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公开(公告)号：US4394353A
公开(公告)日：1983-07-19
申请号：US213110
申请日：1980-12-04
CPC分类号： C22B3/0024 , B01D15/422 , B01J39/26 , C01F17/0006 , C22B3/24 , C22B3/42 , G01N30/02 , Y02P10/234
摘要： A process for the separation of one rare earth metal from another in a mixture of rare earth metals by chromatographic displacement using a complexing agent and a cation exchanger, which process comprises using a cation exchanger having a micro-void volume void ratio of 0.5 to 0.95, preferably 0.5 to 0.88.
摘要翻译： 一种通过使用络合剂和阳离子交换剂的色谱置换在稀土金属混合物中分离一种稀土金属的方法，该方法包括使用具有微孔隙体积空隙率为0.5至0.95的阳离子交换剂 ，优选为0.5〜0.88。
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公开(公告)号：US07169209B2
公开(公告)日：2007-01-30
申请号：US10398114
申请日：2001-10-02
申请人： Shuichi Nakata , Yasuki Shimamura
发明人： Shuichi Nakata , Yasuki Shimamura
IPC分类号： C22C9/00
CPC分类号： B22F3/1035 , B22F1/0007 , B22F1/0059 , B22F1/02 , B22F1/025 , B22F2001/0066 , B22F2998/00 , B22F2998/10 , B23K35/0244 , B23K35/262 , B23K35/302 , B23K2101/36 , H01B1/22 , H01L23/49883 , H01L2924/0002 , Y10T428/1225 , B22F9/082 , B22F1/0085 , B22F1/0011 , H01L2924/00
摘要： Disclosed are metal alloy particles containing substantially no lead, each exhibiting a plurality of different melting points including an original lowest melting point (a) and a highest melting point, wherein, when the metal alloy particles are subjected to differential scanning calorimetry (DSC), at least one exothermic peak is observed in the DSC, wherein each of the metal alloy particles exhibits the original lowest melting point (a) at least at a surface portion thereof, and wherein, when each metal alloy particle is heated at a temperature equal to or higher than the original lowest melting point (a) to melt at least a surface portion of each metal alloy particle, followed by cooling to room temperature to thereby solidify the melted portion of each metal alloy particle, the resultant solid metal alloy particle having experienced the melting and solidification exhibits an elevated lowest melting point (a′) higher than the original lowest melting point (a).
摘要翻译： 公开了基本上不含铅的金属合金粒子，其各自表现出多个不同的熔点，包括原始最低熔点（a）和最高熔点，其中当金属合金粒子进行差示扫描量热法（DSC）时， 在DSC中观察到至少一个放热峰，其中每个金属合金颗粒至少在其表面部分表现出原始的最低熔点（a），并且其中当每个金属合金颗粒在等于 或高于原始最低熔点（a）以熔化至少每个金属合金颗粒的表面部分，随后冷却至室温，从而固化每种金属合金颗粒的熔融部分，所得固体金属合金颗粒经历 熔融和凝固表现出比原始最低熔点（a）高的最低熔点（a'）。
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3.发明授权
公开(公告)号：US4965322A
公开(公告)日：1990-10-23
申请号：US171590
申请日：1988-03-22
申请人： Yasuki Shimamura , Jyoji Ihata
发明人： Yasuki Shimamura , Jyoji Ihata
CPC分类号： B41C1/1041 , B41M5/368 , C08F8/36 , G03C1/733 , C08F2800/10 , C08F2800/20
摘要： A photosensitive and heat-sensitive polymer having conjugated polyenes and sulfonic acid groups and an absorbance ratio of a strong band in the region of 1200 cm.sup.-1 to 1300 cm.sup.-1 assignable to sulfonic acid groups adjacent to conjugated polyenes of at least 3 sequence lengths to a strong band near 1050 cm.sup.-1 assignable to sulfonic acid groups in the IR spectrum of at least 0.6. The photosensitive and heat-sensitive polymer is obtained by the sulfonation of a polymer of an ethylenically unsaturated monomer having a number average molecular weight of at least 10,000 or a polymer having conjugated polyenes and a number average molecular weight of at least 10,000 and selected from specified polymers and copolymers. The photosensitive and heat-sensitive polymer is useful for information recording materials capable of being recorded by a laser beam or a thermal head for preparing printing plates, especially offset printing plates.
