SOLID-STATE IMAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SOLID-STATE IMAGE DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    固态图像装置及其制造方法

    公开(公告)号:US20110115955A1

    公开(公告)日:2011-05-19

    申请号:US13006936

    申请日:2011-01-14

    IPC分类号: H04N5/335 H01L31/0224

    摘要: An object of the present invention is to provide a solid-state image device that can effectively dissipate heat. In order to attain the object, the solid-state image device of the present invention includes non-through heat dissipation portions (7) provided on a semiconductor substrate (2). The non-through heat dissipation portion (7) is made up of a non-through hole and a metal embedded in the non-through hole. The non-through hole has one open end on one of the surfaces of the semiconductor substrate (2), extends from the one surface toward the other surface of the semiconductor substrate (2), and has the other end between the surfaces of the semiconductor substrate (2). The non-through heat dissipation portions (7) act as heat dissipation paths.

    摘要翻译: 本发明的目的是提供一种可以有效散热的固态图像装置。 为了实现该目的,本发明的固态成像装置包括设置在半导体基板(2)上的非贯穿散热部(7)。 非通过散热部(7)由非通孔和嵌入在非贯通孔中的金属构成。 非贯通孔在半导体衬底(2)的一个表面上具有一个开口端,从半导体衬底(2)的一个表面向另一个表面延伸,另一端位于半导体衬底 基板(2)。 非通过散热部(7)作为散热路径。

    SOLID STATE IMAGING DEVICE
    2.
    发明申请
    SOLID STATE IMAGING DEVICE 有权
    固态成像装置

    公开(公告)号:US20110284929A1

    公开(公告)日:2011-11-24

    申请号:US13198240

    申请日:2011-08-04

    IPC分类号: H01L27/148

    CPC分类号: H01L27/1463 H01L27/14654

    摘要: In each of pixels 10 arranged in an array pattern, an insulating isolation part 22 electrically isolates adjacent photoelectric conversion elements 11, and the photoelectric conversion element 11 and an amplifier transistor 14. The insulating isolation part 22 constitutes a first region A between the photoelectric conversion elements 11 where the amplifier transistor 14 is not arranged, and a second region B between the photoelectric conversion elements 11 where the amplifier transistor 14 is arranged. A low concentration first isolation diffusion layer 23 is formed below the insulating isolation part 22 constituting the first region A, and a high concentration second isolation diffusion layer 24 and a low concentration first isolation diffusion layer 23 are formed below the insulating isolation part 22 constituting the second region B. A source/drain region of the amplifier transistor 14 in the second region B is formed in a well region 25 formed simultaneously with the second isolation diffusion layer 24.

    摘要翻译: 在排列成阵列图形的像素10的每一个中,绝缘隔离部分22电隔离相邻的光电转换元件11和光电转换元件11和放大器晶体管14.绝缘隔离部分22构成光电转换 未布置放大器晶体管14的元件11和布置放大器晶体管14的光电转换元件11之间的第二区域B. 在构成第一区域A的绝缘隔离部分22的下方形成低浓度第一隔离扩散层23,在绝缘隔离部分22的下方形成高浓度第二隔离扩散层24和低浓度第一隔离扩散层23 第二区域B中的放大器晶体管14的源极/漏极区域形成在与第二隔离扩散层24同时形成的阱区域25中。

    SOLID STATE IMAGING DEVICE
    3.
    发明申请
    SOLID STATE IMAGING DEVICE 有权
    固态成像装置

    公开(公告)号:US20110291162A1

    公开(公告)日:2011-12-01

    申请号:US13198451

    申请日:2011-08-04

    IPC分类号: H01L27/148

    摘要: Each of pixels 10 arranged in an array pattern includes a photoelectric conversion element 11, a transfer transistor 13 for transferring charges to a floating diffusion layer 12, and an amplifier transistor 14 for outputting the transferred charges to an output line. An insulating isolation part 22 isolates the adjacent photoelectric conversion elements 11, and isolates the photoelectric conversion element 11 and the amplifier transistor 14. The insulating isolation part 22 constitutes a first region A between the photoelectric conversion elements 11 where the amplifier transistor 14 is not arranged, and a second region B between the photoelectric conversion elements 11 where the amplifier transistor 14 is arranged. First and second isolation diffusion layers 23 and 24 are formed below the insulating isolation part 22, and the second isolation diffusion layer 24 is wider than the first isolation diffusion layer 23 in the first region A.

