公开(公告)号：US20150096441A1

公开(公告)日：2015-04-09

申请号：US14490887

申请日：2014-09-19

Applicant: Tokyo Electron Limited

Inventor： Tomohiro Iseki ,  Hideo Funakoshi ,  Seiya Totsuka

IPC: B01D19/00

CPC classification number: B01D19/0063 ,  B01D19/0036

Abstract: Disclosed is a bubble removing method in which fine bubbles are removed from a filter to improve the performance of the filter. The bubble removing method includes a step of degassing a processing liquid supplied from a supply source to prepare a highly degassed liquid (highly degassed liquid preparation), a step of supplying the prepared highly degassed liquid at a first processing liquid from a pump device to a filter device (temporary liquid permeation), a step of supplying the highly degassed liquid at a second processing liquid flow rate higher than the first processing liquid flow rate from the pump device to the filter device (initial liquid permeation), and a step of causing the highly degassed liquid to flow from the pump device to the filter device for a predetermined length of time (liquid permeation).

Abstract translation: 公开了一种气泡去除方法，其中从过滤器除去细小气泡以提高过滤器的性能。 气泡去除方法包括对从供给源供给的处理液进行脱气以制备高度脱气的液体（高度脱气的液体制剂）的步骤，将制备的高度脱气的液体从第一处理液体从泵装置供给到 过滤装置（临时液体渗透），以高于第一处理液体流量从泵装置向过滤装置供给高脱气液体的步骤（初始液体渗透），以及引起 高度脱气的液体从泵装置流过过滤器装置达预定长度的时间（液体渗透）。

公开(公告)号：US20180059539A1

公开(公告)日：2018-03-01

申请号：US15682750

申请日：2017-08-22

Applicant: Tokyo Electron Limited

Inventor： Shinichi Hatakeyama ,  Masanobu Watanabe ,  Kouzo Nishi ,  Seiya Totsuka ,  Kentaro Yoshihara

IPC: G03F7/00 ,  G03F7/20

CPC classification number: G03F7/0027 ,  G03F7/162 ,  G03F7/70433 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67253

Abstract: A substrate processing apparatus according to the present disclosure includes: a nozzle that ejects a processing liquid to a wafer; a force-feeding unit that force-feeds the processing liquid to the nozzle side; a liquid feeding pipeline that includes first and second valves and guides the processing liquid from the force-feeding unit to the nozzle; and a controller. The controller is configured to perform opening the first valve in a state where the second valve is closed and a pressure between the first and second valves is higher than a pressure between the force-feeding unit and the first valve, controlling the force-feeding unit to increase the pressure between the first and second valves that has been decreased by the opening of the first valve, and opening the second valve after the pressure between the first and second valves is decreased by the opening of the first valve.

公开(公告)号：US09649577B2

公开(公告)日：2017-05-16

申请号：US14490887

申请日：2014-09-19

Applicant: Tokyo Electron Limited

Inventor： Tomohiro Iseki ,  Hideo Funakoshi ,  Seiya Totsuka

IPC: B01D19/00

CPC classification number: B01D19/0063 ,  B01D19/0036

Abstract: Disclosed is a bubble removing method in which fine bubbles are removed from a filter to improve the performance of the filter. The bubble removing method includes a step of degassing a processing liquid supplied from a supply source to prepare a highly degassed liquid (highly degassed liquid preparation), a step of supplying the prepared highly degassed liquid at a first processing liquid from a pump device to a filter device (temporary liquid permeation), a step of supplying the highly degassed liquid at a second processing liquid flow rate higher than the first processing liquid flow rate from the pump device to the filter device (initial liquid permeation), and a step of causing the highly degassed liquid to flow from the pump device to the filter device for a predetermined length of time (liquid permeation).

公开(公告)号：US11433420B2

公开(公告)日：2022-09-06

申请号：US16768216

申请日：2018-12-07

Applicant: Tokyo Electron Limited

Inventor： Ryouichirou Naitou ,  Masato Hayashi ,  Hideo Shite ,  Hiroyuki Ide ,  Yosuke Kameda ,  Seiya Totsuka ,  Atsumu Maita ,  Takami Satoh ,  Hirofumi Araki ,  Kentaro Yoshihara

IPC: B05C19/06 ,  B05C11/10 ,  H01L21/67

Abstract: A solution supply apparatus is for supplying a treatment solution to a treatment solution discharger which discharges the treatment solution to a treatment object. The solution supply apparatus includes: a supply pipe line connected to the treatment solution discharger; a filter provided on the supply pipe line which filters the treatment solution to remove foreign substances; and a controller. The controller performs a determination of a state of the treatment solution to be supplied to a primary side of the filter and, when the state of the treatment solution is determined to be bad, outputs a control signal for restricting supply of the treatment solution to the primary side of the filter.

公开(公告)号：US10295903B2

公开(公告)日：2019-05-21

申请号：US15682750

申请日：2017-08-22

Applicant: Tokyo Electron Limited

Inventor： Shinichi Hatakeyama ,  Masanobu Watanabe ,  Kouzo Nishi ,  Seiya Totsuka ,  Kentaro Yoshihara

IPC: G03F7/00 ,  G03F7/20 ,  H01L21/67 ,  G03F7/16

Abstract: A substrate processing apparatus according to the present disclosure includes: a nozzle that ejects a processing liquid to a wafer; a force-feeding unit that force-feeds the processing liquid to the nozzle side; a liquid feeding pipeline that includes first and second valves and guides the processing liquid from the force-feeding unit to the nozzle; and a controller. The controller is configured to perform opening the first valve in a state where the second valve is closed and a pressure between the first and second valves is higher than a pressure between the force-feeding unit and the first valve, controlling the force-feeding unit to increase the pressure between the first and second valves that has been decreased by the opening of the first valve, and opening the second valve after the pressure between the first and second valves is decreased by the opening of the first valve.