Method of manufacturing semiconductor device including air space formed around gate electrode
    1.
    发明授权
    Method of manufacturing semiconductor device including air space formed around gate electrode 有权
    制造半导体器件的方法,包括围绕栅电极形成的空气空间

    公开(公告)号:US07358179B2

    公开(公告)日:2008-04-15

    申请号:US11295663

    申请日:2005-12-07

    IPC分类号: H01L21/4763 H01L21/44

    CPC分类号: H01L27/0605 H01L21/764

    摘要: After a HEMT is formed, side walls are formed on a semiconductor substrate. Next, a sacrificial layer is formed to cover the HEMT. Next, contact holes are formed in the sacrificial layer to expose upper surfaces of source electrodes. Next, a metal interconnect line is formed by patterning a metal film formed on the entire top surface. Next, slits are formed in the metal interconnect line to partially expose an upper surface of the sacrificial layer. After the sacrificial layer is dissolved, the dissolved sacrificial layer is discharged through the slits to the outside. An air space is formed as a result of the removal of the sacrificial layer.

    摘要翻译: 在形成HEMT之后,在半导体衬底上形成侧壁。 接下来,形成牺牲层以覆盖HEMT。 接下来,在牺牲层中形成接触孔以暴露源电极的上表面。 接下来,通过图案化形成在整个顶表面上的金属膜来形成金属互连线。 接下来,在金属互连线中形成狭缝以部分地暴露牺牲层的上表面。 在牺牲层溶解之后,将溶解的牺牲层通过狭缝排出到外部。 作为去除牺牲层的结果形成空气空间。

    Method of manufacturing semiconductor device including air space formed around gate electrode
    2.
    发明申请
    Method of manufacturing semiconductor device including air space formed around gate electrode 有权
    制造半导体器件的方法,包括围绕栅电极形成的空气空间

    公开(公告)号:US20060199322A1

    公开(公告)日:2006-09-07

    申请号:US11295663

    申请日:2005-12-07

    IPC分类号: H01L21/8234 H01L21/4763

    CPC分类号: H01L27/0605 H01L21/764

    摘要: After a HEMT is formed, side walls are formed on a semiconductor substrate. Next, a sacrificial layer is formed to cover the HEMT. Next, contact holes are formed in the sacrificial layer to expose upper surfaces of source electrodes. Next, a metal interconnect line is formed by patterning a metal film formed on the entire top surface. Next, slits are formed in the metal interconnect line to partially expose an upper surface of the sacrificial layer. After the sacrificial layer is dissolved, the dissolved sacrificial layer is discharged through the slits to the outside. An air space is formed as a result of the removal of the sacrificial layer.

    摘要翻译: 在形成HEMT之后,在半导体衬底上形成侧壁。 接下来,形成牺牲层以覆盖HEMT。 接下来,在牺牲层中形成接触孔以暴露源电极的上表面。 接下来,通过图案化形成在整个顶表面上的金属膜来形成金属互连线。 接下来,在金属互连线中形成狭缝以部分地暴露牺牲层的上表面。 在牺牲层溶解之后,将溶解的牺牲层通过狭缝排出到外部。 作为去除牺牲层的结果形成空气空间。

    Micro-lens array substrate and method for manufacturing thereof
    3.
    发明授权
    Micro-lens array substrate and method for manufacturing thereof 有权
    微透镜阵列基板及其制造方法

    公开(公告)号:US07978413B2

    公开(公告)日:2011-07-12

    申请号:US12432803

    申请日:2009-04-30

    IPC分类号: G02B27/10

    摘要: A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided.In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.In a method for manufacturing the micro-lens array substrate of the present invention, a resist layer having a plurality of consecutive lens-shaped concave portions is formed in a surface of a quartz or glass substrate, the lens-shaped concave portion of the resist layer is transferred to the substrate by dry-etching, and a micro-lens array is formed by injecting a resin into the lens-shaped concave portion of this substrate. In addition, a taper portion is formed in a peripheral portion similarly to the formation of the lens-shaped concave portion, and a micro-lens array is formed by injecting a resin into the lens-shaped concave portion and taper portion.

