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    Chip pickup device and method of manufacturing semiconductor device
    1.
    发明授权
    Chip pickup device and method of manufacturing semiconductor device 失效
    芯片拾取装置及半导体装置的制造方法

    公开(公告)号：US06774011B2

    公开(公告)日：2004-08-10

    申请号：US09920628

    申请日：2001-08-03

    申请人： Takahito Nakazawa ,  Tetsuya Kurosawa ,  Hideo Numata ,  Shinya Takyu

    发明人： Takahito Nakazawa ,  Tetsuya Kurosawa ,  Hideo Numata ,  Shinya Takyu

    IPC分类号： H01L2146

    CPC分类号： H01L21/67276 ,  H01L21/67132 ,  H01L2221/68318

    摘要： A pickup device comprises a thrusting mechanism, a carrying mechanism and a controller. The thrusting mechanism is configured to thrust the chips sequentially by using pins from a back side of the adhesive tape with the adhesive tape between the chips and the pins so as to peel the chips off the adhesive tape. The carrying mechanism is configured to sequentially absorb the chips with use of a collet, hold the chips to be absorbed until the chips are peeled off the adhesive tape, thereafter pick the chips up by ascending the collet in order to be carried the chips to a subsequent process stage. The controller is configured to controlling the thrust of the chip by thrusting mechanism, the controller control an ascend time and a descend time of the pins, and keeping a predetermined period of a time when the pins arrive at their peak.

    摘要翻译： 拾取装置包括推压机构，承载机构和控制器。 推力机构构造成通过使用来自胶带的背面的销从而将芯片顺序地推出，并且将芯片与销之间的粘合带剥离，从而将芯片从胶带剥离。 携带机构被配置为使用夹头顺序地吸收芯片，保持待吸收的芯片直到芯片从胶带剥离，然后通过升高夹头来拾取芯片，以将芯片运送到 后续流程阶段。 控制器被配置为通过推压机构控制芯片的推力，控制器控制销的上升时间和下降时间，并且当销到达其峰值时保持预定的一段时间。

    Method of manufacturing semiconductor devices
    3.
    发明授权
    Method of manufacturing semiconductor devices 失效
    制造半导体器件的方法

    公开(公告)号：US5677246A

    公开(公告)日：1997-10-14

    申请号：US575046

    申请日：1995-11-28

    申请人： Hideaki Maeta ,  Katsuhiko Oyama ,  Hiroshi Iwasaki ,  Yumiko Ohshima ,  Takahito Nakazawa

    发明人： Hideaki Maeta ,  Katsuhiko Oyama ,  Hiroshi Iwasaki ,  Yumiko Ohshima ,  Takahito Nakazawa

    IPC分类号： H01L21/56 ,  H01L21/60

    CPC分类号： H01L21/561 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/14

    摘要： In the disclosed method of manufacturing semiconductor devices with a single-sided resin-sealed package structure, when resin is filled into between the chip and the substrate, the occurrence of variations in the finishing dimensions of the package or defects in the outward appearance of the package is prevented. The disclosed manufacturing method comprises the step of using a guide plate for pouring resin and bringing one end of the guide plate into contact with one face end of a substrate or with a portion of one major surface near at least one side face of a chip in filling sealing resin between the chip and the substrate after the semiconductor chip has been mounted, with the face down, on one major surface of a wiring substrate having the wiring containing a connection section, the step of inclining the guide plate so that the guide plate may meet one major surface of the substrate at a specified angle, when or after one end of the guide plate is brought into contact with the substrate, and the step of supplying the resin to the opening between the chip and the substrate by supplying the resin onto the top surface of the guide plate and allowing the resin to flow over the top surface of the guide plate.

