公开(公告)号：US5934368A

公开(公告)日：1999-08-10

申请号：US530670

申请日：1995-09-19

申请人： Tetsuya Tanaka ,  Toshio Hatada ,  Takayuki Atarashi ,  Junichi Kobayashi ,  Akihiro Takanashi ,  Takahiro Daikoku ,  Yutaka Watanabe ,  Shizuo Zushi

发明人： Tetsuya Tanaka ,  Toshio Hatada ,  Takayuki Atarashi ,  Junichi Kobayashi ,  Akihiro Takanashi ,  Takahiro Daikoku ,  Yutaka Watanabe ,  Shizuo Zushi

IPC分类号： F24F11/00 ,  G05D22/02 ,  G05D23/19 ,  H01L23/34 ,  H01L23/427 ,  H01L23/467 ,  H05K5/02 ,  H05K7/20 ,  F25D17/06

CPC分类号： H05K7/207 ,  F24F11/0008 ,  G05D22/02 ,  G05D23/1931 ,  H01L23/34 ,  H01L23/467 ,  H05K7/20572 ,  H01L2924/0002

摘要： A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.

摘要翻译： 一种高度可靠的电子设备，在设备的机柜中无冷凝。 该电子设备具有安装有散热半导体器件的印刷电路板和风扇。 该电子设备还包括湿度计，用于测量通过开口引入机柜的冷却空气的相对湿度和露点温度，用于感测半导体器件表面温度的表面温度传感器，内部温度 用于感测半导体装置的内部温度的传感器，由热泵和室外机组成的除湿器和加热器装置，以及用于控制除湿装置和加热装置的控制器，使得相对湿度小于100％ 露点温度小于半导体器件的表面温度。

公开(公告)号：US5077601A

公开(公告)日：1991-12-31

申请号：US404350

申请日：1989-09-07

申请人： Toshio Hatada ,  Takayuki Atarashi ,  Takahiro Daikoku ,  Satomi Kobayashi ,  Shizuo Zushi ,  Fumiyuki Kobayashi ,  Susumu Iwai

发明人： Toshio Hatada ,  Takayuki Atarashi ,  Takahiro Daikoku ,  Satomi Kobayashi ,  Shizuo Zushi ,  Fumiyuki Kobayashi ,  Susumu Iwai

IPC分类号： H01L23/467

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.

摘要翻译： 一种冷却系统，用于通过使冷却流体沿着沿着冷却流体的主流排列成串联的电子装置的发热部件等发热部件而流动而冷却电子设备。 冷却系统具有附接到发热部件的散热翅片，以及限定冷却流体流动通道的冷却管道，其中设置有由发热部件和散热翅片组成的组件。 当在垂直于冷却流体的主流方向的平面中时，流动通道在上游端组件的上游端处具有大于组件的截面面积的横截面面积。 流动通道的横截面积朝向下游端逐渐减小，由此流动通道被分成主通道，冷却流体的主流分量通过该主通道直接流入一系列组件和辅助通道，通过该辅助通道 冷却流体的辅助部件基本垂直地朝着发热部件流动以撞击发热部件。

公开(公告)号：US5558493A

公开(公告)日：1996-09-24

申请号：US477653

申请日：1995-06-07

申请人： Yutaka Hayashi ,  Mitsuo Miyamoto ,  Michihito Watarai ,  Takayuki Atarashi ,  Tetsuya Tanaka ,  Toshio Hatada ,  Yoshihiro Takada ,  Takahiro Daikoku

发明人： Yutaka Hayashi ,  Mitsuo Miyamoto ,  Michihito Watarai ,  Takayuki Atarashi ,  Tetsuya Tanaka ,  Toshio Hatada ,  Yoshihiro Takada ,  Takahiro Daikoku

IPC分类号： F25D1/00 ,  C04B28/18 ,  F04D29/42 ,  H05K7/20 ,  F04D29/66

CPC分类号： F04D29/4213

摘要： A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.