摘要翻译： 具有共轭多烯和磺酸基的感光和热敏性聚合物和在1200cm -1至1300cm -1区域中的强带的吸光度比可分配给与至少3个序列长度的共轭多烯相邻的磺酸基 到1050cm -1附近的强分子，其可以分配至至少0.6的IR光谱中的磺酸基团。 光敏和热敏聚合物是通过磺化数均分子量至少为10,000的烯键式不饱和单体的聚合物或具有共轭多烯的聚合物和数均分子量至少为10,000而选自指定的 聚合物和共聚物。 感光和热敏聚合物可用于能够通过激光束或用于制备印刷版，特别是胶印印版的热敏头记录的信息记录材料。
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公开(公告)号：US20090139608A1
公开(公告)日：2009-06-04
申请号：US11887181
申请日：2006-03-29
申请人： Norihito Tanaka , Yasuki Shimamura
发明人： Norihito Tanaka , Yasuki Shimamura
CPC分类号： H05K3/3484 , B22F1/0059 , B23K35/025 , B23K35/262 , B23K35/302 , H05K2201/0272
摘要： There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range.
摘要翻译： 提供了具有高耐热性的导电填料，其可在回流焊热处理条件下熔融粘合无铅焊料，并且在接合之后，在相同的热处理条件下不熔化。 导电填料的特征在于，通过差示扫描量热法测量，其至少观察到一个亚稳金属合金相作为放热峰，并且在210-240℃中具有至少一个作为吸热峰的熔点 范围和300至450℃的范围，并且在246℃下热处理时，填料产生粘合物体，其通过差示扫描量热法测量，没有观察到作为吸热峰的熔点 210-240℃范围内，或者由210-240℃范围内的吸热峰面积计算出的熔融吸热温度，熔融吸热温度为从吸热峰值计算的接合前的填料的熔融吸热温度的90％以下 面积在210〜240摄氏度范围。
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5.发明授权
公开(公告)号：US5187047A
公开(公告)日：1993-02-16
申请号：US679408
申请日：1991-04-02
申请人： Yasuki Shimamura , Jyoji Ihata
发明人： Yasuki Shimamura , Jyoji Ihata
CPC分类号： C08F8/36 , B41C1/1041 , B41M5/368 , G03C1/733 , C08F2800/10 , C08F2800/20 , Y10S430/146
摘要： A photosensitive and heat-sensitive polymer having conjugated polyenes and sulfonic acid groups and an absorbance ratio of a strong band in the region of 1200 cm.sup.-1 to 1300 cm.sup.-1 assignable to sulfonic acid groups adjacent to conjugated polyenes of at least 3 sequence lengths to a strong band near 1050 cm.sup.-1 assignable to sulfonic acid groups in the IR spectrum of at least 0.6. The photosensitive and heat-sensitive polymer is obtained by the sulfonation of a polymer of an ethylenically unsaturated monomer having a number average molecular weight of at least 10,000 or a polymer having conjugated polyenes and a number average molecular weight of at least 10,000 and selected from the group consisting of (a) a homopolymer or copolymer of an olefin having 2 to 8 carbon atoms; (b) a homopolymer or copolymer of a halogenated olefin having 2 to 3 carbon atoms and a copolymer of the halogenated olefin and an olefin having 2 to 8 carbon atoms; (c) a homopolymer or copolymer of an olefin having a polar group and a copolymer of the olefin and an olefin having 2 to 8 carbon atoms; (d) a crosslinked aromatic polymer comprising 50 to 98% by mol of a monovinyl or monovinylidene aromatic monomer unit and 2 to 50% by mol of a polyvinyl monomer unit; and (e) a homopolymer or copolymer having conjugated polyenes of at least 3 sequence lengths.
