公开(公告)号：US06739326B2

公开(公告)日：2004-05-25

申请号：US09986798

申请日：2001-11-13

申请人： Tetsuya Kurosawa ,  Hideo Numata ,  Keisuke Tokubuchi

发明人： Tetsuya Kurosawa ,  Hideo Numata ,  Keisuke Tokubuchi

IPC分类号： B28D704

CPC分类号： H01L21/67092 ,  B28D5/0094 ,  H01L21/6838 ,  H01L21/78 ,  Y10T279/11 ,  Y10T279/1249

摘要： By preventing warping of chips when detaching individual chips from a dicing sheet, improvement in quality without cracks and in productivity is realized. A collet (115) used in a step of detaching chips (110) discretely divided as bonded to a dicing sheet (109) from the dicing sheet has a flat attraction surface made of a porous material of a size equal to or larger than the chip size. Alternatively, the collet may have a chip attraction groove containing poles, balls or hemispheres, for example, to prevent warping of chips. In the step of detaching each chip from the dicing sheet, a means for reducing the bonding force of the dicing sheet, such as heating device or cooling device, may be provided. Thus, warping or cracking can be prevented in a process of thinned semiconductor substrate. Additionally, since the means for reducing the bonding force of the dicing sheet is provided in a semiconductor manufacturing equipment, breakage or cracking of chips can be prevented more reliably.

摘要翻译： 通过防止从切割片上分离各个芯片时芯片的翘曲，可以实现质量的提高，无裂纹和生产率。 在从切割片离散分离的切片（110）分离的步骤中使用的夹头（115）具有由等于或大于芯片的尺寸的多孔材料制成的平坦的吸引表面 尺寸。 或者，夹头可以具有例如包含杆，球或半球的芯片吸引槽，以防止芯片翘曲。 在从切割片分离每个芯片的步骤中，可以提供用于降低切割片（例如加热装置或冷却装置）的结合力的装置。 因此，在减薄的半导体衬底的工艺中可以防止翘曲或破裂。 此外，由于在半导体制造装置中设置了用于降低切割片的接合力的装置，因此可以更可靠地防止切屑的断裂或破裂。

公开(公告)号：US06352073B1

公开(公告)日：2002-03-05

申请号：US09404595

申请日：1999-09-24

申请人： Tetsuya Kurosawa ,  Hideo Numata ,  Keisuke Tokubuchi

发明人： Tetsuya Kurosawa ,  Hideo Numata ,  Keisuke Tokubuchi

IPC分类号： B28D704

CPC分类号： H01L21/67092 ,  B28D5/0094 ,  H01L21/6838 ,  H01L21/78 ,  Y10T279/11 ,  Y10T279/1249

摘要： By preventing warping of chips when detaching individual chips from a dicing sheet, improvement in quality without cracks and in productivity is realized. A collet (115) used in a step of detaching chips (110) discretely divided as bonded to a dicing sheet (109) from the dicing sheet has a flat attraction surface made of a porous material of a size equal to or larger than the chip size. Alternatively, the collet may have a chip attraction groove containing poles, balls or hemispheres, for example, to prevent warping of chips. In the step of detaching each chip from the dicing sheet, a means for reducing the bonding force of the dicing sheet, such as heating device or cooling device, may be provided. Thus, warping or cracking can be prevented in a process of thinned semiconductor substrate. Additionally, since the means for reducing the bonding force of the dicing sheet is provided in a semiconductor manufacturing equipment, breakage or cracking of chips can be prevented more reliably.

