摘要:
After a HEMT is formed, side walls are formed on a semiconductor substrate. Next, a sacrificial layer is formed to cover the HEMT. Next, contact holes are formed in the sacrificial layer to expose upper surfaces of source electrodes. Next, a metal interconnect line is formed by patterning a metal film formed on the entire top surface. Next, slits are formed in the metal interconnect line to partially expose an upper surface of the sacrificial layer. After the sacrificial layer is dissolved, the dissolved sacrificial layer is discharged through the slits to the outside. An air space is formed as a result of the removal of the sacrificial layer.
摘要:
After a HEMT is formed, side walls are formed on a semiconductor substrate. Next, a sacrificial layer is formed to cover the HEMT. Next, contact holes are formed in the sacrificial layer to expose upper surfaces of source electrodes. Next, a metal interconnect line is formed by patterning a metal film formed on the entire top surface. Next, slits are formed in the metal interconnect line to partially expose an upper surface of the sacrificial layer. After the sacrificial layer is dissolved, the dissolved sacrificial layer is discharged through the slits to the outside. An air space is formed as a result of the removal of the sacrificial layer.
摘要:
A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided.In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.In a method for manufacturing the micro-lens array substrate of the present invention, a resist layer having a plurality of consecutive lens-shaped concave portions is formed in a surface of a quartz or glass substrate, the lens-shaped concave portion of the resist layer is transferred to the substrate by dry-etching, and a micro-lens array is formed by injecting a resin into the lens-shaped concave portion of this substrate. In addition, a taper portion is formed in a peripheral portion similarly to the formation of the lens-shaped concave portion, and a micro-lens array is formed by injecting a resin into the lens-shaped concave portion and taper portion.
摘要:
A pattern transfer mask for use in an optical exposure process includes a transparent substrate having a surface; a light shielding film of a desired pattern disposed on the surface of the transparent substrate for shielding a part of a photoresist film from light transmitted through the mask and incident on the photoresist film and for transferring the desired pattern to the photoresist film; and a plurality of projections disposed at equal intervals on one side of and contacting the light shielding film pattern for reducing the intensity of light transmitted through the transparent substrate where the projections are present.
摘要:
A micro-lens substrate having a precise micro-lens array suitable for higher resolution, the micro-lens array substrate of high quality without having a distortion, and a method for manufacturing thereof are provided. In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate. In a method for manufacturing the micro-lens array substrate of the present invention, a resist layer having a plurality of consecutive lens-shaped concave portions is formed in a surface of a quartz or glass substrate, the lens-shaped concave portion of the resist layer is transferred to the substrate by dry-etching, and a micro-lens array is formed by injecting a resin into the lens-shaped concave portion of this substrate. In addition, a taper portion is formed in a peripheral portion similarly to the formation of the lens-shaped concave portion, and a micro-lens array is formed by injecting a resin into the lens-shaped concave portion and taper portion.
摘要:
In the micro-lens array substrate of the present invention, a micro-lens array formed of a plurality of consecutive concave lens-shaped micro-lenses is directly formed in a surface of a quartz substrate or glass substrate, and the micro-lens array is formed by a transfer method based on dry-etching. In the micro-lens array substrate of the present invention, a taper portion is formed toward the surface of the substrate in a peripheral portion of the micro-lens array in the quartz substrate or glass substrate.
摘要:
The present invention provides instant noodles containing agar and curdlan, having water absorption of 250% or more upon reconstitution with water at 20° C. for 3 minutes, and being capable of reconstitution with water in a time of 5 minutes or less, and having an excellent texture with suitable hardness.
摘要:
A silver-containing antimicrobial agent which is excellent in affinity to fiber, antimicrobial property, anti-fungus property and stability to heat and light. It comprises carboxymethyl cellulose containing silver in the amount of 0.01 to 1% by weight and having the degree of substitution to carboxymethyl group of not less than 0.4. The carboxymethyl cellulose may be a crosslinked compound to make the antimicrobial agent water resistant.
摘要:
In a method for producing a field effect transistor, a positive photoresist is deposited on a surface of a semiconductor substrate, the positive photoresist is exposed to light having an asymmetric intensity profile where a gate electrode is to be formed, the positive photoresist is converted into a negative photoresist, the negative photoresist is developed to form a pattern having an aperture opposite the gate electrode formation region of the substrate and asymmetric overhanging portions at the aperture, the semiconductor substrate is wet etched using the photoresist pattern as a mask to form a recess in the semiconductor substrate, and a gate metal is deposited using the photoresist pattern as a mask to form a gate electrode in the recess. Therefore, only one exposure process provides a photoresist pattern having asymmetric overhanging portions at the aperture of the pattern.
摘要:
A mask for use in an optical exposure apparatus with single wavelength light includes a light shielding film pattern having two spaced apart portions on a transparent substrate, a transparent thin film for shifting the phase of light transmitted through the mask disposed in the aperture between the light shielding film portions and spaced from the light shielding film portions. The resolution and contrast of the image of the pattern projected onto a wafer are enhanced and the resolution and depth of focus of the photoresist on which the pattern is projected are improved.