摘要:
One capacitor fabrication process of the invention comprises a noble metal layer formation step of forming a noble metal layer on one surface of a substrate, a dielectric layer formation step of forming a dielectric layer on the noble metal layer, a metal foil formation step of forming a metal foil of 10 μm or greater in thickness on the dielectric layer, a separation step of separating the noble metal layer from the dielectric layer at an interface, and an electrode layer formation step of forming an electrode layer on the second surface of the dielectric layer separated off by the separation step, wherein the second surface faces away from the first surface of the dielectric layer with the metal foil formed thereon.Another capacitor fabrication process of the invention comprises a separation layer formation step of forming a separation layer on one surface of a substrate, a dielectric layer formation step of forming a dielectric layer on the separation layer, a metal foil formation step of forming a metal foil of 10 μm or more in thickness on the dielectric layer, a separation step of separating the substrate from the separation layer at an interface, and an electrode layer formation step of forming an electrode layer on the second surface of the dielectric layer separated off by said separation step via the separation layer, wherein the second surface faces away from the first surface of said dielectric layer with the metal foil formed thereon. It is thus possible to obtain a thin-film capacitor at low costs and high yields that has an ever higher capacity, is so slimmed down in its entirety that it has a form well fit for being buried in a base board, and can be used even at high frequencies.
摘要:
One capacitor fabrication process including metal layer forming a metal layer on one surface of a substrate, dielectric layer forming a dielectric layer on the metal layer, metal foil forming a metal foil on the dielectric layer, separating the noble metal layer from the dielectric layer, and electrode layer forming an electrode layer on the second surface of the dielectric layer, wherein the second surface faces away from the first surface of the dielectric layer with the metal foil. Another capacitor fabrication process includes separation layer forming a separation layer on one surface of a substrate, dielectric layer forming a dielectric layer on the separation layer, metal foil forming a metal foil the dielectric layer, separating the substrate from the separation layer, and an electrode layer forming an electrode layer on the second surface of the dielectric layer, wherein the second surface faces away from the first surface of said dielectric layer with the metal foil. A thin-film capacitor has higher capacity, is so slimmed down and has a form well fit for being buried in a base board, and can be used even at high frequencies.
摘要:
One capacitor fabrication process including metal layer forming a metal layer on one surface of a substrate, dielectric layer forming a dielectric layer on the metal layer, metal foil forming a metal foil on the dielectric layer, separating the noble metal layer from the dielectric layer, and electrode layer forming an electrode layer on the second surface of the dielectric layer, wherein the second surface faces away from the first surface of the dielectric layer with the metal foil. Another capacitor fabrication process includes separation layer forming a separation layer on one surface of a substrate, dielectric layer forming a dielectric layer on the separation layer, metal foil forming a metal foil the dielectric layer, separating the substrate from the separation layer, and an electrode layer forming an electrode layer on the second surface of the dielectric layer, wherein the second surface faces away from the first surface of said dielectric layer with the metal foil. A thin-film capacitor has higher capacity, is so slimmed down and has a form well fit for being buried in a base board, and can be used even at high frequencies.
摘要:
One capacitor fabrication process of the invention comprises a noble metal layer formation step of forming a noble metal layer on one surface of a substrate, a dielectric layer formation step of forming a dielectric layer on the noble metal layer, a metal foil formation step of forming a metal foil of 10 μm or greater in thickness on the dielectric layer, a separation step of separating the noble metal layer from the dielectric layer at an interface, and an electrode layer formation step of forming an electrode layer on the second surface of the dielectric layer separated off by the separation step, wherein the second surface faces away from the first surface of the dielectric layer with the metal foil formed thereon. Another capacitor fabrication process of the invention comprises a separation layer formation step of forming a separation layer on one surface of a substrate, a dielectric layer formation step of forming a dielectric layer on the separation layer, a metal foil formation step of forming a metal foil of 10 μm or more in thickness on the dielectric layer, a separation step of separating the substrate from the separation layer at an interface, and an electrode layer formation step of forming an electrode layer on the second surface of the dielectric layer separated off by said separation step via the separation layer, wherein the second surface faces away from the first surface of said dielectric layer with the metal foil formed thereon. It is thus possible to obtain a thin-film capacitor at low costs and high yields that has an ever higher capacity, is so slimmed down in its entirety that it has a form well fit for being buried in a base board, and can be used even at high frequencies.