    摘要翻译: 排列成阵列图案的像素10中的每一个包括光电转换元件11,用于将电荷转移到浮动扩散层12的转移晶体管13和用于将转移的电荷输出到输出线的放大器晶体管14。 绝缘隔离部分22隔离相邻的光电转换元件11,并隔离光电转换元件11和放大晶体管14.隔离隔离部分22构成放大晶体管14未布置的光电转换元件11之间的第一区域A 以及布置有放大晶体管14的光电转换元件11之间的第二区域B. 第一和第二隔离扩散层23和24形成在绝缘隔离部22的下方,第二隔离扩散层24比第一区域A中的第一隔离扩散层23宽。

    Solid state imaging device
    4.
    发明授权
    Solid state imaging device 有权
    固态成像装置

    公开(公告)号:US08592874B2

    公开(公告)日:2013-11-26

    申请号:US13198240

    申请日:2011-08-04

    IPC分类号: H01L27/148 H01L29/768

    CPC分类号: H01L27/1463 H01L27/14654

    摘要: In each of pixels 10 arranged in an array pattern, an insulating isolation part 22 electrically isolates adjacent photoelectric conversion elements 11, and the photoelectric conversion element 11 and an amplifier transistor 14. The insulating isolation part 22 constitutes a first region A between the photoelectric conversion elements 11 where the amplifier transistor 14 is not arranged, and a second region B between the photoelectric conversion elements 11 where the amplifier transistor 14 is arranged. A low concentration first isolation diffusion layer 23 is formed below the insulating isolation part 22 constituting the first region A, and a high concentration second isolation diffusion layer 24 and a low concentration first isolation diffusion layer 23 are formed below the insulating isolation part 22 constituting the second region B. A source/drain region of the amplifier transistor 14 in the second region B is formed in a well region 25 formed simultaneously with the second isolation diffusion layer 24.

    摘要翻译: 在排列成阵列图形的像素10的每一个中,绝缘隔离部分22电隔离相邻的光电转换元件11和光电转换元件11和放大器晶体管14.绝缘隔离部分22构成光电转换 未布置放大器晶体管14的元件11和布置放大器晶体管14的光电转换元件11之间的第二区域B. 在构成第一区域A的绝缘隔离部分22的下方形成低浓度第一隔离扩散层23,在绝缘隔离部分22的下方形成高浓度第二隔离扩散层24和低浓度第一隔离扩散层23 第二区域B中的放大器晶体管14的源极/漏极区域形成在与第二隔离扩散层24同时形成的阱区域25中。

    Solid state imaging device including source/drain region of amplifier transistor being disposed in isolation diffusion layer
    5.
    发明授权
    Solid state imaging device including source/drain region of amplifier transistor being disposed in isolation diffusion layer 有权
    包括放大晶体管的源极/漏极区域的固态成像装置设置在隔离扩散层中

    公开(公告)号:US08471351B2

    公开(公告)日:2013-06-25

    申请号:US13198451

    申请日:2011-08-04

    摘要: Each of pixels 10 arranged in an array pattern includes a photoelectric conversion element 11, a transfer transistor 13 for transferring charges to a floating diffusion layer 12, and an amplifier transistor 14 for outputting the transferred charges to an output line. An insulating isolation part 22 isolates the adjacent photoelectric conversion elements 11, and isolates the photoelectric conversion element 11 and the amplifier transistor 14. The insulating isolation part 22 constitutes a first region A between the photoelectric conversion elements 11 where the amplifier transistor 14 is not arranged, and a second region B between the photoelectric conversion elements 11 where the amplifier transistor 14 is arranged. First and second isolation diffusion layers 23 and 24 are formed below the insulating isolation part 22, and the second isolation diffusion layer 24 is wider than the first isolation diffusion layer 23 in the first region A.

    摘要翻译: 排列成阵列图案的像素10中的每一个包括光电转换元件11,用于将电荷转移到浮动扩散层12的转移晶体管13和用于将转移的电荷输出到输出线的放大器晶体管14。 绝缘隔离部分22隔离相邻的光电转换元件11,并隔离光电转换元件11和放大晶体管14.隔离隔离部分22构成放大晶体管14未布置的光电转换元件11之间的第一区域A 以及布置有放大晶体管14的光电转换元件11之间的第二区域B. 第一和第二隔离扩散层23和24形成在绝缘隔离部22的下方,第二隔离扩散层24比第一区域A中的第一隔离扩散层23宽。

    Solid state imaging apparatus and method for fabricating the same
    7.
    发明授权
    Solid state imaging apparatus and method for fabricating the same 有权
    固态成像装置及其制造方法

    公开(公告)号:US07800144B2

    公开(公告)日:2010-09-21

    申请号:US12233080

    申请日:2008-09-18

    IPC分类号: H01L31/062 H01L31/113

    摘要: A semiconductor device of the present invention includes a substrate; an imaging region which is formed at part of the substrate and in which photoelectric conversion cells including photoelectric conversion sections are arranged in the form of an array; a control-circuit region which is formed at part of the substrate and in which the imaging region is controlled and a signal from the imaging region is outputted; and a copper-containing interconnect layer formed above the substrate and made of a material containing copper. Furthermore, a first anti-diffusion layer and a second anti-diffusion layer are formed, as anti-diffusion layers for preventing the copper from diffusing into each photoelectric conversion section, on the photoelectric conversion section and the copper-containing interconnect layer, respectively.