    摘要翻译： 在所公开的制造具有单侧树脂密封封装结构的半导体器件的方法中，当树脂填充到芯片和基板之间时，封装的精加工尺寸的变化或外观上的缺陷的发生 包装被阻止。 所公开的制造方法包括以下步骤：使用用于浇注树脂的引导板，并且使引导板的一端与基板的一个面端部或与芯片的至少一个侧面附近的一个主表面的一部分接触 在半导体芯片已经被安装在芯片和基板之后，在具有包括连接部分的布线的布线基板的一个主表面上，将芯片和基板之间填充密封树脂，使引导板倾斜的步骤 当引导板的一端与基板接触时或之后，可以以特定的角度与基板的一个主表面相遇，以及通过供给树脂将树脂供给到芯片和基板之间的开口的步骤 在引导板的顶表面上并允许树脂流过导向板的顶表面。

    Semiconductor device having a protection pattern with two element separation regions
    4.
    发明授权
    Semiconductor device having a protection pattern with two element separation regions 有权
    具有具有两个元件分离区域的保护图案的半导体器件

    公开(公告)号：US08241999B2

    公开(公告)日：2012-08-14

    申请号：US12706056

    申请日：2010-02-16

    申请人： Takafumi Ikeda ,  Takahito Nakazawa ,  Hideaki Maekawa ,  Yuuichi Tatsumi ,  Toshifumi Minami

    发明人： Takafumi Ikeda ,  Takahito Nakazawa ,  Hideaki Maekawa ,  Yuuichi Tatsumi ,  Toshifumi Minami

    IPC分类号： H01L23/544 ,  H01L21/301

    CPC分类号： H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region. The protective pattern comprises a first element separation region formed on the semiconductor substrate, a second element separation region formed on the semiconductor substrate and having a width smaller than that of the first element separation region, a first element region formed between the first element separation region and the second element separation region, a first gate layer formed on the first element separation region, a wiring layer formed on the first gate layer, a passivation layer formed above the wiring layer, a second element region, an insulation film formed on the second element region, and a second gate layer formed on the insulation film, the first element separation region, the first element region, the second element separation region and the second element region being located in this order from the nearer side of the circuit element region.

    摘要翻译： 半导体器件具有形成在半导体衬底上的电路元件区域和形成为围绕电路元件区域的保护图案。 保护图案包括形成在半导体衬底上的第一元件分离区域，形成在半导体衬底上的第二元件分离区域，其宽度小于第一元件分离区域的宽度;第一元素区域，形成在第一元素分离区域 和第二元件分离区域，形成在第一元件分离区域上的第一栅极层，形成在第一栅极层上的布线层，形成在布线层上方的钝化层，第二元素区域，形成在第二栅极层上的绝缘膜 元件区域和形成在绝缘膜上的第二栅极层，第一元件分离区域，第一元件区域，第二元件分离区域和第二元件区域从电路元件区域的更靠近的方向定位。

    SEMICONDUCTOR DEVICE
    5.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号：US20100237438A1

    公开(公告)日：2010-09-23

    申请号：US12706056

    申请日：2010-02-16

    申请人： Takafumi IKEDA ,  Takahito Nakazawa ,  Hideaki Maekawa ,  Yuuichi Tatsumi ,  Toshifumi Minami

    发明人： Takafumi IKEDA ,  Takahito Nakazawa ,  Hideaki Maekawa ,  Yuuichi Tatsumi ,  Toshifumi Minami

    IPC分类号： H01L29/06

    CPC分类号： H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device has a circuit element region formed on a semiconductor substrate, and a protective pattern formed so as to surround the circuit element region. The protective pattern comprises a first element separation region formed on the semiconductor substrate, a second element separation region formed on the semiconductor substrate and having a width smaller than that of the first element separation region, a first element region formed between the first element separation region and the second element separation region, a first gate layer formed on the first element separation region, a wiring layer formed on the first gate layer, a passivation layer formed above the wiring layer, a second element region, an insulation film formed on the second element region, and a second gate layer formed on the insulation film, the first element separation region, the first element region, the second element separation region and the second element region being located in this order from the nearer side of the circuit element region.

