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1.发明授权Apparatus for automatically mounting chip type circuit elements on printed circuit boards 失效芯片型电路元件自动安装在印刷电路板上的装置
公开(公告)号：US4606117A
公开(公告)日：1986-08-19
申请号：US585284
申请日：1984-03-01
CPC分类号： H05K13/0417 , H05K13/0408 , Y10T29/4913 , Y10T29/49133 , Y10T29/53178 , Y10T29/53261
摘要： Apparatus for automatically mounting chip type circuit elements on printed circuit boards is constructed in a manner to mount a feed wheel for carrying out the delivery of a chip tape on a lower frame. A lever is mounted with respect to the feed wheel through a one way clutch, so as to allow the lever to be pressed by a cam provided on a reciprocating upper frame which supports a mounting head. The feed wheel is thus rotated in the actuating direction of the one-way clutch to intermittently feed the chip tape and permit another chip type circuit element to be disposed at a chip type circuit element removing position, each time when the mounting head is returned to its original position.
摘要翻译： 用于在印刷电路板上自动安装芯片型电路元件的装置以安装用于在下框架上执行芯片带的传送的馈送轮的方式构造。 杠杆通过单向离合器相对于进给轮安装，以便允许杠杆由设置在支撑安装头的往复运动的上框架上的凸轮按压。 因此，馈送轮在单向离合器的致动方向上旋转以间歇地馈送芯片带，并且允许另一芯片型电路元件设置在芯片型电路元件去除位置，每当安装头返回到 其原来的位置。
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公开(公告)号：US4294000A
公开(公告)日：1981-10-13
申请号：US34014
申请日：1979-04-27
CPC分类号： B65G1/00 , H05K13/0417 , Y10T29/5142 , Y10T29/5149 , Y10T29/515 , Y10T29/53183
摘要： An insert sub-assembly of an insert device of a machine for processing and inserting parallel lead electronic components from an electronic component web carrier into lead receiving openings in a printed circuit board includes a first slider device slidably mounted on a frame. A driver mounted on the frame drives the first slider device. A second slider device slidably mounted on the frame cooperates with movement of the first slider device and includes a lead holding and guiding device for holding and guiding an electronic component and a push bar for displacing the component from a predetermined position to an inserted position under the control of the lead holding and guiding device. A feed device mounted on the frame is driven by an intermittent drive to feed the electronic component web carrier intermittently, pitch by pitch. A cutter separates one electronic component from the electronic component web carrier fed by the feed device. A transfer device includes a reciprocating unit for producing reciprocative movements between the cutter and the lead holding and guiding device and an electronic component holding device for holding a lead of the electronic component to be separated by the cutter and transferring the component to the lead holding and guiding device after such component has been separated by the cutter.
摘要翻译： 一种用于处理并将平行的铅电子部件从电子元件幅材载体插入到印刷电路板中的引线接收开口的机器的插入装置的插入子组件包括可滑动地安装在框架上的第一滑块装置。 安装在框架上的驱动器驱动第一滑块装置。 可滑动地安装在框架上的第二滑动装置与第一滑块装置的运动协调，并且包括用于保持和引导电子部件的引线保持和引导装置和用于将部件从预定位置移动到下面的插入位置的推杆 控制引线保持和引导装置。 安装在框架上的进给装置通过间歇驱动来驱动，以间歇地间歇地供给电子部件腹板载体。 切割器将一个电子元件与由馈送装置馈送的电子元件幅材载体分开。 传送装置包括：往复运动单元，用于在切割器和引线保持引导装置之间产生往复运动;以及电子部件保持装置，用于保持要由切割器分离的电子部件的引线并将部件传送到引线保持件， 在这种部件已经被切割器分离之后的引导装置。
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3.发明授权
公开(公告)号：US4292116A
公开(公告)日：1981-09-29
申请号：US28924
申请日：1979-04-10
CPC分类号： H05K13/0482 , Y10T156/1089 , Y10T156/1763 , Y10T156/1768 , Y10T156/1783 , Y10T29/53178 , Y10T29/53191 , Y10T29/53252 , Y10T29/53478
摘要： A method whereby chip type circuit elements are mounted at predetermined locations on a printed circuit board by a suction means and apparatus for performing the method are disclosed. The suction means picks up each circuit element from a respective stack supported in a vertical magazine and transfers and positions them above the predetermined locations on the printed circuit board which can have a predetermined pattern of laminar conductors on the upper surface thereof. The circuit elements are then released by termination of the applied suction and adhered to the board by a thermoplastic adhesive setting operation.
