公开(公告)号：US20250161979A1

公开(公告)日：2025-05-22

申请号：US19033032

申请日：2025-01-21

Applicant: Tokyo Electron Limited

Inventor： Yusaku HASHIMOTO ,  Kodai YAGI ,  Yuki MATSUTAKE

IPC: B05D3/04 ,  H01L21/02 ,  H01L21/027

Abstract: A coating film forming method includes coating a coating liquid by supplying the same to a front surface of a substrate and rotating the substrate to form a coating film, supplying a high-temperature gas having a temperature higher than the substrate to an exposed region of a rear surface of the substrate, adjusting film thickness distribution of the coating film in a plane of the substrate by rotating the substrate at a first rotation speed, and drying, after the adjusting the film thickness distribution, the coating film by adjusting the film thickness of the coating film in an entire plane of the substrate by rotating the substrate at a second rotation speed different from the first rotation speed. A period in which the drying of the coating film is performed includes a period in which the supplying of the high-temperature gas to the substrate is stopped.

公开(公告)号：US20250112066A1

公开(公告)日：2025-04-03

申请号：US18899015

申请日：2024-09-27

Applicant: Tokyo Electron Limited

Inventor： Shinichi MIZUSHINO ,  Shunsuke INTO ,  Yuichiro KUNUGIMOTO ,  Akihiro TOYOZAWA ,  Daisuke ISHIMARU ,  Yuki MATSUTAKE ,  Shigeyuki IIDA ,  Takafumi HAYAMA

IPC: H01L21/67 ,  G02F1/29 ,  G03B13/34 ,  G03F7/16 ,  H01L21/66 ,  H04N23/56 ,  H04N23/60

Abstract: A liquid processing apparatus includes multiple stages on each of which a substrate is to be placed; multiple nozzles shared by the multiple stages, and each for supplying a processing liquid to the substrate; a camera shared by the multiple nozzles, and for monitoring states of the multiple nozzles; and an imaging condition changing program module for causing circuitry to change an imaging condition of the camera according to a monitoring condition.

公开(公告)号：US20230219116A1

公开(公告)日：2023-07-13

申请号：US18150818

申请日：2023-01-06

Applicant: Tokyo Electron Limited

Inventor： Yusaku HASHIMOTO ,  Kodai YAGI ,  Yuki MATSUTAKE

IPC: B05D3/04 ,  H01L21/02 ,  H01L21/027

CPC classification number: B05D3/0473 ,  H01L21/0206 ,  H01L21/0276

Abstract: A coating film forming method includes coating a coating liquid by supplying the same to a front surface of a substrate and rotating the substrate to form a coating film, supplying a high-temperature gas having a temperature higher than the substrate to an exposed region of a rear surface of the substrate, adjusting film thickness distribution of the coating film in a plane of the substrate by rotating the substrate at a first rotation speed, and drying, after the adjusting the film thickness distribution, the coating film by adjusting the film thickness of the coating film in an entire plane of the substrate by rotating the substrate at a second rotation speed different from the first rotation speed. A period in which the drying of the coating film is performed includes a period in which the supplying of the high-temperature gas to the substrate is stopped.