    摘要翻译: 提供了具有适合于更高分辨率的精确微透镜阵列的微透镜基板,具有高质量的微透镜阵列基板而不具有变形,及其制造方法。 在本发明的微透镜阵列基板中,由石英基板或玻璃基板的表面直接形成由多个连续凹透镜形状的微透镜形成的微透镜阵列,微透镜阵列 通过基于干蚀刻的转印方法形成。 在本发明的微透镜阵列基板中,在石英基板或玻璃基板的微透镜阵列的周边部分,朝向基板的表面形成锥形部。 在本发明的微透镜阵列基板的制造方法中,在石英或玻璃基板的表面形成具有多个连续的透镜状的凹部的抗蚀剂层,抗蚀剂的透镜状的凹部 通过干法蚀刻将层转移到基板上,并且通过将树脂注入到该基板的透镜形凹部中而形成微透镜阵列。 此外,与透镜状凹部的形成同样,在周边部形成有锥形部,通过将树脂注入到透镜状的凹部和锥形部中而形成微透镜阵列。

    Pattern transfer mask
    4.
    发明授权
    Pattern transfer mask 失效
    模式传输掩码

    公开(公告)号:US5547789A

    公开(公告)日:1996-08-20

    申请号:US340865

    申请日:1994-11-15

    摘要: A pattern transfer mask for use in an optical exposure process includes a transparent substrate having a surface; a light shielding film of a desired pattern disposed on the surface of the transparent substrate for shielding a part of a photoresist film from light transmitted through the mask and incident on the photoresist film and for transferring the desired pattern to the photoresist film; and a plurality of projections disposed at equal intervals on one side of and contacting the light shielding film pattern for reducing the intensity of light transmitted through the transparent substrate where the projections are present.

    摘要翻译: 用于光学曝光工艺的图案转印掩模包括具有表面的透明衬底; 设置在所述透明基板的表面上的用于屏蔽光阻膜的一部分的光的屏蔽膜与透过所述掩模的光入射到所述光致抗蚀剂膜上并将所需图案转印到所述光致抗蚀剂膜上; 以及多个突起,以等间隔设置在遮光膜图案的一侧并与遮光膜图案接触,用于降低透射透过透明基板的光的强度。

    Microlens array substrate and production method therefor
    5.
    发明申请
    Microlens array substrate and production method therefor 有权
    微透镜阵列基板及其制造方法

    公开(公告)号:US20060215269A1

    公开(公告)日:2006-09-28

    申请号:US10557803

    申请日:2005-03-25

    IPC分类号: G02B27/10

    摘要: A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided. In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate. In a method for manufacturing the micro-lens array substrate of the present invention, a resist layer having a plurality of consecutive lens-shaped concave portions is formed in a surface of a quartz or glass substrate, the lens-shaped concave portion of the resist layer is transferred to the substrate by dry-etching, and a micro-lens array is formed by injecting a resin into the lens-shaped concave portion of this substrate. In addition, a taper portion is formed in a peripheral portion similarly to the formation of the lens-shaped concave portion, and a micro-lens array is formed by injecting a resin into the lens-shaped concave portion and taper portion.

    摘要翻译: 提供了具有适合于更高分辨率的精确微透镜阵列的微透镜基板,具有高质量的微透镜阵列基板而不具有变形,及其制造方法。 在本发明的微透镜阵列基板中,在石英基板或玻璃基板的表面直接形成由多个连续的凹透镜形微透镜形成的微透镜阵列,微透镜阵列 通过基于干蚀刻的转印方法形成。 在本发明的微透镜阵列基板中,在石英基板或玻璃基板的微透镜阵列的周边部分,朝向基板的表面形成锥形部。 在本发明的微透镜阵列基板的制造方法中,在石英或玻璃基板的表面形成具有多个连续的透镜状凹部的抗蚀剂层,抗蚀剂的透镜状凹部 通过干法蚀刻将层转移到基板上,并且通过将树脂注入到该基板的透镜形凹部中而形成微透镜阵列。 此外,与透镜状凹部的形成同样,在周边部形成有锥形部,通过将树脂注入到透镜状的凹部和锥形部中而形成微透镜阵列。

    Micro-lens array substrate and production method therefor
    6.
    发明授权
    Micro-lens array substrate and production method therefor 有权
    微透镜阵列基板及其制造方法

    公开(公告)号:US07715104B2

    公开(公告)日:2010-05-11

    申请号:US10557803

    申请日:2005-03-25

    IPC分类号: G02B27/10

    摘要: In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.