摘要翻译： 具有共轭多烯和磺酸基的感光和热敏性聚合物和在1200cm -1至1300cm -1区域中的强带的吸光度比可分配给与至少3个序列长度的共轭多烯相邻的磺酸基 到1050cm -1附近的强分子，其可以分配至至少0.6的IR光谱中的磺酸基团。 感光和热敏聚合物通过磺化数均分子量至少为10,000的烯属不饱和单体的聚合物或具有共轭多烯的聚合物和数均分子量为至少10,000的聚合物而获得，并且选自 由（a）具有2至8个碳原子的烯烃的均聚物或共聚物组成的组; （b）具有2至3个碳原子的卤代烯烃和卤代烯烃与具有2至8个碳原子的烯烃的共聚物的均聚物或共聚物; （c）具有极性基团的烯烃和烯烃与具有2-8个碳原子的烯烃的共聚物的均聚物或共聚物; （d）包含50-98摩尔％的单乙烯基或单亚乙烯基芳族单体单元和2-50摩尔％的聚乙烯基单体单元的交联芳族聚合物; 和（e）具有至少3个序列长度的共轭多烯的均聚物或共聚物。
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公开(公告)号：US08241436B2
公开(公告)日：2012-08-14
申请号：US11887181
申请日：2006-03-29
申请人： Norihito Tanaka , Yasuki Shimamura
发明人： Norihito Tanaka , Yasuki Shimamura
CPC分类号： H05K3/3484 , B22F1/0059 , B23K35/025 , B23K35/262 , B23K35/302 , H05K2201/0272
摘要： There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that, as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240° C. range and the 300 to 450° C. range, and that the filler, upon heat treatment at 246° C., gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240° C. range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240° C. range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240° C. range.
摘要翻译： 提供了具有高耐热性的导电填料，其可在回流焊热处理条件下熔融粘合无铅焊料，并且在接合之后，在相同的热处理条件下不熔化。 导电填料的特征在于，通过差示扫描量热法测量，其至少观察到一个亚稳金属合金相作为放热峰，并且在210-240℃中具有至少一个作为吸热峰的熔点 范围和300至450℃的范围，并且在246℃下热处理时，填料产生粘合物体，其通过差示扫描量热法测量，没有观察到作为吸热峰的熔点 210-240℃范围内，或者由210-240℃范围内的吸热峰面积计算出的熔融吸热温度，熔融吸热温度为从吸热峰值计算的接合前的填料的熔融吸热温度的90％以下 面积在210〜240摄氏度范围。
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7.发明授权
公开(公告)号：US5025266A
公开(公告)日：1991-06-18
申请号：US554751
申请日：1990-07-20
申请人： Yasuki Shimamura , Jyoji Ihata
发明人： Yasuki Shimamura , Jyoji Ihata
CPC分类号： B41C1/1041 , B41M5/368 , C08F8/36 , G03C1/733 , C08F2800/10 , C08F2800/20
摘要： A photosensitive and heat-sensitive polymer having conjugated polyenes and sulfonic acid groups and an absorbance ratio of a strong band in the region of 1200 cm.sup.-1 to 1300 cm.sup.-1 assignable to sulfonic acid groups adjacent to conjugated polyenes of at least 3 sequence lengths to a strong band near 1050 cm.sup.-1 assignable to sulfonic acid groups in the IR spectrum of at least 0.6. The photosensitive and heat-sensitive polymer is obtained by the sulfonation of a polymer of an ethylenically unsaturated monomer having a number average molecular weight of at least 10,000 or a polymer having conjugated polyenes and a number average molecular weight of at least 10,000 and selected from the group consisting of (a) a homopolymer or copolymer of an olefin having 2 to 8 carbon atoms; (b) a homopolymer or copolymer of a halogenated olefin having 2 to 3 carbon atoms and a copolymer of the halogenated olefin and an olefin having 2 to 8 carbon atoms; (c) a homopolymer or copolymer of an olefin having a polar group and a copolymer of the olefin and an olefin having 2 to 8 carbon atoms; (d) a crosslinked aromatic polymer comprising 50 to 98% by mol of a monovinyl or monovinylidene aromatic monomer unit and 2 to 50% by mol of a polyvinyl monomer unit; and (e) a homopolymer or copolymer having conjugated polyenes of at least 3 sequence lengths. The photosensitive and heat-sensitive polymer is useful for information recording materials capable of being recorded by a laser beam or a thermal head for preparing printing plates, especially offset printing plates.
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