摘要翻译： 一种强制用空气冷却装置，其特征在于，具有鼓风机，所述鼓风机用于将鼓风机从壳体或机架上进行操作的设备中，从鼓风机的进气表面或进气口吸入的空气吹向电子设备，其中， 装置具有垂直于入口表面垂直相交的流动调节板，其紧靠在进气表面之前安装。 通过这种结构，可以防止在进气表面附近的涡流流动，从鼓风机获得的冷却能力最优化，从而达到能够有效地冷却电子设备的效果，而不需要在进气表面 的鼓风机和安装有鼓风机的框架或壳体的壁面相比，与同一设备的常规安装相比，在没有流量调节板的情况下。

公开(公告)号：US5504651A

公开(公告)日：1996-04-02

申请号：US220256

申请日：1994-03-30

申请人： Takayuki Atarashi ,  Toshio Hatada ,  Tetsuya Tanaka ,  Toshiki Iino ,  Kenichi Kasai ,  Takahiro Daikoku ,  Tamotsu Tsukaguchi

发明人： Takayuki Atarashi ,  Toshio Hatada ,  Tetsuya Tanaka ,  Toshiki Iino ,  Kenichi Kasai ,  Takahiro Daikoku ,  Tamotsu Tsukaguchi

IPC分类号： H01L23/36 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： An electronic equipment has a cooling structure in which air discharged from heat sinks can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening and a discharge opening for cooling air are independently formed in a heat sink. A plurality of supply branched ducts and discharge branched ducts are combined in a comb-like shape along the axis of the ducts. Ejection openings for cooling air are formed on each of the supply branched ducts in positions corresponding to each of the heat sinks. Such ejection openings are closely connected to the supply openings for cooling air of the heat sinks. On the other hand, recovery openings for cooling air are formed on each of the refrigerant discharge ducts in a position corresponding to each of the heat sinks. Such recovery openings are closely connected to the discharge openings for gas refrigerant of the heat sinks.

摘要翻译： 电子设备具有冷却结构，其中可以在没有泄漏的情况下回收从散热器排出的空气，并且在狭窄的空间中设置紧凑的吹气管道和排放管道。 用于冷却空气的供给开口和排出口独立地形成在散热器中。 多个供应分支管道和排出分支管道沿着管道的轴线组合成梳状形状。 在每个供应分支管道上，在对应于每个散热器的位置中形成用于冷却空气的喷射开口。 这样的喷射开口紧密地连接到用于冷却散热器的空气的供应开口。 另一方面，冷却空气的回收开口形成在与各散热器对应的位置上的每个制冷剂排出管上。 这种回收开口与散热器的气体制冷剂的排出口紧密连接。

公开(公告)号：US5592363A

公开(公告)日：1997-01-07

申请号：US128227

申请日：1993-09-29

申请人： Takayuki Atarashi ,  Toshio Hatada ,  Takahiro Daikoku ,  Nobuo Kawasaki ,  Toshiki Iino ,  Tamotsu Tsukaguchi ,  Kenichi Kasai ,  Fumiyuki Kobayashi ,  Yoshito Hayashi

发明人： Takayuki Atarashi ,  Toshio Hatada ,  Takahiro Daikoku ,  Nobuo Kawasaki ,  Toshiki Iino ,  Tamotsu Tsukaguchi ,  Kenichi Kasai ,  Fumiyuki Kobayashi ,  Yoshito Hayashi

IPC分类号： H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

摘要翻译： 在每个半导体器件上设置具有多个半导体器件的电子设备，所述多个半导体器件在操作期间产生热量，散热片具有多个平板状或针状散热片。 喷嘴与散热器相关联，以将冷却流体供应到散热器中。 散热器布置成使得所有这些散热器沿相同的方向引导和排出冷却流体。 在由散热器确定的流体的流动方向（x方向）和冷却流体的排放量上测量的各个喷嘴的宽度小于相关散热器的宽度。 在与x方向垂直的方向（y方向）上测量的喷嘴的宽度小于相关联的散热器的宽度。 相邻喷嘴之间的空间提供了足够横截面的排放通道，其减小被加热的冷却介质通过其排出所遇到的阻力。

