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公开(公告)号：US20050212027A1
公开(公告)日：2005-09-29
申请号：US10708861
申请日：2004-03-29
IPC分类号： H01L21/8234 , H01L21/8242 , H01L27/108 , H01L29/94
CPC分类号： H01L27/10876 , H01L27/10841 , H01L29/945 , Y10S438/931
摘要： A method of forming a trench in a semiconductor substrate includes a step of converting the cross section of the upper portion of the trench from octagonal to rectangular, so that sensitivity to alignment errors between the trench lithography and the active area lithography is reduced. Applications include a vertical transistor that becomes insensitive to misalignment between the trench and the litho for the active area, in particular a DRAM cell with a vertical transistor.
摘要翻译： 在半导体衬底中形成沟槽的方法包括将沟槽的上部的横截面从八边形转换为矩形的步骤，从而减小了沟槽光刻和有源区光刻之间对准误差的敏感性。 应用包括对于有源区域，特别是具有垂直晶体管的DRAM单元对沟槽和光刻层之间的未对准变得不敏感的垂直晶体管。
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2.发明申请METHOD AND STRUCTURE FOR FORMING CAPACITORS AND MEMORY DEVICES ON SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES 有权在半导体绝缘体（SOI）衬底上形成电容器和存储器件的方法和结构公开(公告)号：US20110169065A1
公开(公告)日：2011-07-14
申请号：US12686403
申请日：2010-01-13
IPC分类号： H01L27/06 , H01L21/8242
CPC分类号： H01L21/84 , H01L27/0207 , H01L27/1087 , H01L27/10894 , H01L27/1203 , H01L29/66181
摘要： A device is provided that includes memory, logic and capacitor structures on a semiconductor-on-insulator (SOI) substrate. In one embodiment, the device includes a semiconductor-on-insulator (SOI) substrate having a memory region and a logic region. Trench capacitors are present in the memory region and the logic region, wherein each of the trench capacitors is structurally identical. A first transistor is present in the memory region in electrical communication with a first electrode of at least one trench capacitor that is present in the memory region. A second transistor is present in the logic region that is physically separated from the trench capacitors by insulating material. In some embodiments, the trench capacitors that are present in the logic region include decoupling capacitors and inactive capacitors. A method for forming the aforementioned device is also provided.
摘要翻译： 提供了一种在绝缘体上半导体（SOI）衬底上包括存储器，逻辑和电容器结构的器件。 在一个实施例中，该器件包括具有存储区域和逻辑区域的绝缘体上半导体（SOI）衬底。 沟槽电容器存在于存储器区域和逻辑区域中，其中每个沟槽电容器在结构上相同。 第一晶体管存在于与存在于存储器区域中的至少一个沟槽电容器的第一电极电连通的存储区域中。 第二晶体管存在于通过绝缘材料与沟槽电容器物理分离的逻辑区域中。 在一些实施例中，存在于逻辑区域中的沟槽电容器包括去耦电容器和无效电容器。 还提供了一种用于形成上述装置的方法。
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3.发明授权Self-aligned body contact for a semiconductor-on-insulator trench device and method of fabricating same 有权绝缘体上半导体沟槽器件的自对准体接触及其制造方法公开(公告)号：US07935998B2
公开(公告)日：2011-05-03
申请号：US12053692
申请日：2008-03-24
IPC分类号： H01L23/02
CPC分类号： H01L29/7827 , H01L21/84 , H01L27/0207 , H01L27/10841 , H01L27/10876 , H01L29/66666 , H01L2924/0002 , H01L2924/00
摘要： A structure and method of forming a body contact for a semiconductor-on-insulator trench device. The method including: forming set of mandrels on a top surface of a substrate, each mandrel of the set of mandrels arranged on a different corner of a polygon and extending above the top surface of the substrate, a number of mandrels in the set of mandrels equal to a number of corners of the polygon; forming sidewall spacers on sidewalls of each mandrel of the set of mandrels, sidewalls spacers of each adjacent pair of mandrels merging with each other and forming a unbroken wall defining an opening in an interior region of the polygon, a region of the substrate exposed in the opening; etching a contact trench in the substrate in the opening; and filling the contact trench with an electrically conductive material to form the contact.
摘要翻译： 形成绝缘体上半导体沟槽器件的体接触的结构和方法。 该方法包括：在基板的顶表面上形成一组心轴，该组心轴的每个心轴布置在多边形的不同角上并且在衬底的顶表面上方延伸，该心轴组中的多个心轴 等于多边形的多个角; 在所述一组心轴的每个心轴的侧壁上形成侧壁间隔件，每个相邻的一对心轴的侧壁间隔件彼此合并并且形成在多边形的内部区域中限定开口的不间断的壁， 开口 蚀刻开口中的衬底中的接触沟槽; 以及用导电材料填充接触沟槽以形成接触。
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公开(公告)号：US07776706B2
公开(公告)日：2010-08-17
申请号：US12169727
申请日：2008-07-09
IPC分类号： H01L21/8234
CPC分类号： H01L27/10867 , H01L27/0207
摘要： A method of forming a trench memory cell includes forming a trench capacitor within a substrate material, the trench capacitor including a node dielectric layer formed within a trench and a conductive capacitor electrode material formed within the trench in contact with the node dielectric layer; forming a strap mask so as cover one side of the trench and removing one or more materials from an uncovered opposite side of the trench; and forming a conductive buried strap material within the trench; wherein the strap mask is patterned in a manner such that a single-sided buried strap is defined within the trench, the single-sided buried strap configured in a manner such that the deep trench capacitor is electrically accessible at only one side of the trench.
