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1.
公开(公告)号:US10173262B2
公开(公告)日:2019-01-08
申请号:US15016042
申请日:2016-02-04
发明人: Henry Helvajian , Anthony J. Manzo
IPC分类号: G01K11/00 , G01N25/00 , B22F3/105 , G01K11/24 , G06F17/50 , B29C64/153 , B29C64/393 , B33Y80/00 , B33Y50/02
摘要: Under one aspect, a method of processing a material includes heating a region of the material with a first energy source; exciting an acoustic wave in the material; and transmitting the acoustic wave through the heated region, the heated region changing at least one property of the acoustic wave. The method also can include detecting the change in at least one property of the acoustic wave; characterizing a temperature of the material in the heated region based on the detected change in at least one property of the acoustic wave; and comparing the characterized temperature of the material in the heated region to a threshold. The method further can include, based on the characterized temperature of the material in the heated region being less than the threshold or being above the threshold for an insufficient amount of time, modifying a property of the heated region with a second energy source.
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2.
公开(公告)号:US20170227408A1
公开(公告)日:2017-08-10
申请号:US15016042
申请日:2016-02-04
发明人: Henry Helvajian , Anthony J. Manzo
CPC分类号: B22F3/1055 , B22F2003/1057 , B22F2999/00 , B29C64/153 , B29C64/393 , B33Y50/02 , B33Y80/00 , G01K11/24 , G06F17/50 , Y02P10/295 , B22F2203/03
摘要: Under one aspect, a method of processing a material includes heating a region of the material with a first energy source; exciting an acoustic wave in the material; and transmitting the acoustic wave through the heated region, the heated region changing at least one property of the acoustic wave. The method also can include detecting the change in at least one property of the acoustic wave; characterizing a temperature of the material in the heated region based on the detected change in at least one property of the acoustic wave; and comparing the characterized temperature of the material in the heated region to a threshold. The method further can include, based on the characterized temperature of the material in the heated region being less than the threshold or being above the threshold for an insufficient amount of time, modifying a property of the heated region with a second energy source.
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3.
公开(公告)号:US20190111483A1
公开(公告)日:2019-04-18
申请号:US16206940
申请日:2018-11-30
发明人: Henry Helvajian , Anthony J. Manzo
IPC分类号: B22F3/105 , B29C64/393 , G01K11/24 , G06F17/50 , B29C64/153
CPC分类号: B22F3/1055 , B22F2003/1057 , B22F2999/00 , B29C64/153 , B29C64/393 , B33Y50/02 , B33Y80/00 , G01K11/24 , G06F17/50 , Y02P10/295 , B22F2203/03
摘要: Under one aspect, a method of processing a material includes heating a region of the material with a first energy source; exciting an acoustic wave in the material; and transmitting the acoustic wave through the heated region, the heated region changing at least one property of the acoustic wave. The method also can include detecting the change in at least one property of the acoustic wave; characterizing a temperature of the material in the heated region based on the detected change in at least one property of the acoustic wave; and comparing the characterized temperature of the material in the heated region to a threshold. The method further can include, based on the characterized temperature of the material in the heated region being less than the threshold or being above the threshold for an insufficient amount of time, modifying a property of the heated region with a second energy source.
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4.
公开(公告)号:US10413969B2
公开(公告)日:2019-09-17
申请号:US16206940
申请日:2018-11-30
发明人: Henry Helvajian , Anthony J. Manzo
IPC分类号: G01K11/00 , G01N25/00 , B22F3/105 , G01K11/24 , G06F17/50 , B29C64/153 , B29C64/393 , B33Y80/00 , B33Y50/02
摘要: Under one aspect, a method of processing a material includes heating a region of the material with a first energy source; exciting an acoustic wave in the material; and transmitting the acoustic wave through the heated region, the heated region changing at least one property of the acoustic wave. The method also can include detecting the change in at least one property of the acoustic wave; characterizing a temperature of the material in the heated region based on the detected change in at least one property of the acoustic wave; and comparing the characterized temperature of the material in the heated region to a threshold. The method further can include, based on the characterized temperature of the material in the heated region being less than the threshold or being above the threshold for an insufficient amount of time, modifying a property of the heated region with a second energy source.
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公开(公告)号:US10160061B2
公开(公告)日:2018-12-25
申请号:US15237408
申请日:2016-08-15
发明人: Henry Helvajian , Anthony J. Manzo
IPC分类号: B23K26/351 , G01K11/22 , C23C16/48 , G01H9/00 , B23K15/00 , H05B3/06 , G10K11/36 , B23K26/50 , C23C14/22 , G10K11/26 , F24V30/00
摘要: An acoustic wave is modified by initiating excitation of an acoustic wave from a first location on a substrate to a second location on the substrate and selectively heating the second location of the substrate so as to alter a property of the second location. With such arrangements, the altered property of the second location modifies the acoustic wave to result in a modified acoustic wave that is propagated from the second location to a third location on the substrate. Related apparatus, systems, and methods are also described.
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公开(公告)号:US20180043473A1
公开(公告)日:2018-02-15
申请号:US15237408
申请日:2016-08-15
发明人: Henry Helvajian , Anthony J. Manzo
CPC分类号: B23K26/351 , B23K15/0006 , B23K26/50 , C23C14/22 , C23C16/483 , F24V30/00 , G01H9/00 , G10K11/26 , G10K11/36 , H05B3/06
摘要: An acoustic wave is modified by initiating excitation of an acoustic wave from a first location on a substrate to a second location on the substrate and selectively heating the second location of the substrate so as to alter a property of the second location. With such arrangements, the altered property of the second location modifies the acoustic wave to result in a modified acoustic wave that is propagated from the second location to a third location on the substrate. Related apparatus, systems, and methods are also described.
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