摘要翻译： 通过防止从切割片上分离各个芯片时芯片的翘曲，可以实现质量的提高，无裂纹和生产率。 在从切割片离散分离的切片（110）分离的步骤中使用的夹头（115）具有由等于或大于芯片的尺寸的多孔材料制成的平坦的吸引表面 尺寸。 或者，夹头可以具有例如包含杆，球或半球的芯片吸引槽，以防止芯片翘曲。 在从切割片分离每个芯片的步骤中，可以提供用于降低切割片（例如加热装置或冷却装置）的结合力的装置。 因此，在减薄的半导体衬底的工艺中可以防止翘曲或破裂。 此外，由于在半导体制造装置中设置了用于降低切割片的接合力的装置，因此可以更可靠地防止切屑的断裂或破裂。

公开(公告)号：US06238515B1

公开(公告)日：2001-05-29

申请号：US09376996

申请日：1999-08-18

申请人： Masaki Tsujimoto ,  Kenji Kobayashi ,  Hideo Numata ,  Keisuke Tokubuchi

发明人： Masaki Tsujimoto ,  Kenji Kobayashi ,  Hideo Numata ,  Keisuke Tokubuchi

IPC分类号： H01L2178

CPC分类号： H01L21/67132 ,  H01L21/68 ,  H01L2221/6839 ,  Y10S414/137 ,  Y10S414/141 ,  Y10T156/1705 ,  Y10T156/1983

摘要： A wafer transfer apparatus for sticking a wafer, which is divided into a multiplicity of chips and which has its surface stuck with a protective tape, to a ring frame by a transfer tape, includes: a positioning unit capable of disposing the protective tape stuck wafer on a positioning table and capable of performing a position adjustment of the wafer in longitudinal, lateral and rotational directions, so that the wafer is located in a reference position; a transfer tape mount unit capable of disposing the protective tape stuck wafer, which has been located in the reference position by the positioning unit, on a transfer tape mount table, and capable of sticking a transfer tape to both a ring frame disposed round periphery of the wafer and back of the wafer, so that the wafer and the ring frame are stuck to each other and integrated; and a protective tape peeling unit capable of disposing the wafer, which has its back covered with the transfer tape and which has been integrated with the ring frame by the transfer tape mount unit, on a protective tape peeling table, and capable of bonding an end of a peeling tape to an end of the protective tape stuck to the wafer surface, and capable of pulling the peeling tape so that the protective tape is peeled from the wafer surface.

摘要翻译： 将通过转印带将被分割为多个芯片并且其表面粘贴有保护带的晶片的晶片传送装置包括：能够将保护带粘贴的晶片 并且能够在纵向，横向和旋转方向上执行晶片的位置调整，使得晶片位于参考位置; 一种转印带安装单元，其能够将位于参考位置的定位单元的保护带粘贴的晶片放置在转印带安装台上，并且能够将转印带粘附到设置在圆周周围的环形框架 晶片和晶片的背面，使得晶片和环形框架彼此粘合并集成; 以及保护带剥离单元，其能够将其后面被转印带覆盖并且通过转印带安装单元与环形框架一体化的晶片设置在保护带剥离台上，并且能够将端部 剥离胶带粘附到保护胶带的端部，粘贴在晶片表面上，并且能够拉动剥离带使得保护带从晶片表面剥离。

公开(公告)号：US06774011B2

公开(公告)日：2004-08-10

申请号：US09920628

申请日：2001-08-03

申请人： Takahito Nakazawa ,  Tetsuya Kurosawa ,  Hideo Numata ,  Shinya Takyu

发明人： Takahito Nakazawa ,  Tetsuya Kurosawa ,  Hideo Numata ,  Shinya Takyu

IPC分类号： H01L2146

CPC分类号： H01L21/67276 ,  H01L21/67132 ,  H01L2221/68318

摘要： A pickup device comprises a thrusting mechanism, a carrying mechanism and a controller. The thrusting mechanism is configured to thrust the chips sequentially by using pins from a back side of the adhesive tape with the adhesive tape between the chips and the pins so as to peel the chips off the adhesive tape. The carrying mechanism is configured to sequentially absorb the chips with use of a collet, hold the chips to be absorbed until the chips are peeled off the adhesive tape, thereafter pick the chips up by ascending the collet in order to be carried the chips to a subsequent process stage. The controller is configured to controlling the thrust of the chip by thrusting mechanism, the controller control an ascend time and a descend time of the pins, and keeping a predetermined period of a time when the pins arrive at their peak.

