SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
    SOI衬底及其制造方法

    公开(公告)号:US20100006940A1

    公开(公告)日:2010-01-14

    申请号:US12497720

    申请日:2009-07-06

    摘要: An object is to provide an SOI substrate provided with a semiconductor layer which can be used practically even when a glass substrate is used as a base substrate. Another object is to provide a semiconductor device having high reliability using such an SOI substrate. An altered layer is formed on at least one surface of a glass substrate used as a base substrate of an SOI substrate to form the SOI substrate. The altered layer is formed on at least the one surface of the glass substrate by cleaning the glass substrate with solution including hydrochloric acid, sulfuric acid or nitric acid. The altered layer has a higher proportion of silicon oxide in its composition and a lower density than the glass substrate.

    摘要翻译: 本发明的目的是提供一种具有半导体层的SOI衬底,即使在使用玻璃衬底作为基底衬底时也可以实际使用。 另一个目的是提供一种使用这种SOI衬底具有高可靠性的半导体器件。 在用作SOI衬底的基底衬底的玻璃衬底的至少一个表面上形成改变的层,以形成SOI衬底。 通过用包括盐酸,硫酸或硝酸的溶液清洗玻璃基板,在玻璃基板的至少一个表面上形成改变的层。 改变的层在其组成中具有较高比例的氧化硅,并且具有比玻璃基底更低的密度。

    SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF 有权
    SOI衬底及其制造方法

    公开(公告)号:US20110316082A1

    公开(公告)日:2011-12-29

    申请号:US13230086

    申请日:2011-09-12

    IPC分类号: H01L29/786 H01L29/02

    摘要: An object is to provide an SOI substrate provided with a semiconductor layer which can be used practically even when a glass substrate is used as a base substrate. Another object is to provide a semiconductor device having high reliability using such an SOI substrate. An altered layer is formed on at least one surface of a glass substrate used as a base substrate of an SOI substrate to form the SOI substrate. The altered layer is formed on at least the one surface of the glass substrate by cleaning the glass substrate with solution including hydrochloric acid, sulfuric acid or nitric acid. The altered layer has a higher proportion of silicon oxide in its composition and a lower density than the glass substrate.

    摘要翻译: 本发明的目的是提供一种具有半导体层的SOI衬底,即使在使用玻璃衬底作为基底衬底时也可以实际使用。 另一个目的是提供一种使用这种SOI衬底具有高可靠性的半导体器件。 在用作SOI衬底的基底衬底的玻璃衬底的至少一个表面上形成改变的层,以形成SOI衬底。 通过用包括盐酸,硫酸或硝酸的溶液清洗玻璃基板,在玻璃基板的至少一个表面上形成改变的层。 改变的层在其组成中具有较高比例的氧化硅,并且具有比玻璃基底更低的密度。

    METHOD FOR MANUFACTURING SOI SUBSTRATE AND SEMICONDUCTOR DEVICE
    4.
    发明申请
    METHOD FOR MANUFACTURING SOI SUBSTRATE AND SEMICONDUCTOR DEVICE 有权
    制造SOI衬底和半导体器件的方法

    公开(公告)号:US20090137101A1

    公开(公告)日:2009-05-28

    申请号:US12247470

    申请日:2008-10-08

    IPC分类号: H01L21/71

    摘要: To provide a method for manufacturing an SOI substrate provided with a semiconductor layer which can be used practically even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like is used. The semiconductor layer is transferred to a supporting substrate by the steps of irradiating a semiconductor wafer with ions from one surface to form a damaged layer; forming an insulating layer over one surface of the semiconductor wafer; attaching one surface of the supporting substrate to the insulating layer formed over the semiconductor wafer and performing heat treatment to bond the supporting substrate to the semiconductor wafer; and performing separation at the damaged layer into the semiconductor wafer and the supporting substrate. The damaged layer remaining partially over the semiconductor layer is removed by wet etching and a surface of the semiconductor layer is irradiated with a laser beam.

