公开(公告)号：US11798819B2

公开(公告)日：2023-10-24

申请号：US17354128

申请日：2021-06-22

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yusuke Takamatsu ,  Taisei Inoue

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/14 ,  B08B13/00 ,  B08B3/08

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B3/14 ,  B08B13/00 ,  H01L21/02057 ,  B08B2203/007

Abstract: A liquid processing apparatus includes a storage tank, a circulation line, a supply line, a return line and at least one filter. The storage tank stores a processing liquid therein. Through the circulation line, the processing liquid sent from the storage tank is returned back into the storage tank. The supply line connects the circulation line and a supply configured to supply the processing liquid onto a substrate. The return line is connected to the supply line, and the processing liquid is returned back into the storage tank from the supply line through the return line. The filter is provided in at least one of the supply line on an upstream side of a connection point between the return line and the supply line or the return line, and is configured to remove a foreign substance in the processing liquid.

公开(公告)号：US11862474B2

公开(公告)日：2024-01-02

申请号：US17104086

申请日：2020-11-25

Applicant: Tokyo Electron Limited

Inventor： Taisei Inoue ,  Hiroki Sakurai ,  Takashi Nakazawa

IPC: H01L21/3213 ,  C23F1/30 ,  H01L21/67

CPC classification number: H01L21/32134 ,  C23F1/30 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate processing apparatus includes a temperature detector, a calculation unit and an execution unit. The temperature detector is configured to detect a temperature of a substrate on which a processing liquid is discharged. The calculation unit is configured to calculate, by using a given calculation formula, an etching amount of the substrate based on the temperature detected by the temperature detector. The execution unit configured to perform an etching processing on the substrate by the processing liquid based on the etching amount.

公开(公告)号：US20210398828A1

公开(公告)日：2021-12-23

申请号：US17354128

申请日：2021-06-22

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yusuke Takamatsu ,  Taisei Inoue

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/08 ,  B08B3/14 ,  B08B13/00

Abstract: A liquid processing apparatus includes a storage tank, a circulation line, a supply line, a return line and at least one filter. The storage tank stores a processing liquid therein. Through the circulation line, the processing liquid sent from the storage tank is returned back into the storage tank. The supply line connects the circulation line and a supply configured to supply the processing liquid onto a substrate. The return line is connected to the supply line, and the processing liquid is returned back into the storage tank from the supply line through the return line. The filter is provided in at least one of the supply line on an upstream side of a connection point between the return line and the supply line or the return line, and is configured to remove a foreign substance in the processing liquid.

公开(公告)号：US20210175093A1

公开(公告)日：2021-06-10

申请号：US17104086

申请日：2020-11-25

Applicant: Tokyo Electron Limited

Inventor： Taisei Inoue ,  Hiroki Sakurai ,  Takashi Nakazawa

IPC: H01L21/3213 ,  C23F1/30 ,  H01L21/67

Abstract: A substrate processing apparatus includes a temperature detector, a calculation unit and an execution unit. The temperature detector is configured to detect a temperature of a substrate on which a processing liquid is discharged. The calculation unit is configured to calculate, by using a given calculation formula, an etching amount of the substrate based on the temperature detected by the temperature detector. The execution unit configured to perform an etching processing on the substrate by the processing liquid based on the etching amount.