摘要翻译： 拾取装置包括推压机构，承载机构和控制器。 推力机构构造成通过使用来自胶带的背面的销从而将芯片顺序地推出，并且将芯片与销之间的粘合带剥离，从而将芯片从胶带剥离。 携带机构被配置为使用夹头顺序地吸收芯片，保持待吸收的芯片直到芯片从胶带剥离，然后通过升高夹头来拾取芯片，以将芯片运送到 后续流程阶段。 控制器被配置为通过推压机构控制芯片的推力，控制器控制销的上升时间和下降时间，并且当销到达其峰值时保持预定的一段时间。

公开(公告)号：US08338904B2

公开(公告)日：2012-12-25

申请号：US12883674

申请日：2010-09-16

申请人： Kazumasa Tanida ,  Chiaki Takubo ,  Hideo Numata ,  Yoshihisa Imori

发明人： Kazumasa Tanida ,  Chiaki Takubo ,  Hideo Numata ,  Yoshihisa Imori

IPC分类号： H01L31/05

CPC分类号： H01L27/14603 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14683

摘要： According to an embodiment, there is provided a semiconductor device including a semiconductor substrate having a first surface on which an active layer having a light receiving portion is provided and a second surface to be a light receiving surface for the light receiving portion, a wiring layer provided on the active layer, an insulating layer provided to cover the wiring layer, and a supporting substrate joined to the semiconductor substrate via the insulating layer to face the first surface of the semiconductor substrate. A joined body of the semiconductor substrate and the supporting substrate includes an intercalated portion provided between its outer peripheral surface and the active surface. The intercalated portion is provided to penetrate the semiconductor substrate and the insulating layer from the second surface of the semiconductor substrate and to reach inside the supporting substrate.

摘要翻译： 根据实施例，提供了一种半导体器件，其包括具有第一表面的半导体衬底，在该第一表面上设置有具有光接收部分的有源层和作为光接收部分的光接收表面的第二表面，布线层 设置在有源层上，设置为覆盖布线层的绝缘层，以及经由绝缘层与半导体基板接合以与半导体基板的第一表面相对的支撑基板。 半导体衬底和支撑衬底的接合体包括设置在其外周表面和活性表面之间的插入部分。 插入部分被设置为从半导体衬底的第二表面穿透半导体衬底和绝缘层并到达支撑衬底内部。

公开(公告)号：US20120190138A1

公开(公告)日：2012-07-26

申请号：US13354734

申请日：2012-01-20

申请人： Kazumasa TANIDA ,  Satoshi Hongo ,  Naoko Yamaguchi ,  Kenji Takahashi ,  Hideo Numata

发明人： Kazumasa TANIDA ,  Satoshi Hongo ,  Naoko Yamaguchi ,  Kenji Takahashi ,  Hideo Numata

IPC分类号： H01L21/66 ,  B32B37/30 ,  B32B41/00

CPC分类号： H01L21/681 ,  H01L21/67092 ,  H01L21/6838 ,  H01L27/1464

摘要： According to one embodiment, semiconductor manufacturing apparatus includes a first member that holds a first semiconductor substrate; a second member that holds a second semiconductor substrate in a state where a bonding surface of the second semiconductor substrate faces a bonding surface of the first semiconductor substrate; a distance detecting unit that detects a distance between the bonding surface of the first semiconductor substrate and the bonding surface of the second semiconductor substrate; an adjusting unit that adjusts the distance between the bonding surface of the first semiconductor substrate and the bonding surface of the second semiconductor substrate to a predetermined value by moving at least one of the first and second members based on a detection result of the distance detecting unit; and a third member that forms the bonding start point between the first semiconductor substrate and the second semiconductor substrate.

