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34 条记录 (耗时 0.034 秒)

    Stacked photovoltaic device
    3.
    发明授权
    Stacked photovoltaic device 有权
    堆叠式光伏器件

    公开(公告)号：US06835888B2

    公开(公告)日：2004-12-28

    申请号：US10422171

    申请日：2003-04-23

    申请人： Masafumi Sano ,  Tetsuro Nakamura

    发明人： Masafumi Sano ,  Tetsuro Nakamura

    IPC分类号： H01L31075

    CPC分类号： H01L31/076 ,  H01L31/1816 ,  H01L31/1824 ,  H01L31/202 ,  H01L31/206 ,  Y02E10/545 ,  Y02E10/548 ,  Y02P70/521

    摘要： A stacked photovoltaic device comprises at least three p-i-n junction constituent devices superposed in layers, each having a p-type layer, an i-type layer and an n-type layer which are formed of silicon non-single crystal semiconductors. An amorphous silicon layer is used as the i-type layer of a first p-i-n junction, a microcrystalline silicon layer is used as the i-type layer of a second p-i-n junction and a microcrystalline silicon layer is used as the i-type layer of a third p-i-n junction, the first to third layers being in order from the light incident side. In this way, a stacked photovoltaic device can be provided which is practical and low-cost and yet has high reliability and high photoelectric conversion efficiency.

    摘要翻译： 层叠的光伏器件包括叠层的至少三个p-i-n结构成器件，每个具有由非硅单晶半导体形成的p型层，i型层和n型层。 非晶硅层用作第一pin结的i型层，微晶硅层用作第二pin结的i型层，微晶硅层用作i型层 第三针结，第一至第三层从光入射侧依次排列。 以这种方式，可以提供实用且低成本但具有高可靠性和高光电转换效率的叠层光伏器件。

    Direct-contact type image sensor device, an image sensor unit, and methods for producing the same
    4.
    发明授权
    Direct-contact type image sensor device, an image sensor unit, and methods for producing the same 失效
    直接接触型图像传感器装置，图像传感器单元及其制造方法

    公开(公告)号：US5477047A

    公开(公告)日：1995-12-19

    申请号：US141328

    申请日：1993-10-21

    申请人： Masahiro Nakagawa ,  Tetsuro Nakamura ,  Shinji Fujiwara ,  Eiichiro Tanaka

    发明人： Masahiro Nakagawa ,  Tetsuro Nakamura ,  Shinji Fujiwara ,  Eiichiro Tanaka

    IPC分类号： H04N1/031 ,  H01J40/14

    CPC分类号： H04N1/0316 ,  H04N1/0313

    摘要： A direct-contact type image sensor device according to the present invention includes: a light-transmitting substrate having an upper surface and a lower surface; a patterned conductor layer formed over the upper surface of the light-transmitting substrate; a transparent electrically conductive layer formed on the lower surface of the light-transmitting substrate; an image sensor chip mounted face-down on the upper surface of the light-transmitting substrate, with an insulating resin layer being interposed between the image sensor chip and the upper surface of the light-transmitting substrate, the image sensor chip being mounted by a flip-chip-bonding method, a light-interrupting layer provided between the patterned conductor layer and the upper surface of the light-transmitting substrate; and a light-interrupting portion for interrupting a portion of a light beam, the light beam being radiated on an original through the light-transmitting substrate by a light source disposed above the light-transmitting substrate. The image sensor chip and the light-interrupting portion serve as an optical throttle for the light beam.

    摘要翻译： 根据本发明的直接接触型图像传感器装置包括：具有上表面和下表面的透光基底; 形成在所述透光基板的上表面上的图案化导体层; 形成在所述透光基板的下表面上的透明导电层; 图像传感器芯片，其面向下安装在透光基板的上表面上，绝缘树脂层插入在图像传感器芯片和透光基板的上表面之间，图像传感器芯片由 倒装芯片接合方法，设置在图案化导体层和透光基板的上表面之间的遮光层; 以及用于中断光束的一部分的遮光部，通过透光基板通过设置在透光基板上方的光源将光束照射在原稿上。 图像传感器芯片和遮光部分用作光束的光学节流阀。

    Direct-contact type image sensor using optical fiber array with light absorbing cladding
    5.
    发明授权
    Direct-contact type image sensor using optical fiber array with light absorbing cladding 失效
    直接接触式图像传感器，采用光吸收包层光纤阵列