摘要翻译： 公开了一种芯片型电路元件通过抽吸装置和用于执行该方法的装置安装在印刷电路板上的预定位置上的方法。 抽吸装置从支撑在垂直仓库中的相应堆叠件拾取每个电路元件，并将它们传送并定位在印刷电路板上的预定位置上方，该印刷电路板在其上表面上可以具有预定图案的层状导体。 然后通过终止所施加的抽吸来释放电路元件，并通过热塑性粘合剂设置操作将其粘附到板上。
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4.发明授权Machine for processing and securing parallel lead electronic circuit elements to a printed circuit board 失效将平行的铅电子电路元件加工和固定到印刷电路板的机器
公开(公告)号：US4054988A
公开(公告)日：1977-10-25
申请号：US672944
申请日：1976-04-02
CPC分类号： H05K13/0452 , Y10T29/5142 , Y10T29/53183
摘要： A machine for processing and securing parallel lead electronic circuit elements into lead receiving openings formed in a printed circuit board is provided. The machine includes a supply assembly for selectively supplying one group of a plurality of distinct groups of parallel lead electronic circuit elements, the supply assembly including a selecting sub-assembly for selecting one of the circuit elements from the selected group circuit elements to be supplied. A transfer assembly includes a chuck for receiving the supplied circuit elements and displacing same to a release position. An insert assembly is adapted to effect release of the circuit elements when the chuck is displaced to a release position and includes a holding sub-assembly for receiving each circuit element released by the chuck at the release position and a plunger sub-assembly adapted to engage the circuit elements at the release position and displace the circuit elements from the release position to an inserted position. A board handling assembly disposes the receiving openings in the printed board in alignment with the circuit elements so that the parallel leads each circuit element are received in the appropriate receiving openings when same are displaced to the inserted position.
摘要翻译： 提供了一种用于将平行的引线电子电路元件处理和固定到形成在印刷电路板中的引线接收开口中的机器。 所述机器包括用于选择性地供应一组平行的引线电子电路元件的多个不同组的供电组件，所述供电组件包括用于从要供应的所选组电路元件中选择一个电路元件的选择子组件。 传送组件包括用于接收所提供的电路元件并将其移位到释放位置的卡盘。 插入组件适于当卡盘移位到释放位置时实现电路元件的释放，并且包括用于接收由释放位置处的卡盘释放的每个电路元件的保持子组件和适于接合的柱塞子组件 电路元件处于释放位置，并将电路元件从释放位置移位到插入位置。 板处理组件将印刷板中的接收开口布置成与电路元件对齐，使得当相同的位移到插入位置时，每个电路元件的平行引线接收在适当的接收开口中。
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公开(公告)号：US4619043A
公开(公告)日：1986-10-28
申请号：US591190
申请日：1984-03-19
CPC分类号： H05K13/0408 , Y10S269/903 , Y10T29/49144 , Y10T29/53178
摘要： An apparatus and method for mounting chip type electronic parts, in which the parts can be smoothly, reliably and accurately mounted on, for example, a printed circuit board. The apparatus for mounting the chip type parts comprises means for conveying the part to be mounted, means for supplying the part onto the conveying means, means for receiving the part from the conveying means and for mounting the same onto a printed circuit board for example, and also means for positioning the part upon the conveying means before transfer of the part to the receiving and mounting means. The method for mounting a chip type part according to the present invention comprises the steps of supplying the part onto means for conveying the same to be mounted, positioning of the part on the conveying means, and then removing the part off the conveying means and mounting the same.