    摘要翻译： 半导体器件具有形成在半导体衬底上的电路元件区域和形成为围绕电路元件区域的保护图案。 保护图案包括形成在半导体衬底上的第一元件分离区域，形成在半导体衬底上的第二元件分离区域，其宽度小于第一元件分离区域的宽度;第一元素区域，形成在第一元素分离区域 和第二元件分离区域，形成在第一元件分离区域上的第一栅极层，形成在第一栅极层上的布线层，形成在布线层上方的钝化层，第二元素区域，形成在第二栅极层上的绝缘膜 元件区域和形成在绝缘膜上的第二栅极层，第一元件分离区域，第一元件区域，第二元件分离区域和第二元件区域从电路元件区域的更靠近的方向定位。

    Method for manufacturing a semiconductor package
    7.
    发明授权
    Method for manufacturing a semiconductor package 失效
    半导体封装的制造方法

    公开(公告)号：US06379484B2

    公开(公告)日：2002-04-30

    申请号：US09730193

    申请日：2000-12-05

    申请人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

    发明人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

    IPC分类号： H01L2128

    CPC分类号： H01L21/6715 ,  B05B1/14 ,  B05B13/04 ,  B05C5/001 ,  B05C5/0208 ,  B05C9/14 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T156/1798 ,  H01L2924/00

    摘要： An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. According to the present invention, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip so the resin spreads throughout the entire gap at substantially the same time as it flows along the peripheral portion of the chip. Thus, the formation of resin-less voids in the gap is deterred so that the grade and quality of the semiconductor device is improved.

    摘要翻译： 提供一种用于制造半导体封装的装置，其中半导体芯片和安装板之间的间隙填充有树脂。 该装置包括用于沿着半导体芯片的一侧供应树脂的树脂供给装置和用于控制由树脂供给装置供应的树脂量使得在半导体芯片的中心部分附近提供更多树脂的树脂供给控制装置， 靠近半导体芯片的端部。 还提供了一种方法，其包括以下步骤：连接半导体芯片和安装板，并且以半导体芯片的一侧向树脂提供树脂，使得在半导体芯片的中心部分附近提供更多的树脂， 半导体芯片的端部。 根据本发明，提供树脂，使得其在芯片的周边部分附近相对较少集中，使得树脂在沿着芯片的周边部分流动的基本同时在整个间隙中扩展。 因此，阻止了间隙中无树脂的空隙的形成，从而提高了半导体器件的等级和质量。

    Apparatus and method for manufacturing a semiconductor package
    8.
    发明授权
    Apparatus and method for manufacturing a semiconductor package 失效

    公开(公告)号：US06191024B1

    公开(公告)日：2001-02-20

    申请号：US09294955

    申请日：1999-04-20

    申请人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

    发明人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

    IPC分类号： H01L21288

    CPC分类号： H01L21/6715 ,  B05B1/14 ,  B05B13/04 ,  B05C5/001 ,  B05C5/0208 ,  B05C9/14 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  Y10T156/1798 ,  H01L2924/00

    摘要： An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. According to the present invention, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip so the resin spreads throughout the entire gap at substantially the same time as it flows along the peripheral portion of the chip. Thus, the formation of resin-less voids in the gap is deterred so that the grade and quality of the semiconductor device is improved.

    Flip-chip semiconductor package
    9.
    发明授权
    Flip-chip semiconductor package 失效
    倒装芯片半导体封装