    公开(公告)号：US5448055A

    公开(公告)日：1995-09-05

    申请号：US161123

    申请日：1993-12-02

    申请人： Tetsuro Nakamura ,  Eiji Kawamoto ,  Shinji Fujiwara

    发明人： Tetsuro Nakamura ,  Eiji Kawamoto ,  Shinji Fujiwara

    IPC分类号： G02B6/08 ,  H04N1/031 ,  H01J40/14

    CPC分类号： H04N1/0312 ,  G02B6/08 ,  H04N1/0311 ,  H04N1/0315

    摘要： The present invention provides a direct-contact type image sensor device in which an image sensor chip having electrodes and a photosensitive element array is mounted on an optical fiber array plate by a flip-chip-bonding method. The optical fiber array plate includes a first opaque substrate, a second opaque substrate, an optical fiber array formed by arranging a plurality of optical fibers, and a transparent member disposed in contact with a side face of the optical fiber array, the optical fiber array and the transparent member being interposed between the first and second opaque substrates. Each of the plurality of optical fibers includes a center core, a clad provided on an outer surface of the core, and a light absorbing layer provided on an outer surface of the clad. The image sensor chip is provided in such a way that the photosensitive element array is disposed along an upper end of the optical fiber array and in a portion of the optical fiber array plate except the transparent member, the transparent member forming a slit for transmitting light.

    摘要翻译： 本发明提供一种直接接触型图像传感器装置，其中具有电极和感光元件阵列的图像传感器芯片通过倒装芯片接合方法安装在光纤阵列板上。 光纤阵列板包括：第一不透明基板，第二不透明基板，通过布置多根光纤形成的光纤阵列;以及与光纤阵列的侧面接触设置的透明部件，所述光纤阵列 并且所述透明构件插入在所述第一和第二不透明基板之间。 多个光纤中的每一个包括中心芯，设置在芯的外表面上的包层以及设置在包层的外表面上的光吸收层。 图像传感器芯片以这样的方式设置，使得光敏元件阵列沿着光纤阵列的上端布置，并且在除了透明构件之外的光纤阵列板的一部分中，透明构件形成用于透射光的狭缝 。

    Image sensors with an optical fiber array
    6.
    发明授权
    Image sensors with an optical fiber array 失效
    具有光纤阵列的图像传感器

    公开(公告)号：US5266828A

    公开(公告)日：1993-11-30

    申请号：US884826

    申请日：1992-05-18

    申请人： Tetsuro Nakamura ,  Takahiko Murata ,  Shinji Fujiwara

    发明人： Tetsuro Nakamura ,  Takahiko Murata ,  Shinji Fujiwara

    IPC分类号： G02B6/42 ,  H04N1/031 ,  H01L27/14

    CPC分类号： H04N1/0312 ,  G02B6/4249 ,  H01L27/14618 ,  H01L27/14625 ,  H04N1/0311 ,  H04N1/0316 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041

    摘要： This invention relates to an image sensor with photo sensors (13). An object thereof is to simplify mounting operation of an image sensor chip (12) provided with the photo sensors (13). In order to accomplish this object, according to this invention, the photo sensors (13) and electrodes (15) are disposed on the underside of the image sensor chip (12). The image sensor chip (12) is bonded to the upper side of a transparent substrate (18) by means of a transparent photo-setting type insulating resin (16), so that the electrodes (15) come into contact with circuit conductor layers (17) disposed on the upper side of the transparent substrate (18). With the above-mentioned construction, since fine metal wire (75) by which the electrodes (15) and the circuit conductor layers (17) are connected to each other is not required, mounting operation can be simplified.

    摘要翻译： 本发明涉及具有光传感器（13）的图像传感器。 其目的在于简化设置有光传感器（13）的图像传感器芯片（12）的安装操作。 为了实现该目的，根据本发明，光传感器（13）和电极（15）设置在图像传感器芯片（12）的下侧。 图像传感器芯片12通过透明光固定型绝缘树脂16与透明基板18的上侧接合，使得电极15与电路导体层（ 17）设置在透明基板（18）的上侧。 利用上述结构，由于不需要将电极（15）和电路导体层（17）彼此连接的细金属线（75），因此可以简化安装操作。