摘要翻译： 根据一个实施例，半导体制造装置包括保持第一半导体衬底的第一构件; 第二构件，其在第二半导体衬底的接合表面面对第一半导体衬底的接合表面的状态下保持第二半导体衬底; 距离检测单元，其检测第一半导体衬底的接合表面和第二半导体衬底的接合表面之间的距离; 调整单元，其基于所述距离检测单元的检测结果，通过移动所述第一和第二构件中的至少一个来调整所述第一半导体衬底的接合表面与所述第二半导体衬底的接合表面之间的距离为预定值 ; 以及在第一半导体衬底和第二半导体衬底之间形成接合起始点的第三构件。

公开(公告)号：US20110304003A1

公开(公告)日：2011-12-15

申请号：US13152057

申请日：2011-06-02

申请人： Kazumasa Tanida ,  Naoko Yamaguchi ,  Satoshi Hongo ,  Hideo Numata

发明人： Kazumasa Tanida ,  Naoko Yamaguchi ,  Satoshi Hongo ,  Hideo Numata

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L27/1464 ,  H01L27/14618 ,  H01L27/14687 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2924/00014

摘要： According to the embodiments, a semiconductor substrate, an active layer that is formed on one surface of the semiconductor substrate, a wiring layer that is formed on the active layer and includes a wire to be a convex portion on a surface that is not in contact with the active layer, a insulation layer that is formed on the wiring layer to have a concave portion, an embedded layer that is provided on the concave portion of the insulation layer, a bonding layer that is provided on the insulation layer and the embedded layer, and a substrate that is bonded to the bonding layer to face one surface of the semiconductor substrate are included.

摘要翻译： 根据实施例，半导体衬底，形成在半导体衬底的一个表面上的有源层，形成在有源层上并且在不接触的表面上包括作为凸部的线的布线层 在所述有源层上形成有在所述布线层上具有凹部的绝缘层，设置在所述绝缘层的凹部的嵌入层，设置在所述绝缘层和所述嵌入层上的接合层 并且包括结合到接合层以面向半导体衬底的一个表面的衬底。

公开(公告)号：US20110073974A1

公开(公告)日：2011-03-31

申请号：US12880838

申请日：2010-09-13

申请人： Eiji Takano ,  Hideo Numata ,  Kazumasa Tanida

发明人： Eiji Takano ,  Hideo Numata ,  Kazumasa Tanida

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L21/78 ,  H01L27/14683 ,  H01L2224/13

摘要： In one embodiment, a method for manufacturing a semiconductor device includes following steps. An aperture is formed in an interlayer insulating film formed on a semiconductor wafer apart from an integrated circuit portion by etching process. The interlayer insulating film has a dielectric constant smaller than a silicon oxide film (SiO2), and the width of the aperture is larger than a dicing region. A resin layer is embedded in the aperture. An adhesive layer is formed on the interlayer insulating film and the resin layer. The semiconductor wafer is attached to a glass substrate using the adhesive layer by Face Down method. The semiconductor wafer, the resin layer, and the adhesive layer on a dicing region are cut by blade dicing. The semiconductor wafer and the glass substrate adhered to the semiconductor wafer are cut into pieces by the blade dicing of the glass substrate under the dicing region.

摘要翻译： 在一个实施例中，制造半导体器件的方法包括以下步骤。 在通过蚀刻工艺与集成电路部分隔开的半导体晶片上形成的层间绝缘膜中形成开口。 层间绝缘膜的介电常数小于氧化硅膜（SiO 2），并且孔径的宽度大于切割区域。 树脂层嵌入孔中。 在层间绝缘膜和树脂层上形成粘接层。 半导体晶片通过Face Down方法使用粘合剂层附着到玻璃基板上。 通过刀片切割切割切割区域上的半导体晶片，树脂层和粘合剂层。 通过在切割区域下方的玻璃基板的切片将切割半导体晶片和粘附到半导体晶片的玻璃基板切割成片。