    公开(公告)号：US06011312A

    公开(公告)日：2000-01-04

    申请号：US902430

    申请日：1997-07-29

    申请人： Takahito Nakazawa ,  Yumiko Ohshima

    发明人： Takahito Nakazawa ,  Yumiko Ohshima

    IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L23/04 ,  H01L23/52

    CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15151

    摘要： A semiconductor package is provided that includes a semiconductor chip that is mounted on a mount board with metal bumps interposed therebetween so as to create a gap. A structure is provided in the gap for limiting the flow of a resin, which is deposited along side the semiconductor chip, around the peripheral portion of the semiconductor chip. The structure increases the resistance to the flow of the resin in the peripheral portion of the semiconductor chip. Therefore, the rate at which the resin flows in the peripheral portion of the semiconductor chip is made lower than the rate at which the resin flows near the central portion of semiconductor chip. Accordingly, the formation of a resin-less void in the gap is suppressed so that the grade and quality of the semiconductor device is improved. In one embodiment, the structure in the gap includes projections provided on a portion of the mount board that corresponds to the peripheral portion of the semiconductor chip. In another embodiment, the structure in the gap includes protruding, portions provided on portions of the mount board that correspond to side portions of the semiconductor chip. The protruding portions make the size of the gap near the central portion of the semiconductor chip larger than size of the gap near the side portions of the semiconductor chip.

    摘要翻译： 提供一种半导体封装件，其包括安装在安装板上的半导体芯片，其间插入有金属凸块，以产生间隙。 在间隙中设置有用于限制沿着半导体芯片的侧面沉积的树脂的流动围绕半导体芯片的周边部分的结构。 该结构增加了对半导体芯片周边部分中树脂流动的阻力。 因此，树脂在半导体芯片的周边部分流动的速率比在半导体芯片的中心部附近树脂流动的速率低。 因此，抑制了间隙中无树脂的空隙的形成，从而提高了半导体器件的等级和质量。 在一个实施例中，间隙中的结构包括设置在对应于半导体芯片的周边部分的安装板的一部分上的突起。 在另一个实施例中，间隙中的结构包括设置在对应于半导体芯片的侧部的安装板的部分上的突出部分。 突起部分使得靠近半导体芯片的中心部分的间隙的尺寸大于靠近半导体芯片的侧部的间隙的尺寸。

    Apparatus and method for manufacturing a semiconductor package
    10.
    发明授权
    Apparatus and method for manufacturing a semiconductor package 失效
    用于制造半导体封装的装置和方法

    公开(公告)号：US5935375A

    公开(公告)日：1999-08-10

    申请号：US902349

    申请日：1997-07-29

    申请人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

    发明人： Takahito Nakazawa ,  Hiroshi Nomura ,  Yumiko Ohshima

    IPC分类号： H01L21/60 ,  B05B1/14 ,  B05B13/04 ,  B05C5/00 ,  B05C5/02 ,  B05C9/14 ,  H01L21/00 ,  H01L21/56 ,  H01L23/16 ,  H01L23/28 ,  B05B5/00

    CPC分类号： H01L21/6715 ,  B05C5/001 ,  B05C5/0208 ,  B05C9/14 ,  H01L24/743 ,  B05B1/14 ,  B05B13/04 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  Y10T156/1798

    摘要： An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. According to the present invention, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip so the resin spreads throughout the entire gap at substantially the same time as it flows along the peripheral portion of the chip. Thus, the formation of resin-less voids in the gap is deterred so that the grade and quality of the semiconductor device is improved.

    摘要翻译： 提供一种用于制造半导体封装的装置，其中半导体芯片和安装板之间的间隙填充有树脂。 该装置包括用于沿着半导体芯片的一侧供应树脂的树脂供给装置和用于控制由树脂供给装置供应的树脂量使得在半导体芯片的中心部分附近提供更多树脂的树脂供给控制装置， 靠近半导体芯片的端部。 还提供了一种方法，其包括以下步骤：连接半导体芯片和安装板，并且以半导体芯片的一侧向树脂提供树脂，使得在半导体芯片的中心部分附近提供更多的树脂， 半导体芯片的端部。 根据本发明，提供树脂，使得其在芯片的周边部分附近相对较少集中，使得树脂在沿着芯片的周边部分流动的基本同时在整个间隙中扩展。 因此，阻止了间隙中无树脂的空隙的形成，从而提高了半导体器件的等级和质量。