公开(公告)号：US07506548B2

公开(公告)日：2009-03-24

申请号：US11865479

申请日：2007-10-01

申请人： Tetsuya Fukuda ,  Katsuya Kikuiri ,  Kiyoshi Sato ,  Mitsuru Watanabe ,  Yoshinobu Nakamura

发明人： Tetsuya Fukuda ,  Katsuya Kikuiri ,  Kiyoshi Sato ,  Mitsuru Watanabe ,  Yoshinobu Nakamura

IPC分类号： G01L7/00

CPC分类号： G01L19/0069 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several μms.

摘要翻译： 封装主要由具有用于存储压力传感器的存储区域的存储区域，存储在封装体的存储区域中的容量型压力传感器，密封保存有压力传感器的封装体的封装体，粘合剂 用于将压力传感器固定到封装主体的代理，以及用于将压力传感器的焊盘电耦接到封装体的导电部分的接合线。 包装体和压力传感器的粘合区域设置在除了压力传感器的隔膜的投影区域之外的区域在安装底面上。 这使得可以提供能够以高灵敏度检测压力的压力传感器的封装，尽管基板和隔膜之间的间隙具有几个数量级的值。

公开(公告)号：US07469590B2

公开(公告)日：2008-12-30

申请号：US11870791

申请日：2007-10-11

申请人： Tetsuya Fukuda ,  Mitsuru Watanabe

发明人： Tetsuya Fukuda ,  Mitsuru Watanabe

IPC分类号： G01L9/12

CPC分类号： G01L9/0075

摘要： A pressure-sensor package mainly includes a pressure sensor, a support substrate, and a resin layer. The pressure sensor includes a glass substrate having a fixed electrode, and a silicon substrate having a diaphragm that is disposed apart from the fixed electrode by a predetermined distance. The support substrate is a silicon/glass composite substrate on which the pressure sensor is mounted such that the support substrate and the diaphragm face each other. The resin layer fixes the pressure sensor and the support substrate together. The pressure sensor is mounted on a mounting area of the support substrate with a joint member therebetween. Accordingly, even if a gap between the support substrate and the diaphragm has a size of about several micrometers, the pressure-sensor package is capable of performing pressure detection with high sensitivity.

摘要翻译： 压力传感器封装主要包括压力传感器，支撑基板和树脂层。 压力传感器包括具有固定电极的玻璃基板和具有与固定电极隔开预定距离的隔膜的硅基板。 支撑基板是硅/玻璃复合基板，其上安装有压力传感器，使得支撑基板和隔膜彼此面对。 树脂层将压力传感器和支撑基板固定在一起。 压力传感器安装在支撑基板的安装区域上，其间具有接头部件。 因此，即使支撑基板和隔膜之间的间隙具有约几微米的尺寸，压力传感器封装能够以高灵敏度执行压力检测。

公开(公告)号：US20080078251A1

公开(公告)日：2008-04-03

申请号：US11865479

申请日：2007-10-01

申请人： Tetsuya Fukuda ,  Katsuya Kikuiri ,  Kiyoshi Sato ,  Mitsuru Watanabe ,  Yoshinobu Nakamura

发明人： Tetsuya Fukuda ,  Katsuya Kikuiri ,  Kiyoshi Sato ,  Mitsuru Watanabe ,  Yoshinobu Nakamura

IPC分类号： G01L7/00

CPC分类号： G01L19/0069 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several μms.

摘要翻译： 封装主要由具有用于存储压力传感器的存储区域的存储区域，存储在封装体的存储区域中的容量型压力传感器，密封保存有压力传感器的封装体的封装体，粘合剂 用于将压力传感器固定到封装主体的代理，以及用于将压力传感器的焊盘电耦接到封装体的导电部分的接合线。 包装体和压力传感器的粘合区域设置在除了压力传感器的隔膜的投影区域之外的区域在安装底面上。 这使得可以提供能够以高灵敏度检测压力的压力传感器的封装，尽管基板和隔膜之间的间隙具有几个数量级的值。