    摘要翻译: 在本发明的微透镜阵列基板中,由石英基板或玻璃基板的表面直接形成由多个连续凹透镜形状的微透镜形成的微透镜阵列,微透镜阵列 通过基于干蚀刻的转印方法形成。 在本发明的微透镜阵列基板中,在石英基板或玻璃基板的微透镜阵列的周边部分,朝向基板的表面形成锥形部。

    Antimicrobial agent
    8.
    发明授权
    Antimicrobial agent 失效
    抗微生物剂

    公开(公告)号:US5709870A

    公开(公告)日:1998-01-20

    申请号:US544532

    申请日:1995-10-18

    CPC分类号: A01N59/16 A01N43/16

    摘要: A silver-containing antimicrobial agent which is excellent in affinity to fiber, antimicrobial property, anti-fungus property and stability to heat and light. It comprises carboxymethyl cellulose containing silver in the amount of 0.01 to 1% by weight and having the degree of substitution to carboxymethyl group of not less than 0.4. The carboxymethyl cellulose may be a crosslinked compound to make the antimicrobial agent water resistant.

    摘要翻译: 一种对纤维的亲和性,抗微生物性,抗真菌性和对热和光的稳定性优异的含银抗微生物剂。 它含有含量为0.01〜1重量%的银的羧甲基纤维素,其羧甲基取代度为0.4以上。 羧甲基纤维素可以是交联化合物,以使抗微生物剂具有防水性。

    Method for producing field effect transistor
    9.
    发明授权
    Method for producing field effect transistor 失效
    制造场效应晶体管的方法

    公开(公告)号:US5395739A

    公开(公告)日:1995-03-07

    申请号:US142860

    申请日:1993-10-28

    摘要: In a method for producing a field effect transistor, a positive photoresist is deposited on a surface of a semiconductor substrate, the positive photoresist is exposed to light having an asymmetric intensity profile where a gate electrode is to be formed, the positive photoresist is converted into a negative photoresist, the negative photoresist is developed to form a pattern having an aperture opposite the gate electrode formation region of the substrate and asymmetric overhanging portions at the aperture, the semiconductor substrate is wet etched using the photoresist pattern as a mask to form a recess in the semiconductor substrate, and a gate metal is deposited using the photoresist pattern as a mask to form a gate electrode in the recess. Therefore, only one exposure process provides a photoresist pattern having asymmetric overhanging portions at the aperture of the pattern.

    摘要翻译: 在制造场效应晶体管的方法中,在半导体衬底的表面上沉积正性光致抗蚀剂,将正性光致抗蚀剂暴露于具有不对称强度分布的光,其中形成栅电极,将正性光致抗蚀剂转化为 负性光致抗蚀剂显影,形成具有与基板的栅电极形成区相对的孔和孔的不对称悬垂部分的图案,使用光致抗蚀剂图案作为掩模对半导体衬底进行湿蚀刻以形成凹部 在半导体衬底中,并且使用光致抗蚀剂图案作为掩模沉积栅极金属,以在凹部中形成栅电极。 因此,只有一个曝光工艺在图案的孔径处提供具有不对称悬垂部分的光刻胶图案。

    Method of producing a phase shifting mask
    10.
    发明授权
    Method of producing a phase shifting mask 失效
    生产相移掩模的方法

    公开(公告)号:US5300378A

    公开(公告)日:1994-04-05

    申请号:US928639

    申请日:1992-08-14

    申请人: Hiroyuki Minami

    发明人: Hiroyuki Minami

    CPC分类号: G03F1/29

    摘要: A mask for use in an optical exposure apparatus with single wavelength light includes a light shielding film pattern having two spaced apart portions on a transparent substrate, a transparent thin film for shifting the phase of light transmitted through the mask disposed in the aperture between the light shielding film portions and spaced from the light shielding film portions. The resolution and contrast of the image of the pattern projected onto a wafer are enhanced and the resolution and depth of focus of the photoresist on which the pattern is projected are improved.

    摘要翻译: 用于具有单波长光的光学曝光设备的掩模包括在透明基板上具有两个间隔开的部分的遮光膜图案,透明薄膜,用于移动透射通过设置在光线之间的孔中的掩模的光的相位 屏蔽膜部分并与遮光膜部分间隔开。 提高了投射到晶片上的图案的图像的分辨率和对比度,并提高了其上投影图案的光致抗蚀剂的分辨率和深度。