23K2101/42 , B23K2103/12
摘要： A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.
摘要翻译： 激光加工方法和激光加工装置，其孔位精度和孔质量优异。 作为短脉冲输出的输出光束通过脉冲整形单元成形，从而形成＃1分支光束。 将＃1分支光束供给到要加工的部分，以便加工该部分。 在这种情况下，可以控制＃1分支光束与输出光束同步。 当要被加工的零件由金属材料和有机材料和无机材料中的至少一种制成时，金属材料被加工成具有不小于100ns的脉冲宽度的激光束，并且至少一个 的有机材料和无机材料用激光束加工成具有短于100ns的脉冲宽度。
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公开(公告)号：US20050136657A1
公开(公告)日：2005-06-23
申请号：US11033406
申请日：2005-01-12
CPC分类号： C23C16/34 , C23C16/4404
摘要： A film-formation method for a semiconductor process includes pre-coating of covering a worktable with a pre-coat before loading a target substrate into a process chamber, and film formation thereafter of loading the target substrate into the process chamber, and forming a main film on the target substrate. The pre-coating repeats the first and second steps a plurality of times, thereby laminating segment films to form the pre-coat. The first step supplies first and second process gases into the process chamber, thereby forming a segment film containing a metal element on the worktable. The second step supplies the second process gas containing no metal element into the process chamber, thereby exhausting and removing, from the process chamber, a byproduct produced in the first step other than a component forming the segment film.
摘要翻译： 半导体工艺的成膜方法包括在将目标衬底加载到处理室中之前用预涂层覆盖工作台，以及之后将目标衬底装载到处理室中的膜形成，以及形成主体 目标底物上的胶片。 预涂层重复第一和第二步骤多次，从而层压段膜以形成预涂层。 第一步骤将第一和第二工艺气体供应到处理室中，从而在工作台上形成含有金属元素的分段薄膜。 第二步骤将不含金属元素的第二工艺气体供应到处理室中，从而从处理室排出除去除了形成段膜的部件之外的第一步骤中产生的副产物。
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