公开(公告)号：US20050023433A1

公开(公告)日：2005-02-03

申请号：US10900792

申请日：2004-07-28

申请人： Yoshihiko Ishitaka ,  Hidenori Chiba ,  Takayuki Chida ,  Tetsuya Fukuda

发明人： Yoshihiko Ishitaka ,  Hidenori Chiba ,  Takayuki Chida ,  Tetsuya Fukuda

IPC分类号： B29C33/56 ,  B29C33/60 ,  B29C45/37 ,  B29D11/00 ,  F21V8/00 ,  G02B6/00

CPC分类号： G02B6/0036 ,  B29C33/565 ,  B29C33/60 ,  B29C45/37 ,  B29C45/372 ,  B29D11/00278 ,  B29K2707/045 ,  B29K2907/02 ,  B29K2907/04 ,  B29L2011/00 ,  G02B6/0038 ,  G02B6/0053 ,  G02B6/0065

摘要： The resin optical component mold includes a first mold and a second mold for defining a cavity for molding a resin optical component having a minutely concavo-convex shaped surface, on which a plurality of minute concave or convex portions in units of submicrons is formed, by injection molding light transmitting resin. A master mold 36 formed of an inorganic oxide layer having a minutely concavo-convex shaped surface 36a, on which a concavo-convex shape complementary to the concavo-convex shape formed on the minutely concavo-convex shaped surface of the resin optical component is formed, is provided on the internal surface of the first mold.

摘要翻译： 树脂光学部件模具包括第一模具和第二模具，用于限定用于模制具有微小凹凸表面的树脂光学部件的空腔，在其上形成有以亚微米为单位的多个微小凹凸部分，其上形成有亚微米单位的多个微小凹凸部分 注塑成型透光树脂。 由具有微小凹凸面36a的无机氧化物层形成的母模36形成与形成在树脂光学部件的微小凹凸面上的凹凸形状互补的凹凸形状 设置在第一模具的内表面上。

公开(公告)号：US06570107B1

公开(公告)日：2003-05-27

申请号：US09676751

申请日：2000-10-02

申请人： Takumi Nishimoto ,  Koji Ono ,  Jun Sato ,  Tetsuya Fukuda

发明人： Takumi Nishimoto ,  Koji Ono ,  Jun Sato ,  Tetsuya Fukuda

IPC分类号： H01H1900

CPC分类号： H01H25/06 ,  H01H25/008 ,  H01H25/04

摘要： A multiple operation switch that provides electric signal in accordance with the angle of tilting an operating rod protruding from the front panel of an electronic apparatus. The switch comprises a lower case provided at the recessed bottom with a lower switching portion formed of a movable contact and a first fixed contact point. A movable contact body is provided with a conductive flange that makes contact, when tilted by the operating rod, in part with at least two of the second fixed contact points disposed on the reverse surface of upper case. Which movable contact body is supported at the conductive flange by a holding member pushed upward by a coil spring provided in the lower case so that it is engaged in a tiltable manner with an upper case. The second fixed contact points and the conductive flange constitute an upper switching portion.

摘要翻译： 多重操作开关，其根据从电子设备的前面板突出的操作杆的倾斜角度提供电信号。 开关包括设置在凹陷底部的下壳体，其具有由可动触头和第一固定触点形成的下开关部分。 可动接触体设置有导电凸缘，该导电凸缘当被操作杆倾斜时部分地与设置在上壳体的背面上的至少两个第二固定接点相接触。 通过设置在下壳体中的螺旋弹簧向上推动的保持构件，可动接触体被支撑在导电凸缘处，使得其与上壳体可倾斜地接合。 第二固定触点和导电凸缘构成上开关部。

公开(公告)号：US5571001A

公开(公告)日：1996-11-05

申请号：US568223

申请日：1995-12-06

申请人： Tetsuya Fukuda ,  Yoshiaki Yamada

发明人： Tetsuya Fukuda ,  Yoshiaki Yamada

IPC分类号： B63J99/00 ,  F04D7/02 ,  F04D13/06 ,  F04D13/08 ,  F04D29/58 ,  F04B17/00

CPC分类号： F04D13/06 ,  F04D13/086 ,  F04D29/588

摘要： A pressure-resistant explosion-proof electric motor (44) is surrounded by a double casing comprised of inner and outer cases with a motor-cooling oil passage (54) formed therebetween. A flange (26) is detachably fitted to the top surface of a tank to hold the electric motor (44) in the tank. A downwardly-extending pipe (28) is at an upper end fixed to the flange and at a lower end connected through a terminal box (30) to the electric motor (44). A centrifugal pump (67) is fixed to the underside of the electric motor (44) to have its rotary shaft connected to the output shaft (60) of the electric motor (44). A motor cover accommodates therein the electric motor and the terminal box (30) in a watertight manner. A protective pipe (71) extends from the flange (26) to the motor cover (69) and accommodates therein the downwardly-extending pipe (28) in a watertight manner. A cooling oil is circulated through the motor-cooling oil passage (54) to cool the electric motor. This water-immersed cargo handling pump is suitable for transferring the liquid in a tank of a vessel.

