公开(公告)号：US07094291B2

公开(公告)日：2006-08-22

申请号：US09893316

申请日：2001-06-26

申请人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner ,  Aleksander Owczarz ,  Raymon F. Thompson

发明人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner ,  Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： B05C11/00 ,  B05B12/00 ,  B05B15/00

CPC分类号： H01L21/6715 ,  G11B7/26 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  Y10S134/902

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

公开(公告)号：US6066575A

公开(公告)日：2000-05-23

申请号：US883393

申请日：1997-06-26

申请人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner

发明人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner

IPC分类号： G11B7/26 ,  H01L21/00 ,  H01L21/4763 ,  B05D1/02 ,  B05D3/02 ,  B05D3/12

CPC分类号： H01L21/6715 ,  G11B7/26

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

公开(公告)号：US5658387A

公开(公告)日：1997-08-19

申请号：US422485

申请日：1995-04-12

申请人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner

发明人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner

IPC分类号： G11B7/26 ,  H01L21/00 ,  B05B3/12

CPC分类号： H01L21/6715 ,  G11B7/26

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

摘要翻译： 一种用于喷涂硅片或其他半导体产品的半导体处理器。 处理器具有隔室，其中安装有晶片转移，涂覆站和热处理站。 涂装站具有喷雾处理容器，其中可移动喷头和可转动的晶片保持器。 喷涂站具有涂层粘度控制功能。 超声波共振喷头从计量泵精确地提供涂层。 热处理站热固化涂层，然后冷却晶片。 该系统允许在不规则表面上以相对均匀的构象层施加涂层。

公开(公告)号：US07138016B2

公开(公告)日：2006-11-21

申请号：US09893315

申请日：2001-06-26

申请人： Timothy J. Reardon ,  Thomas H. Oberlitner ,  Craig P. Meuchel ,  Aleksander Owczarz ,  Raymon F. Thompson

发明人： Timothy J. Reardon ,  Thomas H. Oberlitner ,  Craig P. Meuchel ,  Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： B05C11/00 ,  B05B12/00 ,  B05B15/00

CPC分类号： H01L21/6715 ,  G11B7/26 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  Y10S134/902

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

公开(公告)号：US06375741B2

公开(公告)日：2002-04-23

申请号：US09575965

申请日：2000-05-23

申请人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner

发明人： Timothy J. Reardon ,  Craig P. Meuchel ,  Thomas H. Oberlitner

IPC分类号： B05C1100

CPC分类号： H01L21/6715 ,  G11B7/26 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  Y10S134/902

摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

公开(公告)号：US06699373B2

公开(公告)日：2004-03-02

申请号：US09944152

申请日：2001-08-30

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： H01L21/68721 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/687 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68785

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US06309524B1

公开(公告)日：2001-10-30

申请号：US09386610

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1704

CPC分类号： H01L21/2885 ,  A61K35/12 ,  C12N2500/25 ,  C12N2500/32 ,  C12N2500/34 ,  C12N2500/40 ,  C12N2501/11 ,  C12N2501/39 ,  C12N2501/395 ,  C12N2506/22 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith. The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

摘要翻译： 阐述了将金属镀在工件表面上的反应器。 反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。 接触组件与反应器碗内的阳极间隔开。 接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。 当工件与其接合时，触头对工件的表面执行擦拭动作。 接触组件还包括设置在多个触点内部的屏障。 阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。 在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。 可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。 吹扫气体可用于帮助形成接触组件的屏障。 还提出了组合电镀/无电镀工具和方法。

公开(公告)号：US20080110751A1

公开(公告)日：2008-05-15

申请号：US11838453

申请日：2007-08-14

申请人： Thomas H. Oberlitner ,  Kyle M. Hanson

发明人： Thomas H. Oberlitner ,  Kyle M. Hanson

IPC分类号： C25B9/00

CPC分类号： H01L21/67086 ,  C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D17/007 ,  C25D21/10 ,  H01L21/67005 ,  H01L21/67023 ,  H01L21/67057 ,  H01L21/6723

摘要： An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed. One aspect of the present invention enables the fluids supplied to the workpiece by the paddle to be limited to the space located between the workpiece and the paddle, thus avoiding mixing of these fluids with the processing fluid located within the bowl assembly not supplied by the paddle.

摘要翻译： 提供了一种集成工具，其包括具有桨组件的至少一个工件处理站。 根据本发明的另一个独立方面，工件加工站适于调节加工流体相对于工件的水平，其中待加工的工件和可能的桨叶的部分选择性地浸入处理流体 。 根据本发明的另一独立方面，提供了一种在工件处理站中靠近工件使用的桨叶。 桨叶包括一组或多组输送口和一组或多组流体回收口。 在至少一个实施例中，桨叶用于搅拌靠近工件表面的处理流体。 在至少另一个实施例中，桨叶用于将待处理的工件的一个或多个流体递送和/或回收。 本发明的一个方面使得通过桨将供应到工件的流体限于位于工件和桨之间的空间，从而避免这些流体与位于碗组件内的处理流体混合，而不是由桨供应 。

公开(公告)号：US06645356B1

公开(公告)日：2003-11-11

申请号：US09386558

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  C25D7/123

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

公开(公告)号：US5489341A

公开(公告)日：1996-02-06

申请号：US111131

申请日：1993-08-23

申请人： Eric J. Bergman ,  Thomas H. Oberlitner

发明人： Eric J. Bergman ,  Thomas H. Oberlitner

IPC分类号： H01L21/00 ,  B08B3/04

CPC分类号： H01L21/67023

摘要： A semiconductor processor and methods using pillar shaped liquid emitters. The emitters have emission ports upon which liquid domes of processing chemicals are formed. The domes are applied to the surface of a wafer to wash discrete areas and thereby allow gases evolved from the reaction to easily escape about the domes and through gas passageways existing about the pillars. The wafer is rotated to provide even processing of the treated surface.