摘要翻译： 形成沟槽存储单元的方法包括在衬底材料内形成沟槽电容器，所述沟槽电容器包括形成在沟槽内的节点电介质层和形成在所述沟槽内与所述节点电介质层接触的导电电容器电极材料; 形成带状掩模，以覆盖沟槽的一侧，并从沟槽的未覆盖的相对侧移除一种或多种材料; 以及在所述沟槽内形成导电掩埋带材料; 其中所述带掩模被图案化，使得在所述沟槽内限定单面掩埋带，所述单侧埋入带以使得所述深沟槽电容器仅在所述沟槽的一侧电可访问的方式构造。
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公开(公告)号：US07759188B2
公开(公告)日：2010-07-20
申请号：US12002828
申请日：2007-12-19
IPC分类号： H01L21/8242
CPC分类号： H01L27/1203 , H01L21/84 , H01L29/66666 , H01L29/78642
摘要： A method of fabricating a vertical field effect transistor (“FET”) is provided which includes a transistor body region and source and drain regions disposed in a single-crystal semiconductor-on-insulator (“SOI”) region of a substrate adjacent a sidewall of a trench. The substrate includes a buried insulator layer underlying the SOI region and a bulk region underlying the buried insulator layer. A buried strap conductively connects the SOI region to a lower node disposed below the SOI region and a body contact extends from the transistor body region to the bulk region of the substrate, the body contact being insulated from the buried strap.
摘要翻译： 提供一种制造垂直场效应晶体管（“FET”）的方法，其包括晶体管本体区域和设置在邻近侧壁的衬底的单晶半导体绝缘体（“SOI”）区域中的源极和漏极区域 的沟渠 衬底包括在SOI区域下面的掩埋绝缘体层和埋在掩埋绝缘体层下面的主体区域。 掩埋带导电地将SOI区域连接到设置在SOI区域下方的下部节点，并且主体接触从晶体管本体区域延伸到衬底的主体区域，身体接触部与掩埋带绝缘。
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6.发明授权Self-aligned strap for embedded trench memory on hybrid orientation substrate 失效用于混合取向基板上嵌入式沟槽存储器的自对准带公开(公告)号：US07737482B2
公开(公告)日：2010-06-15
申请号：US11538982
申请日：2006-10-05
IPC分类号： H01L29/76
CPC分类号： H01L27/1203 , H01L21/743 , H01L21/84 , H01L27/10829 , H01L27/10867 , H01L27/1087 , H01L27/1207 , H01L29/78
摘要： Structures including a self-aligned strap for embedded trench memory (e.g., trench capacitor) on hybrid orientation technology (HOT) substrate, and related method, are disclosed. One structure includes a hybrid orientation substrate including a semiconductor-on-insulator (SOI) section and a bulk semiconductor section; a transistor over the SOI section; a trench capacitor in the bulk semiconductor section; and a self-aligned strap extending from a source/drain region of the transistor to an electrode of the trench capacitor. The method does not require additional masks to generate the strap, results in a self-aligned strap and improved device performance. In one embodiment, the strap is a silicide strap.
摘要翻译： 公开了包括用于混合取向技术（HOT）衬底上的嵌入式沟槽存储器（例如，沟槽电容器）的自对准带的结构以及相关方法。 一种结构包括：包含绝缘体上半导体（SOI）部分和体半导体部分的混合取向衬底; SOI部分上的晶体管; 体半导体部分中的沟槽电容器; 以及从晶体管的源极/漏极区域延伸到沟槽电容器的电极的自对准带。 该方法不需要额外的掩模来生成带，导致自对准带和改进的设备性能。 在一个实施例中，带是硅化物带。
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公开(公告)号：US07700434B2
公开(公告)日：2010-04-20
申请号：US11957615
申请日：2007-12-17
IPC分类号： H01L21/8242
CPC分类号： H01L29/945 , H01L29/66181
摘要： A semiconductor fabrication method. First, a semiconductor structure is provided. The semiconductor structure includes a semiconductor substrate, a trench in the semiconductor substrate. The trench includes a side wall which includes {100} side wall surfaces and {110} side wall surfaces. The semiconductor structure further includes a blocking layer on the {100} side wall surfaces and the {110} side wall surfaces. Next, portions of the blocking layer on the {110} side wall surfaces are removed without removing portions of the blocking layer on the {100} side wall surfaces such that the {110} side wall surfaces are exposed to a surrounding ambient.