公开(公告)号：US07892682B2

公开(公告)日：2011-02-22

申请号：US12129136

申请日：2008-05-29

申请人： Akiji Ando ,  Hideo Numata ,  Yuji Matsumoto

发明人： Akiji Ando ,  Hideo Numata ,  Yuji Matsumoto

IPC分类号： H01M8/04

CPC分类号： H01M8/04089 ,  H01M8/04231 ,  H01M8/04619 ,  H01M8/04753 ,  H01M8/04776 ,  H01M2008/1095

摘要： A fuel cell system includes: a fuel cell for generating electricity using a chemical reaction between hydrogen and air supplied thereto; a diluter for diluting hydrogen discharged from the fuel cell with air discharged from the fuel cell; a request load air amount calculation unit for calculating an amount of air required for generating electricity in the fuel cell which meets request load; a dilution air amount calculation unit for calculating an amount of air to be supplied to the fuel cell that provides an amount of discharged gas required for diluting hydrogen in the diluter to a specific concentration; and an air supply control unit for supplying air to the fuel cell in an amount which is the larger amount selected from between the amount of air calculated in the request load air amount calculation unit and the amount of air calculated in the dilution air amount calculation unit.

摘要翻译： 一种燃料电池系统，包括：燃料电池，其利用氢气与供给的空气之间的化学反应发电; 用于从燃料电池排出的空气稀释从燃料电池排出的氢的稀释器; 请求负载空气量计算单元，用于计算满足请求负荷的燃料电池中发电所需的空气量; 稀释空气量计算单元，用于计算向所述燃料电池供应的空气量，所述空气量将所述稀释器中的氢稀释至特定浓度所需的排出气体量; 以及空气供给控制单元，其以从在请求负载空气量计算单元计算出的空气量与在稀释空气量计算单元中计算的空气量之间选择的较大量的量向燃料电池供给空气， 。

公开(公告)号：US20080299426A1

公开(公告)日：2008-12-04

申请号：US12129136

申请日：2008-05-29

申请人： Akiji ANDO ,  Hideo Numata ,  Yuji Matsumoto

发明人： Akiji ANDO ,  Hideo Numata ,  Yuji Matsumoto

IPC分类号： H01M8/04

CPC分类号： H01M8/04089 ,  H01M8/04231 ,  H01M8/04619 ,  H01M8/04753 ,  H01M8/04776 ,  H01M2008/1095

摘要： A fuel cell system includes: a fuel cell for generating electricity using a chemical reaction between hydrogen and air supplied thereto; a diluter for diluting hydrogen discharged from the fuel cell with air discharged from the fuel cell; a request load air amount calculation unit for calculating an amount of air required for generating electricity in the fuel cell which meets request load; a dilution air amount calculation unit for calculating an amount of air to be supplied to the fuel cell that provides an amount of discharged gas required for diluting hydrogen in the diluter to a specific concentration; and an air supply control unit for supplying air to the fuel cell in an amount which is the larger amount selected from between the amount of air calculated in the request load air amount calculation unit and the amount of air calculated in the dilution air amount calculation unit.

摘要翻译： 一种燃料电池系统，包括：燃料电池，其利用氢气与供给的空气之间的化学反应发电; 用于从燃料电池排出的空气稀释从燃料电池排出的氢的稀释器; 请求负载空气量计算单元，用于计算满足请求负荷的燃料电池中发电所需的空气量; 稀释空气量计算单元，用于计算向所述燃料电池供应的空气量，所述空气量将所述稀释器中的氢稀释至特定浓度所需的排出气体量; 以及空气供给控制单元，其以从在请求负载空气量计算单元计算出的空气量与在稀释空气量计算单元中计算的空气量之间选择的较大量的量向燃料电池供给空气， 。