公开(公告)号：US5705854A

公开(公告)日：1998-01-06

申请号：US632618

申请日：1996-04-15

申请人： Takayuki Atarashi ,  Tetsuya Tanaka ,  Takahiro Daikoku

发明人： Takayuki Atarashi ,  Tetsuya Tanaka ,  Takahiro Daikoku

IPC分类号： H01L23/433 ,  H01L23/467 ,  H01L23/34

CPC分类号： H01L23/4336 ,  H01L23/467 ,  H01L2924/0002

摘要： A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly mounted in a plane or when the calorific value of the heat-generating semiconductor parts is extremely large. In addition, the cooling apparatus realizes uniform air quantity distribution and uniform temperature distribution to the heat-generating semiconductor parts. Heat sinks 13 are respectively attached onto a plurality of heat-generating semiconductor parts 12a, 12b and 12c on a board 11. Further, nozzles 14 are respectively provided on the opposite side surfaces of heat-generating semiconductor part fitted surfaces of the heat sinks 13. The nozzles 14 have a substantially rectangular cross section parallel to the board, and are designed such that, when the ratio of the distance between the adjacent heat sinks to the pitch of the plurality of mounted heat sinks is not less than 0.00 but below 0.02, the ratio of the width of the nozzles 14 in the direction (X direction) that a refrigerant flows within the heat sinks 13 to the width of the heat sinks 13 is not less than 0.16 and not more than 0.35.

摘要翻译： 一种用于电子设备的冷却装置，其能够在发热半导体部件非常紧密地安装在平面中时或者当发热量（以下简称为热值）时能够降低排气流路中的流动阻力以减小噪声并提高散热器的冷却性能 的发热半导体部件非常大。 此外，冷却装置实现均匀的空气量分布和对发热半导体部件的均匀的温度分布。 散热片13分别安装在板11上的多个发热半导体部分12a，12b和12c上。此外，喷嘴14分别设置在散热片13的发热半导体部件装配表面的相对侧表面上 喷嘴14具有与板平行的大致矩形的横截面，并且被设计成使得当相邻散热器之间的距离与多个安装的散热器的间距之比不小于0.00但小于0.02时 制冷剂在散热器13内流动的方向（X方向）上的喷嘴14的宽度与散热片13的宽度的比率不小于0.16且不大于0.35。

公开(公告)号：US07609477B2

公开(公告)日：2009-10-27

申请号：US10884426

申请日：2004-07-02

申请人： Takayuki Atarashi ,  Hiroshi Fukuda ,  Kenji Fujita

发明人： Takayuki Atarashi ,  Hiroshi Fukuda ,  Kenji Fujita

IPC分类号： G11B33/14 ,  H05K7/16

CPC分类号： G11B33/1406 ,  G11B33/128 ,  G11B33/142

摘要： In a disc array apparatus having a plurality of disc units, and a plurality of first connectors, each of which disc units includes a disc casing surrounding at least one recording disc rotatable therein on a rotatable axis, a casing holder on which the disk casing is mounted, and a second connector (detachably) connectable to corresponding one of the first connectors so that at least an electric connection between the disc casing and the corresponding one of the first connectors is capable of being formed through the second connector, the disk casing is connected to the casing holder in such a manner that a heat energy generated for at least one of recording an information onto the recording disc and reading out the information from the recording disk is capable of transferring from the disk casing to the casing holder.

摘要翻译： 在具有多个盘单元的盘阵列装置和多个第一连接器中，每个盘单元包括围绕可旋转的轴线可旋转的至少一个记录盘的盘壳体，盘壳体上的盘座 和可连接到相应的一个第一连接器的第二连接器（可拆卸地），使得盘壳体和相应的第一连接器之间的至少电连接能够通过第二连接器形成，盘壳体是 连接到壳体保持器，使得产生用于将信息记录到记录盘上并从记录盘读出信息中的至少一种的热能能够从盘壳体转移到壳体保持器。

