公开(公告)号：US10792711B2

公开(公告)日：2020-10-06

申请号：US16215958

申请日：2018-12-11

Applicant: Tokyo Electron Limited

Inventor： Meitoku Aibara ,  Yuki Yoshida ,  Hisashi Kawano ,  Masami Yamashita ,  Itaru Kanno ,  Kenji Mochida ,  Motoyuki Shima

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

公开(公告)号：US10272478B2

公开(公告)日：2019-04-30

申请号：US14809387

申请日：2015-07-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Meitoku Aibara ,  Yuki Yoshida ,  Hisashi Kawano ,  Masami Yamashita ,  Itaru Kanno ,  Kenji Mochida ,  Motoyuki Shima

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

公开(公告)号：US20190118227A1

公开(公告)日：2019-04-25

申请号：US16215958

申请日：2018-12-11

Applicant: Tokyo Electron Limited

Inventor： Meitoku AIBARA ,  Yuki Yoshida ,  Hisashi Kawano ,  Masami Yamashita ,  Itaru Kanno ,  Kenji Mochida ,  Motoyuki Shima

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

公开(公告)号：US09818598B2

公开(公告)日：2017-11-14

申请号：US14809373

申请日：2015-07-27

Applicant: TOKYO ELECTRON LIMITED ,  JSR CORPORATION

Inventor： Meitoku Aibara ,  Yuki Yoshida ,  Hisashi Kawano ,  Masami Yamashita ,  Itaru Kanno ,  Kenji Mochida ,  Motoyuki Shima

IPC: B08B7/00 ,  H01L21/02 ,  H01L21/67 ,  B08B3/08

CPC classification number: H01L21/02057 ,  B08B3/08 ,  H01L21/02041 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6715

Abstract: An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.