摘要翻译： 耐压防爆电动机（44）由包括内壳和外壳的双壳体围绕，其间形成有电动冷却油通道（54）。 凸缘（26）可拆卸地装配到罐的顶面以将电动机（44）保持在箱中。 向下延伸的管道（28）位于固定到凸缘的上端，并且在通过接线盒（30）连接到电动机（44）的下端处。 离心泵（67）固定在电动机（44）的下侧，使其旋转轴与电动机（44）的输出轴（60）连接。 电动机盖以水密的方式容纳电动机和接线盒（30）。 保护管（71）从凸缘（26）延伸到电动机盖（69）并且以水密的方式容纳向下延伸的管道（28）。 冷却油循环通过电动机冷却油通道（54）以冷却电动机。 这种水浸式货物处理泵适用于将容器中的液体转移到容器中。

公开(公告)号：USD563329S1

公开(公告)日：2008-03-04

申请号：US29245326

申请日：2005-12-21

申请人： Yoshiro Sano ,  Hideki Mitsuoka ,  Tetsuya Fukuda

设计人： Yoshiro Sano ,  Hideki Mitsuoka ,  Tetsuya Fukuda

公开(公告)号：USD563328S1

公开(公告)日：2008-03-04

申请号：US29245243

申请日：2005-12-21

申请人： Yoshiro Sano ,  Tetsuya Fukuda

设计人： Yoshiro Sano ,  Tetsuya Fukuda

公开(公告)号：US20080028856A1

公开(公告)日：2008-02-07

申请号：US11679638

申请日：2007-02-27

申请人： Katsuya Kikuiri ,  Kiyoshi Sato ,  Tetsuya Fukuda

发明人： Katsuya Kikuiri ,  Kiyoshi Sato ,  Tetsuya Fukuda

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  G01P15/0802 ,  G01P15/18

摘要： Provided is a capacitive acceleration sensor including a silicon substrate, which includes a movable electrode having a comb shape and a fixed electrode having a comb shape opposed to the comb shape of the movable electrode, and a pair of glass substrates having a concave portion forming a cavity on at least one side thereof, wherein the silicon substrate and the glass substrates are bonded to each other so that the movable electrode and the fixed electrode is disposed in the cavity. Accordingly, it is possible to provide the capacitive acceleration sensor having a small size and high sensitivity.

摘要翻译： 提供一种电容式加速度传感器，其包括硅基板，其包括具有梳状的可动电极和具有与可动电极的梳形形状相对的梳形形状的固定电极，以及一对玻璃基板，具有形成 其中硅基板和玻璃基板彼此接合，使得可动电极和固定电极设置在空腔中。 因此，可以提供具有小尺寸和高灵敏度的电容加速度传感器。

公开(公告)号：US20070205474A1

公开(公告)日：2007-09-06

申请号：US11680970

申请日：2007-03-01

申请人： Tetsuya Fukuda ,  Katsuya Kikuiri ,  Yoshinobu Nakamura ,  Shigeaki Yamauchi

发明人： Tetsuya Fukuda ,  Katsuya Kikuiri ,  Yoshinobu Nakamura ,  Shigeaki Yamauchi

IPC分类号： H01L29/82

CPC分类号： G01L9/0073 ,  G01L9/0075

摘要： A pressure sensor includes a gold-silicon eutectic crystal layer interposed between the contact layer and the silicon substrate. Because the contact layer and the silicon substrate are electrically connected to each other by using a gold-silicon eutectic reaction at the time of bonding the silicon substrate and the glass substrate, a contact resistance between the contact layer and the silicon substrate can be stabilized, and a Q value of the sensor can be stabilized. In addition, since the contact layer and the silicon substrate are bonded to each other by the gold-silicon eutectic reaction, the bonding strength is sufficient.

摘要翻译： 压力传感器包括介于接触层和硅衬底之间的金 - 硅共晶晶体层。 由于接触层和硅衬底在接合硅衬底和玻璃衬底时通过使用金 - 硅共晶反应彼此电连接，所以可以使接触层和硅衬底之间的接触电阻稳定， 并且传感器的Q值可以稳定。 此外，由于接触层和硅衬底通过金 - 硅共晶反应彼此接合，所以接合强度是足够的。