公开(公告)号：US20160061882A1

公开(公告)日：2016-03-03

申请号：US14781021

申请日：2014-03-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Eiichi SHINOHARA ,  Munetoshi NAGASAKA ,  Ken TAOKA ,  Yoshiyasu KATO

IPC: G01R31/26 ,  G01R1/073

CPC classification number: G01R31/26 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  G01R31/2887

Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.

Abstract translation: 探针装置包括布置在安装台上方的电极板，用于安装半导体晶片并电连接到测试器;布置在安装台侧面并与安装台的安装台电极电连接的接触探针。 接触探针包括具有与电极板接触的不平坦的顶表面的接触部分和与接触部分形成为一个单元的电缆连接部分。 接触部分和电缆连接部分可通过设置在电缆连接部分下方的偏置部件垂直移动。 当通过向上移动安装台使探针与半导体晶片的半导体器件的电极接触时，接触部分和电极板彼此接触，并且背面电极和测试仪彼此电连接。

公开(公告)号：US20210265183A1

公开(公告)日：2021-08-26

申请号：US17177687

申请日：2021-02-17

Applicant: Tokyo Electron Limited

Inventor： Shigeru KASAI ,  Yutaka AKAIKE ,  Yoshiyasu KATO ,  Hiroyuki NAKAYAMA ,  Hiroaki KOMIYA

IPC: H01L21/67 ,  B32B7/12 ,  B32B15/01 ,  H05B3/20

Abstract: A dummy wafer includes a planar heater and a pair of plate-shaped members formed of an aluminum alloy, aluminum, or silicon carbide, wherein the planar heater is sandwiched by the plate-shaped members.

公开(公告)号：US20220015193A1

公开(公告)日：2022-01-13

申请号：US17370347

申请日：2021-07-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI ,  Hiroyuki NAKAYAMA ,  Yutaka AKAIKE ,  Hiroaki KOMIYA ,  Yoshiyasu KATO

IPC: H05B1/02 ,  H05B3/22 ,  G01R31/28

Abstract: A method for adjusting a temperature of a substrate support is provided. In an apparatus for inspecting a target device, a substrate placement surface of the substrate support is divided into multiple regions and a heater is disposed in each of the multiple regions. The method comprises controlling the heater in a main region corresponding to the target device such that a temperature of the main region becomes a set temperature, and controlling the heater in a sub-region adjacent to the main region. When overshoot has not occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the main region and the sub-region becomes a predetermined value, and when overshoot has occurred, the heater of the sub-region is controlled such that a difference between the set temperature and the temperature in the sub-region becomes the predetermined value.

公开(公告)号：US20160054357A1

公开(公告)日：2016-02-25

申请号：US14781003

申请日：2014-03-18

Applicant: TOKYO ELECTRON LIMITED

Inventor： Eiichi SHINOHARA ,  Munetoshi NAGASAKA ,  Yoshiyasu KATO

IPC: G01R3/00 ,  G01R31/28 ,  G01R1/073

CPC classification number: G01R3/00 ,  G01R1/07342 ,  G01R31/2886 ,  G01R31/2887 ,  G01R31/2889

Abstract: A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other.

Abstract translation: 探针装置包括布置在安装台上方的电极板，用于安装半导体晶片并电连接到测试器，连接导体，布置在安装台的一侧并电连接到形成在安装台的安装表面上的安装台电极 安装台，以及包括用于研磨连接导体的接触部分的抛光单元的清洁机构，用于对接触部分进行擦刷的刷清洁单元，以及用于测量接触部分的接触电阻的接触电阻测量单元 接触部分。 安装台电极与半导体晶片的半导体器件的背面电极接触。 当连接导体连接到电极板时，形成在半导体器件的背面上的背面电极和测试器彼此电连接。