摘要:
A method of manufacturing a thin-film electronic device comprising providing a dielectric layer on a base, providing a first electrically conductive layer having a first opening and covering at least part of the dielectric layer; and forming a first through-hole extending through the base and communicating with the first opening. A second electrically conductive layer may be provided on the base, and a dielectric layer may be provided so as to cover at least part of this second conductive layer.
摘要:
A screen display apparatus is capable of visually presenting to a viewer E a secondary image 30 (virtual image and/or a real image) as an “inclined” a primary image (subject) 10, and is vertically inclined with respect to said viewer at a position, which is different from a position of said primary image 10. This is realized through an action of a lens 20. With the “inclination, the viewer E views the secondary image 30 with a three-dimensional feeling. The “inclination” is effective when the upper part of the secondary image 30 is located farther from the viewer E than the lower part thereof, and when its angle &thgr; is within a range of 3° to 40°. Further, a screen display apparatus, a plurality of secondary images 30 (in the figures, virtual images 31 and 32) on a primary image 10 as a subject are formed by a microlens array 20 including convex microlenses 221 and concave microlenses 223. The screen display apparatus visually presents those secondary images 30 to a viewer E so that those images are viewed as a single image. As a result, an image is displayed with an intensive three-dimensionally feeling.
摘要:
The invention provides a method for manufacturing a magnetic recording tape which is free from the problems of the phenomenon of dropout as well as runout of the tape roll throughout the life of the tape. The inventive method comprises providing a coating layer on a surface of a film base of the tape having been provided with the magnetic coating layer on the other surface with a coating composition comprising a radiation-sensitive curable polymeric material, which is a thermoplastic resin modified to be radiation-sensitive with or without admixture of a thermoplastic elastomer, and a filler dispersed therein and, prior to winding of the tape into a roll, irradiating the coating layer with a high energy radiation of, preferably, electron beams whereby the coating composition is fully radiation-cured to form a backing layer of the tape.
摘要:
A capacitor comprises: a lower electrode formed of a foil made of a polycrystalline metal; an upper conductor layer; and a dielectric layer disposed between the lower electrode and the upper electrode layer. Grain boundaries of the polycrystalline metal appear at the top surface of the lower electrode. The capacitor further comprises an insulator that is disposed between the top surface of the dielectric layer and the bottom surface of the upper electrode layer and that is present only in part of a region in which the top surface of the dielectric layer and the bottom surface of the upper electrode layer face each other. The insulator is disposed to cover at least part of the grain boundaries appearing at the top surface of the lower electrode when seen from above the top surface of the dielectric layer. The insulator is formed by electrophoresis.
摘要:
This invention provides a magnetic recording medium with excellent electromagnetic characteristics and running durability. According to the invention, a magnetic powder is kneaded with a cross-linkable or polymerizable resin binder, together with a phosphoric ester having a polymerizable, unsaturated double bond or bonds, the resulting coating material is applied to a substrate, and then the coating is cross-linked or polymerized. The addition of the phosphoric ester in place of an ordinary dispersing agent improves the mechanical properties of the magnetic coating and the durability and running quality of the magnetic recording medium.
摘要:
In a magnetic recording medium made by applying a non-magnetic undercoat and a magnetic top coat on a base, the undercoat comprises a radiation-curable coating material which contains a compound with a molecular weight of not less than 400, having one type of double bond selected from among acrylic, allylic, and maleic double bonds, the undercoat being formed by exposure to radiation. Specifically, the undercoating material contains at least two types of compounds selected from (A) those having a molecular weight of over 5000, preferably over 8000 and having two or more double bonds selected as above, (B) those having a molecular weight of 400 or more but less than 500, preferably in the range of 600 to 3000, and two or more double bonds selected as above, and (C) those having a molecular weight of less than 400 and one or more double bonds selected from among acrylic, allylic, maleic, and styrenic double bonds. At least two types of the compounds are used in a mixing ratio of 0-90 wt % (A), 0-80 wt % (B), and 0-50 wt % wt % (C).