摘要翻译： 半导体制造方法。 首先，提供半导体结构。 半导体结构包括半导体衬底，半导体衬底中的沟槽。 沟槽包括侧壁，其包括{100}侧壁表面和{110}侧壁表面。 半导体结构还包括在{100}侧壁表面和{110}侧壁表面上的阻挡层。 接下来，除去{110}侧壁表面上的阻挡层的部分，而不去除{100}侧壁表面上的阻挡层的部分，使得{110}侧壁表面暴露于周围环境。
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8.发明授权公开(公告)号：US07569450B2
公开(公告)日：2009-08-04
申请号：US11423284
申请日：2006-06-09
IPC分类号： H01L21/8242
CPC分类号： H01L29/945 , H01L29/66931
摘要： A semiconductor structure and a method for forming the same. The semiconductor structure includes a semiconductor substrate. The semiconductor structure further includes an electrically insulating region on top of the semiconductor substrate. The semiconductor structure further includes a first semiconductor region on top of and in direct physical contact with the semiconductor substrate. The semiconductor structure further includes a second semiconductor region on top of the insulating region. The semiconductor structure further includes a capacitor in the first semiconductor region and the semiconductor substrate. The semiconductor structure further includes a capacitor electrode contact in the second semiconductor region and the electrically insulating region.
摘要翻译： 半导体结构及其形成方法。 半导体结构包括半导体衬底。 半导体结构还包括在半导体衬底的顶部上的电绝缘区域。 半导体结构还包括在半导体衬底之上并与之直接物理接触的第一半导体区域。 半导体结构还包括在绝缘区域的顶部上的第二半导体区域。 半导体结构还包括在第一半导体区域和半导体衬底中的电容器。 半导体结构还包括在第二半导体区域和电绝缘区域中的电容器电极接触。
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9.发明申请Method of multi-port memory fabrication with parallel connected trench capacitors in a cell 失效在单元中并联连接沟槽电容器的多端口存储器制造方法公开(公告)号：US20090176339A1
公开(公告)日：2009-07-09
申请号：US12316748
申请日：2008-12-16
IPC分类号： H01L21/8242
CPC分类号： G11C8/16 , G11C11/405 , G11C11/4097 , H01L27/0207 , H01L27/108 , H01L27/10861
摘要： A method is provided for fabricating a multi-port memory in which a plurality of parallel connected capacitors are in a cell. A plurality of trench capacitors are formed which have capacitor dielectric layers extending along walls of the plurality of trenches, the plurality of trench capacitors having first capacitor plates and second capacitor plates opposite the capacitor dielectric layers from the first capacitor plates. The first capacitor plates are conductively tied together and the second capacitor plates are conductively tied together. In this way, the first capacitor plates are adapted to receive a same variable voltage and the second capacitor plates are adapted to receive a same fixed voltage.
摘要翻译： 提供了一种用于制造其中多个并联电容器在单元中的多端口存储器的方法。 形成多个沟槽电容器，其具有沿多个沟槽的壁延伸的电容器电介质层，所述多个沟槽电容器具有第一电容器板和与第一电容器板相对的电容器电介质层的第二电容器板。 第一电容器板导电地连接在一起，并且第二电容器板被导电地连接在一起。 以这种方式，第一电容器板适于接收相同的可变电压，并且第二电容器板适于接收相同的固定电压。
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公开(公告)号：US07439559B2
公开(公告)日：2008-10-21
申请号：US11469039
申请日：2006-08-31
IPC分类号： H01L29/74
CPC分类号： H01L29/78642 , H01L27/10864 , H01L27/1087
摘要： A method of forming a memory cell having a trench capacitor and a vertical transistor in a semiconductor substrate includes a step of providing a bonded semiconductor wafer having a lower substrate with an [010] axis parallel to a first wafer axis and an upper semiconductor layer having an [010] axis oriented at forty-five degrees with respect to the wafer axis, the two being connected by a layer of bonding insulator; etching a trench through the upper layer and lower substrate; enlarging the lower portion of the trench and converting the cross section of the upper portion of the trench from octagonal to rectangular, so that sensitivity to alignment errors between the trench lithography and the active area lithography is reduced. An alternative version employs a bonded semiconductor wafer having a lower substrate formed from a (111) crystal structure and the same upper portion. Applications include a vertical transistor that becomes insensitive to misalignment between the trench and the lithographic pattern for the active area, in particular a DRAM cell with a vertical transistor.
摘要翻译： 在半导体衬底中形成具有沟槽电容器和垂直晶体管的存储单元的方法包括提供具有平行于第一晶片轴的[010]轴的下基板的接合半导体晶片的步骤，以及具有 相对于晶片轴线定向成四十五度的[010]轴，两者通过一层粘合绝缘体连接; 蚀刻通过上层和下衬底的沟槽; 扩大沟槽的下部并将沟槽的上部的横截面从八边形转换为矩形，从而降低对沟槽光刻和有源区光刻之间对准误差的敏感性。 替代方案采用具有由（111）晶体结构和相同上部形成的下基板的键合半导体晶片。 应用包括对于有源区域，特别是具有垂直晶体管的DRAM单元对沟槽和光刻图案之间的未对准变得不敏感的垂直晶体管。
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