    摘要翻译: 为了提供一种制造具有半导体层的SOI衬底的方法,即使使用诸如玻璃衬底等的耐热温度低的衬底也可以实际使用。 通过以下步骤将半导体层转移到支撑衬底:从一个表面照射半导体晶片以形成损伤层; 在所述半导体晶片的一个表面上形成绝缘层; 将所述支撑基板的一个表面附接到形成在所述半导体晶片上的绝缘层,并进行热处理以将所述支撑基板接合到所述半导体晶片; 并且在所述损伤层处进行到所述半导体晶片和所述支撑基板的分离。 通过湿蚀刻除去半导体层上部分残留的损伤层,并用激光束照射半导体层的表面。

    LASER IRRADIATION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
    5.
    发明申请
    LASER IRRADIATION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME 有权
    使用其制造半导体器件的激光辐射方法和方法

    公开(公告)号:US20100304506A1

    公开(公告)日:2010-12-02

    申请号:US12850292

    申请日:2010-08-04

    摘要: The present invention is to provide a laser irradiation method for performing homogeneous laser irradiation to the irradiation object even when the thickness of the irradiation object is not even. In the case of irradiating the irradiation object having uneven thickness, the laser irradiation is performed while keeping the distance between the irradiation object and the lens for condensing the laser beam on the surface of the irradiation object constant by using an autofocusing mechanism. In particular, when the irradiation object is irradiated with the laser beam by moving the irradiation object relative to the laser beam in the first direction and the second direction of the beam spot formed on the irradiation surface, the distance between the irradiation object and the lens is controlled by the autofocusing mechanism before the irradiation object is moved in the first and second directions.

    摘要翻译: 本发明提供一种激光照射方法,即使在照射物体的厚度不均匀的情况下也能够对照射物进行均匀的激光照射。 在照射具有不均匀厚度的照射物体的情况下,通过使用自动聚焦机构,在照射物体和透镜之间的距离保持在照射物体的表面上恒定的同时,进行激光照射。 特别地,当通过在照射表面上形成的第一方向和束点的第二方向上相对于激光束照射被照射物体照射激光束时,照射物体与透镜之间的距离 在照射对象沿第一和第二方向移动之前由自动对焦机构控制。

    LASER IRRADIATION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
    6.
    发明申请
    LASER IRRADIATION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME 有权
    使用其制造半导体器件的激光辐射方法和方法

    公开(公告)号:US20090250590A1

    公开(公告)日:2009-10-08

    申请号:US12480984

    申请日:2009-06-09

    IPC分类号: G02B27/40 H01L21/268

    摘要: The present invention is to provide a laser irradiation method for performing homogeneous laser irradiation to the irradiation object even when the thickness of the irradiation object is not even. In the case of irradiating the irradiation object having uneven thickness, the laser irradiation is performed while keeping the distance between the irradiation object and the lens for condensing the laser beam on the surface of the irradiation object constant by using an autofocusing mechanism. In particular, when the irradiation object is irradiated with the laser beam by moving the irradiation object relative to the laser beam in the first direction and the second direction of the beam spot formed on the irradiation surface, the distance between the irradiation object and the lens is controlled by the autofocusing mechanism before the irradiation object is moved in the first and second directions.

    摘要翻译: 本发明提供一种激光照射方法,即使在照射物体的厚度不均匀的情况下也能够对照射物进行均匀的激光照射。 在照射具有不均匀厚度的照射物体的情况下,通过使用自动聚焦机构,在照射物体和透镜之间的距离保持在照射物体的表面上恒定的同时,进行激光照射。 特别地,当通过在照射表面上形成的第一方向和束点的第二方向上相对于激光束照射被照射物体照射激光束时,照射物体与透镜之间的距离 在照射对象沿第一和第二方向移动之前由自动对焦机构控制。

    LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE
    8.
    发明申请
    LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE 审中-公开
    发光元件,发光装置和电子装置

    公开(公告)号:US20070205416A1

    公开(公告)日:2007-09-06

    申请号:US11679397

    申请日:2007-02-27

    IPC分类号: H01L33/00

    摘要: A light emitting element that can be driven at a low voltage is provided. Further, a light emitting device and an electronic device with reduced power consumption are provided. A light emitting element is provided that includes a substrate 100, and a first electrode 101, a first insulating layer 102, a light emitting layer 103, a second insulating layer 104, and a second electrode 105, which are over the substrate 100. The light emitting layer 103 includes a compound ABC2, referred to as a ‘chalcopyrite’ (wherein A is Cu or Ag, B is Al, Ga, or In, and C is S, Se, or Te). By employing such a structure, a light emitting element that can be driven at a low voltage can be provided.

