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公开(公告)号：US20210242039A1
公开(公告)日：2021-08-05
申请号：US17166047
申请日：2021-02-03
发明人： Melvin Verbaas
摘要： Embodiments of substrate processing systems and methods are provided for reducing the number of external connectors provided on a substrate processing system for receiving liquids and gases from external liquid and gas sources. In one embodiment, a substrate processing system includes a plurality of processing units for processing a substrate; a plurality of external connectors for receiving liquids and/or gases from a plurality of sources stored outside of the substrate processing system; and a plurality of internal distribution lines for routing the liquids and/or gases from the external connectors to the processing units. The disclosed substrate processing system reduces the number of external connectors provided on the system by: (a) including only one external connector for each liquid and gas source, and (b) providing a plurality of internal distribution lines within the substrate processing system for routing liquids and gases from the external connectors to the processing units.
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公开(公告)号：US20210159102A1
公开(公告)日：2021-05-27
申请号：US16951093
申请日：2020-11-18
发明人： Melvin Verbaas
摘要： Bake modules and related heaters for the processing of microelectronic workpieces, such as semiconductor substrates, are disclosed that include a plurality of resistance temperature detectors (RTDs) embedded into the heater to sense temperatures in different zones of the heater. Related methods are also disclosed.
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公开(公告)号：US20210156029A1
公开(公告)日：2021-05-27
申请号：US16697516
申请日：2019-11-27
发明人： Melvin Verbaas , Anthony Dip
IPC分类号： C23C16/455 , C23C16/458 , C23C16/46
摘要： Embodiments are described for internally cooled multi-hole injectors to deliver process chemicals. An internal channel in an injector for the delivery system delivers process chemicals, such as a gas precursor, to a reaction space or substrate within a process chamber through multiple holes formed by outlets. A cooling delivery path and a cooling return path for cooling chemicals are positioned adjacent the supply channel to cool the process chemicals internally within the injector. The cooling process can be controlled to achieve a target cooling level for the process chemicals within the channel. In operation, undesired deposits are reduced thereby extending the time between product maintenance cycles. Further, the delivery and return flow of the cooling chemicals helps to stimulate a more evenly distributed temperature for the supply channel. Still further, the disclosed embodiments can be used in high-temperature environments, such as above about 400 degrees Celsius.
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公开(公告)号：US11774298B2
公开(公告)日：2023-10-03
申请号：US16789046
申请日：2020-02-12
发明人： Melvin Verbaas , Kentaro Asakura , Takashi Mochizuki , Takahisa Mase , Nobutaka Yoshioka , Saki Matsuo
CPC分类号： G01K7/02 , G01K1/08 , G01K1/14 , G01K1/16 , H01L21/67098 , H05B3/141 , H05B3/265 , H01L21/67103 , H01L21/68785
摘要： Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.
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公开(公告)号：US20210247240A1
公开(公告)日：2021-08-12
申请号：US16789046
申请日：2020-02-12
发明人： Melvin Verbaas , Kentaro Asakura , Takashi Mochizuki , Takahisa Mase , Nobutaka Yoshioka , Saki Matsuo
摘要： Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.
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公开(公告)号：US12094753B2
公开(公告)日：2024-09-17
申请号：US17363401
申请日：2021-06-30
发明人： Melvin Verbaas , Einosuke Tsuda , Kentaro Asakura
IPC分类号： H01L21/687 , H01J37/32 , H05B3/22
CPC分类号： H01L21/68742 , H05B3/22 , H01J37/32724 , H01J2237/20235
摘要： A stage device includes: a stage having a pin hole provided therein and a placement surface on which a substrate is placed; and at least one lift pin configured to move up and down through the pin hole; and a lifter configured to raise and lower the at least one lift pin, wherein the stage includes a first heating part provided therein and configured to heat the stage, and the at least one lift pin includes a second heating part provided therein or therearound and configured to heat the at least one lift pin.
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公开(公告)号：US20240355593A1
公开(公告)日：2024-10-24
申请号：US18136276
申请日：2023-04-18
发明人： Melvin Verbaas , Einosuke Tsuda
IPC分类号： H01J37/32 , C23C16/458 , C23C16/46 , C23C16/509 , C23C16/52 , H01L21/683
CPC分类号： H01J37/32715 , C23C16/4583 , C23C16/46 , C23C16/509 , C23C16/52 , H01J37/32568 , H01L21/6833 , H01J37/32082 , H01J2237/002 , H01J2237/2007
摘要： An electrostatic chuck (ESC) for holding a workpiece in a plasma processing chamber, where the ESC includes a monolithic insulating substrate with a top surface; a plurality of electrodes embedded in the insulating substrate, the plurality of electrodes being in a multipolar configuration to receive multiple DC bias signals from a first power supply circuit; and a radio frequency (RF) electrode embedded in the insulating substrate, the plurality of electrodes being located between the top surface and the RF electrode, the RF electrode including a contact node configured to be coupled to a second power supply circuit configured to generate an RF signal.
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公开(公告)号：US20240304491A1
公开(公告)日：2024-09-12
申请号：US18179503
申请日：2023-03-07
发明人： Melvin Verbaas
IPC分类号： H01L21/687 , C23C16/458
CPC分类号： H01L21/68757 , C23C16/4586 , H01L21/68785 , H01L21/68792
摘要： A semiconductor processing apparatus that includes: a wafer pedestal including a ceramic pedestal shaft coupled to an underside of a ceramic wafer chuck, the ceramic pedestal shaft having a central through opening; and ceramic gas delivery tubes embedded within the ceramic pedestal shaft, the ceramic gas delivery tubes being made of a first ceramic material and the ceramic pedestal shaft being made of a second ceramic material, the ceramic gas delivery tubes being coupled to gas channels in the ceramic wafer chuck.
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公开(公告)号：US20220178024A1
公开(公告)日：2022-06-09
申请号：US17114096
申请日：2020-12-07
发明人： Melvin Verbaas , Anthony Dip
摘要： An exemplary apparatus includes a metal furnace tube having an open first end and an opposite second end. The metal furnace tube includes an inner chamber, a fluid inlet to intake a fluid into the inner chamber, and a fluid outlet to exhaust the fluid from the inner chamber, the inner chamber to support a plurality of substrates within the metal furnace tube. The apparatus includes a first base plate or flange back plate coupling the fluid inlet to the inner chamber; a second base plate or flange back plate coupling the fluid outlet to the inner chamber; and a furnace includes a heater to heat the metal furnace tube, the metal furnace tube being mounted within the furnace and the heater being disposed outside the metal furnace tube.
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公开(公告)号：US11225716B2
公开(公告)日：2022-01-18
申请号：US16697516
申请日：2019-11-27
发明人： Melvin Verbaas , Anthony Dip
IPC分类号： C23C16/455 , C23C16/46 , C23C16/458
摘要： Internally cooled multi-hole injectors to deliver process chemicals are provided. An internal channel in an injector for the delivery system delivers process chemicals, such as a gas precursor, to a reaction space or substrate within a process chamber through multiple holes formed by outlets. A cooling delivery path and a cooling return path for cooling chemicals are positioned adjacent the supply channel to cool the process chemicals internally within the injector. The cooling process can be controlled to achieve a target cooling level for the process chemicals within the channel. In operation, undesired deposits are reduced thereby extending the time between product maintenance cycles. Further, the delivery and return flow of the cooling chemicals helps to stimulate a more evenly distributed temperature for the supply channel. Still further, the disclosed embodiments can be used in high-temperature environments, such as above about 400 degrees Celsius.
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