公开(公告)号：US11615971B2

公开(公告)日：2023-03-28

申请号：US16712405

申请日：2019-12-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Teruaki Konishi ,  Kouzou Kanagawa ,  Osamu Kuroda ,  Koji Tanaka ,  Kotaro Tsurusaki ,  Hidemasa Aratake ,  Kouji Ogura ,  Keita Hirase

IPC: H01L21/67 ,  H01L21/311

Abstract: There is provided a substrate processing apparatus including: a processing part configured to process a substrate with a processing liquid; and a processing liquid generation part configured to generate the processing liquid supplied to the processing part. The processing liquid generation part includes: a reservoir configured to store the processing liquid; a circulation line through which the processing liquid stored in the reservoir is circulated; a heater configured to heat the processing liquid; and a nozzle provided at a downstream side of the circulation line and has at least one ejection port formed to eject the processing liquid heated by the heater from above a liquid level of the processing liquid stored in the reservoir.

公开(公告)号：US20210118704A1

公开(公告)日：2021-04-22

申请号：US17072158

申请日：2020-10-16

Applicant: Tokyo Electron Limited

Inventor： Hidemasa Aratake ,  Osamu Kuroda ,  Kouzou Kanagawa

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/04 ,  B08B3/14

Abstract: A substrate processing apparatus includes a processing tub, a storage, a liquid recovery unit, a storage drain line and a liquid recovery unit drain line. The processing tub is allowed to accommodate therein multiple substrates, and configured to store therein a processing liquid. The storage is connected to the processing tub, and configured to store therein the processing liquid drained from the processing tub. The liquid recovery unit is configured to receive the processing liquid overflown from the processing tub. The storage drain line is configured to drain a liquid stored in the storage. The liquid recovery unit drain line is configured to drain a liquid received from the liquid recovery unit to an external drain line provided at an outside.

公开(公告)号：US20190080938A1

公开(公告)日：2019-03-14

申请号：US16126106

申请日：2018-09-10

Applicant: Tokyo Electron Limited

Inventor： Takahiro Kawazu ,  Takafumi Tsuchiya ,  Hideaki Sato ,  Hidemasa Aratake ,  Osamu Kuroda ,  Takashi Nagai ,  Jiro Harada

IPC: H01L21/67 ,  G05B19/418

Abstract: A substrate liquid processing apparatus A1 includes a processing liquid storage unit 38 configured to store a processing liquid therein; a processing liquid drain unit 41 configured to drain the processing liquid from the processing liquid storage unit 38; and a control unit 7. The control unit 7 performs a first control in a constant concentration mode in which a concentration of the processing liquid in the processing liquid storage unit 38 is regulated to a predetermined set concentration and a second control in a concentration changing mode in which the concentration of the processing liquid is changed. In the second control, a set concentration after concentration change is compared with a set concentration before the concentration change, and when the set concentration after the concentration change is lower, the control unit controls the processing liquid drain unit 41 to start draining of the processing liquid.

公开(公告)号：US11869780B2

公开(公告)日：2024-01-09

申请号：US16126106

申请日：2018-09-10

Applicant: Tokyo Electron Limited

Inventor： Takahiro Kawazu ,  Takafumi Tsuchiya ,  Hideaki Sato ,  Hidemasa Aratake ,  Osamu Kuroda ,  Takashi Nagai ,  Jiro Harada

IPC: H01L21/06 ,  H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67086 ,  H01L21/6719 ,  H01L21/67253 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/67754

Abstract: A substrate liquid processing apparatus includes a processing liquid storage unit configured to store a processing liquid therein; a processing liquid drain unit configured to drain the processing liquid from the processing liquid storage unit; and a control unit. The control unit performs a first control in a constant concentration mode in which a concentration of the processing liquid in the processing liquid storage unit is regulated to a predetermined set concentration and a second control in a concentration changing mode in which the concentration of the processing liquid is changed. In the second control, a set concentration after concentration change is compared with a set concentration before the concentration change, and when the set concentration after the concentration change is lower, the control unit controls the processing liquid drain unit to start draining of the processing liquid.

公开(公告)号：US12087599B2

公开(公告)日：2024-09-10

申请号：US17072158

申请日：2020-10-16

Applicant: Tokyo Electron Limited

Inventor： Hidemasa Aratake ,  Osamu Kuroda ,  Kouzou Kanagawa

IPC: H01L21/67 ,  B08B3/04 ,  B08B3/14 ,  H01L21/02

CPC classification number: H01L21/67057 ,  B08B3/048 ,  B08B3/14 ,  H01L21/02057 ,  H01L21/67253

Abstract: A substrate processing apparatus includes a processing tub, a storage, a liquid recovery unit, a storage drain line and a liquid recovery unit drain line. The processing tub is allowed to accommodate therein multiple substrates, and configured to store therein a processing liquid. The storage is connected to the processing tub, and configured to store therein the processing liquid drained from the processing tub. The liquid recovery unit is configured to receive the processing liquid overflown from the processing tub. The storage drain line is configured to drain a liquid stored in the storage. The liquid recovery unit drain line is configured to drain a liquid received from the liquid recovery unit to an external drain line provided at an outside.

公开(公告)号：US11745213B2

公开(公告)日：2023-09-05

申请号：US17068964

申请日：2020-10-13

Applicant: Tokyo Electron Limited

Inventor： Hidemasa Aratake ,  Osamu Kuroda ,  Kouzou Kanagawa

IPC: B05C11/10 ,  H01L21/304 ,  H01L21/02 ,  H01L21/3213 ,  B08B3/04

CPC classification number: B05C11/1036 ,  B05C11/1026 ,  B08B3/04 ,  H01L21/02041 ,  H01L21/304 ,  H01L21/32133

Abstract: A substrate processing apparatus includes a processing tub, a liquid recovery unit, a liquid recovery unit drain line, a storage, a first and a second liquid supply lines, a discharge line, a first and a second liquid flow rate controllers. The liquid recovery unit receives a processing liquid overflown from the processing tub. The liquid recovery unit drain line drains the processing liquid from the liquid recovery unit. The first and the second liquid supply lines supply a first and a second liquids, respectively. The cleaning liquid contains the first liquid and the second liquid, and removes a precipitate from the processing liquid. The discharge line discharges the cleaning liquid, the first liquid or the second liquid toward the liquid recovery unit. The first and the second liquid flow rate controllers are provided at the first and the second liquid supply lines, and adjust flow rates thereof, respectively.

公开(公告)号：US20210114057A1

公开(公告)日：2021-04-22

申请号：US17068964

申请日：2020-10-13

Applicant: Tokyo Electron Limited

Inventor： Hidemasa Aratake ,  Osamu Kuroda ,  Kouzou Kanagawa

IPC: B05C11/10 ,  H01L21/304 ,  H01L21/02 ,  H01L21/3213 ,  B08B3/04

Abstract: A substrate processing apparatus includes a processing tub, a liquid recovery unit, a liquid recovery unit drain line, a storage, a first and a second liquid supply lines, a discharge line, a first and a second liquid flow rate controllers. The liquid recovery unit receives a processing liquid overflown from the processing tub. The liquid recovery unit drain line drains the processing liquid from the liquid recovery unit. The first and the second liquid supply lines supply a first and a second liquids, respectively. The cleaning liquid contains the first liquid and the second liquid, and removes a precipitate from the processing liquid. The discharge line discharges the cleaning liquid, the first liquid or the second liquid toward the liquid recovery unit. The first and the second liquid flow rate controllers are provided at the first and the second liquid supply lines, and adjust flow rates thereof, respectively.