摘要翻译： 一种用于安装芯片型电子部件的装置和方法，其中部件可以平滑，可靠和准确地安装在例如印刷电路板上。 用于安装芯片型部件的装置包括用于输送待安装部件的装置，用于将部件供应到传送装置上的装置，用于从传送装置接收部件并将其安装到例如印刷电路板上的装置， 以及用于在将部件转移到接收和安装装置之前将部件定位在输送装置上的装置。 根据本发明的用于安装芯片型部件的方法包括以下步骤：将部件供给到用于输送要安装的部件的装置，将部件定位在输送装置上，然后将部件从输送装置移除并安装 一样。
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6.发明授权
公开(公告)号：US4263708A
公开(公告)日：1981-04-28
申请号：US43750
申请日：1979-05-30
CPC分类号： H05K13/0452 , Y10T29/5137 , Y10T29/5142 , Y10T29/53183
摘要： A machine for processing and inserting parallel lead electronic components from electronic component web carriers into lead receiving openings in a printed circuit board has improved supply apparatus for selectively receiving an electronic component at a first position and supplying the electronic component to a second predetermined position. The supply apparatus includes a supply sub-assembly having electronic component web carrier apparatus for supporting a plurality of electronic component web carriers at predetermined intervals. Each electronic component web carrier supported by the electronic component web carrier support apparatus is intermittently fed by an intermittent feed device. One electronic component located at the front end of the electronic component web carrier fed by the intermittent feed device is received and gripped at the first position by an electronic component grip device. The electronic component thus received and gripped by the electronic component grip device is separated from the electronic component web carrier by a cutting device. The electronic grip device gripping the electronic component separated by the cutting device is moved to the second predetermined position by a transfer device.
摘要翻译： 用于将平行的铅电子部件从电子元件幅材载体处理和插入印刷电路板中的引线接收开口的机器具有改进的供应装置，用于在第一位置选择性地接收电子部件并将电子部件供应到第二预定位置。 供给装置包括具有用于以预定间隔支撑多个电子元件幅材载体的电子元件幅材载体装置的供应子组件。 由电子元件腹板载体支撑装置支撑的每个电子元件幅材载体由间歇进给装置间歇地供给。 位于由间歇进给装置供给的电子部件腹板载体的前端的一个电子部件通过电子部件夹持装置在第一位置处被夹持并夹持。 由电子部件抓握装置接收和夹住的电子部件通过切割装置与电子部件幅材载体分离。 夹持由切割装置分离的电子部件的电子抓地装置通过传送装置移动到第二规定位置。
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7.发明授权Apparatus for trimming and securing electronic components inserted into a printed circuit substrate 失效用于修整和固定插入到印刷电路基板中的电子部件的装置
公开(公告)号：US4165557A
公开(公告)日：1979-08-28
申请号：US860415
申请日：1977-12-13
申请人： Yoshinobu Taguchi , Kotaro Harigane , Tetsuro Ito
发明人： Yoshinobu Taguchi , Kotaro Harigane , Tetsuro Ito
CPC分类号： H05K13/0473 , Y10T29/515 , Y10T29/53065
摘要： An apparatus for trimming and securing parallel lead electronic components inserted in a printed circuit substrate is provided. The apparatus includes a selectively rotatable driving assembly selectively displaceable towards an electronic component inserted into a printed circuit substrate, a lead bending assembly mounted on the driving assembly for bending the leads, and a cutting assembly mounted on the bending assembly for cutting the leads, the bending and cutting assemblies actuated by displacement of the driving assembly. The apparatus may include a sub-assembly for disposal of chips removed from the leads during cutting and a detection sub-assembly for detecting the presence of an inserted electronic component.
摘要翻译： 提供了一种用于修整和固定插入印刷电路基板中的平行引线电子部件的装置。 该装置包括可选择地旋转的驱动组件，其可选择性地朝向插入印刷电路基板的电子部件移位，安装在驱动组件上用于弯曲引线的引线弯曲组件以及安装在弯曲组件上用于切割引线的切割组件， 弯曲和切割组件由驱动组件的位移致动。 该设备可以包括用于处理在切割期间从引线移除的芯片的子组件和用于检测插入的电子部件的存在的检测子组件。
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