    摘要翻译: 提供可以以低电压驱动的发光元件。 此外,提供了具有降低的功耗的发光装置和电子装置。 提供了一种发光元件,其包括基板100,以及位于基板100上方的第一电极101,第一绝缘层102,发光层103,第二绝缘层104和第二电极105。 发光层103包括称为“黄铜矿”(其中A为Cu或Ag,B为Al,Ga或In,C为S,Se或Te的化合物ABC 2 )。 通过采用这种结构,可以提供能够以低电压驱动的发光元件。

    LIGHT EMITTING MATERIAL, LIGHT EMITTING DEVICE, AND ELECTRONIC DEVICE
    9.
    发明申请
    LIGHT EMITTING MATERIAL, LIGHT EMITTING DEVICE, AND ELECTRONIC DEVICE 失效
    发光材料,发光装置和电子装置

    公开(公告)号:US20070176536A1

    公开(公告)日:2007-08-02

    申请号:US11625114

    申请日:2007-01-19

    IPC分类号: H01J1/62

    摘要: An object is to provide a novel light emitting material. Another object is to provide a light emitting device and an electronic device with reduced power consumption. Still another object is to provide a light emitting device and an electronic device which can be manufactured at low cost. Provided is a light emitting element including a base material, a first impurity element, a second impurity element, and a third impurity element. The base material is one of ZnS, CdS, CaS, Y2S3, Ga2S3, SrS, BaS, ZnO, Y2O3, AlN, GaN, InN, ZnSe, ZnTe, and SrGa2S4; the first impurity element is any of Cu, Ag, Au, Pt, and Si; the second impurity element is any of F, Cl, Br, I, B, Al, Ga, In, and Tl; and the third impurity element is any of Li, Na, K, Rb, Cs, N, P, As, Sb, and Bi.

    摘要翻译: 目的是提供一种新颖的发光材料。 另一个目的是提供一种降低功耗的发光器件和电子器件。 另一个目的是提供一种可以以低成本制造的发光器件和电子器件。 提供了包括基材,第一杂质元素,第二杂质元素和第三杂质元素的发光元件。 基材是ZnS,CdS,CaS,Y 2 S 3,Ga 2 S 3, SrS,BaS,ZnO,Y 2 O 3,AlN,GaN,InN,ZnSe,ZnTe和SrGa 2 S 4 第一杂质元素是Cu,Ag,Au,Pt和Si中的任一种; 第二杂质元素是F,Cl,Br,I,B,Al,Ga,In和Tl中的任一种; 并且第三杂质元素是Li,Na,K,Rb,Cs,N,P,As,Sb和Bi中的任一种。

    METHOD FOR MANUFACTURING LIGHT-EMITTING MATERIAL
    10.
    发明申请
    METHOD FOR MANUFACTURING LIGHT-EMITTING MATERIAL 审中-公开
    制造发光材料的方法

    公开(公告)号:US20080157032A1

    公开(公告)日:2008-07-03

    申请号:US11873041

    申请日:2007-10-16

    IPC分类号: C09K11/64

    CPC分类号: C09K11/641

    摘要: There has been a problem in that kinds of conventional light-emitting materials are not sufficient; therefore, choices of materials and manufacturers of light emitting materials are limited, resulting in an expensive light-emitting device. The present invention provides a novel method for manufacturing a light-emitting material suitable for mass production that can be manufactured at a low cost, and a novel light-emitting material which can provide light emission with high intensity. A mixture in which CuAlS2 is added in a small amount into ZnS as a base material is put in a reaction container. Then, the reaction container is hermetically sealed and the mixture is baked. Note that the reaction container is preferably hermetically sealed in a state where a reduced pressure is held in the reaction container. Further, in a light-emitting element using a light-emitting material obtained, electroluminescence with high luminance can be obtained.

    摘要翻译: 存在这种常规发光材料种类不足的问题。 因此,发光材料的材料和制造商的选择受到限制,导致昂贵的发光装置。 本发明提供了可以低成本制造适合于批量生产的发光材料的新型制造方法,以及能够提供高强度发光的新颖的发光材料。 将CuAlS 2 O 3少量添加到作为基材的ZnS中的混合物放入反应容器中。 然后,将反应容器密封并将混合物烘烤。 注意,反应容器优选在反应容器中保持减压的状态下气密密封。 此外,在使用得到的发光材料的发光元件中,可以获得高亮度的电致发光。