公开(公告)号：US07359191B2

公开(公告)日：2008-04-15

申请号：US10917281

申请日：2004-08-13

申请人： Shunsuke Yamana ,  Hiroshi Fukuda ,  Kenji Fujita ,  Takayuki Atarashi ,  Hitoshi Matsushima

发明人： Shunsuke Yamana ,  Hiroshi Fukuda ,  Kenji Fujita ,  Takayuki Atarashi ,  Hitoshi Matsushima

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： In this invention, the CPU of a NAS board, which is liable to become hot, is cooled by concentrating a larger amount of air onto a heat sink. A plurality of logic circuit boards 3 are mounted on a control section 1D of a disc array device 1. The circuit component 4A for realizing the NAS function, liable to become hot, is provided with a heat sink 5. The aperture of the main air inlet section (Wb) is covered with a top plate 8. Airflow guidance sections (Wa, Wc) are respectively provided on both sides of the main air inlet section. Since the fin pitch of the airflow guidance sections is set narrow, the air inflow resistance (airflow resistance) of these is higher than that of the main air inlet section. Due to this difference in airflow resistance, the air in the vicinity of the airflow guidance sections is guided into the main air inlet section. The top plate 8 prevents outflow of air that has flowed into the main air inlet section to outside the heat sink 5.

摘要翻译： 在本发明中，容易变热的NAS板的CPU通过将更多量的空气集中到散热器上来冷却。 多个逻辑电路板3安装在盘阵列装置1的控制部分1D上。 用于实现易于变热的NAS功能的电路部件4A设置有散热器5。 主空气入口部分（Wb）的孔径被顶板8覆盖。 气流引导部分（Wa，Wc）分别设置在主进气部分的两侧。 由于气流引导部的翅片间距窄，因此这些的空气流入阻力（气流阻力）高于主空气导入部的空气流入阻力（气流阻力）。 由于气流阻力的差异，气流引导部附近的空气被引导到主空气入口部。 顶板8防止已经流入主空气入口部分的空气流到散热器5的外部。

公开(公告)号：US20060077776A1

公开(公告)日：2006-04-13

申请号：US11043994

申请日：2005-01-28

申请人： Hitoshi Matsushima ,  Takayuki Atarashi ,  Hiroshi Fukuda ,  Shunsuke Yamana

发明人： Hitoshi Matsushima ,  Takayuki Atarashi ,  Hiroshi Fukuda ,  Shunsuke Yamana

IPC分类号： G11B7/085

CPC分类号： H05K7/20818 ,  G11B33/128 ,  G11B33/1413 ,  G11B33/1426

摘要： A disk array system includes a plurality of disk drives and at least one unit box including the plurality of disk drives aligned in the thickness direction of the disk drive, each disk drive including a thin case accommodating a recording disk, a read/write head, and a driving mechanism for driving the recording disk and the read/write head, and a control board for controlling the driving mechanism, the control board being mounted on the thin case. In the disk array system, the thin case and the unit box are composed of a thermally-conductive material, the unit box includes surfaces parallel to the thickness direction of the plurality of disk drives, and at least one of the surfaces has a cold plate filled with a refrigerant. Heat generated at the disk drives is transferred to the cold plate, thereby improving cooling performance.

摘要翻译： 磁盘阵列系统包括多个磁盘驱动器和至少一个单元盒，包括在盘驱动器的厚度方向上对齐的多个磁盘驱动器，每个磁盘驱动器包括容纳记录盘的薄壳体，读/写磁头， 以及用于驱动记录盘和读/写头的驱动机构，以及用于控制驱动机构的控制板，控制板安装在薄壳上。 在磁盘阵列系统中，薄壳体和单元盒由导热材料构成，单元盒包括平行于多个磁盘驱动器的厚度方向的表面，并且至少一个表面具有冷板 充满制冷剂。 磁盘驱动器产生的热量传递到冷板，从而提高冷却性能。

公开(公告)号：US08164902B2

公开(公告)日：2012-04-24

申请号：US12544153

申请日：2009-08-19

申请人： Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

发明人： Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  H05K7/20245

摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

摘要翻译： 诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。 冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管， 其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。