    摘要翻译: 本发明的半导体器件包括:衬底; 在基板的一部分形成的成像区域,其中包含光电转换部分的光电转换单元以阵列的形式排列; 形成在基板的一部分并且成像区域被控制并且来自成像区域的信号被输出的控制电路区域; 以及形成在基板上方并由含有铜的材料制成的含铜互连层。 此外,分别在光电转换部和含铜互连层上形成第一防扩散层和第二防扩散层,作为用于防止铜扩散到每个光电转换部中的防扩散层。

    SOLID STATE IMAGING APPARATUS AND METHOD FOR FABRICATING THE SAME
    8.
    发明申请
    SOLID STATE IMAGING APPARATUS AND METHOD FOR FABRICATING THE SAME 有权
    固态成像装置及其制造方法

    公开(公告)号:US20090014759A1

    公开(公告)日:2009-01-15

    申请号:US12233080

    申请日:2008-09-18

    IPC分类号: H01L31/113

    摘要: A semiconductor device of the present invention includes a substrate; an imaging region which is formed at part of the substrate and in which photoelectric conversion cells including photoelectric conversion sections are arranged in the form of an array; a control-circuit region which is formed at part of the substrate and in which the imaging region is controlled and a signal from the imaging region is outputted; and a copper-containing interconnect layer formed above the substrate and made of a material containing copper. Furthermore, a first anti-diffusion layer and a second anti-diffusion layer are formed, as anti-diffusion layers for preventing the copper from diffusing into each photoelectric conversion section, on the photoelectric conversion section and the copper-containing interconnect layer, respectively.

    摘要翻译: 本发明的半导体器件包括:衬底; 在基板的一部分形成的成像区域,其中包含光电转换部分的光电转换单元以阵列的形式排列; 形成在基板的一部分并且成像区域被控制并且来自成像区域的信号被输出的控制电路区域; 以及形成在基板上方并由含有铜的材料制成的含铜互连层。 此外,分别在光电转换部和含铜互连层上形成第一防扩散层和第二防扩散层,作为用于防止铜扩散到每个光电转换部中的防扩散层。

    Optical filter module and manufacturing method thereof
    9.
    发明授权
    Optical filter module and manufacturing method thereof 失效
    光滤波器组件及其制造方法

    公开(公告)号:US07039279B2

    公开(公告)日:2006-05-02

    申请号:US10471419

    申请日:2002-10-02

    IPC分类号: G02B6/30

    摘要: An optical filter module of the present invention has a flat substrate, an optical path formed on the flat substrate; a filter insertion groove provided, crossing the optical path, on the flat substrate; a multilayer filter inserted, dividing the optical path, into the filter insertion groove; and a pair of covers disposed on the flat substrate so as to sandwich the multilayer filter. The present invention enables the omission of the process of adjustment of the optical axis, thus achieving high operability. At the same time, the present invention ensures fixing and mounting of the multilayer filter even if the multilayer filter is warped.

    摘要翻译: 本发明的滤光器模块具有平坦的基板,形成在平坦基板上的光路; 设置在所述平坦基板上的与所述光路交叉的过滤器插入槽; 将光路分割成过滤器插入槽的多层过滤器; 以及设置在平坦基板上以夹持多层过滤器的一对盖。 本发明能够省略光轴的调整过程,从而实现高可操作性。 同时,即使多层过滤器发生翘曲,本发明确保了多层过滤器的固定和安装。

    Low alloy steel having good stress corrosion cracking resistance
    10.
    发明授权
    Low alloy steel having good stress corrosion cracking resistance 失效
    低合金钢具有良好的抗应力腐蚀开裂性能

    公开(公告)号:US4820486A

    公开(公告)日:1989-04-11

    申请号:US846102

    申请日:1986-03-31

    IPC分类号: C22C38/44

    CPC分类号: C22C38/44

    摘要: The present invention relates to low alloy steel and specifically to nickel-chrome-molybdenum steel.A low alloy steel having excellent stress corrosion cracking resistance containing C:.ltoreq.0.40%, Si:.ltoreq.0.15%, Mn:.ltoreq.0.20%, P:.ltoreq.0.010%, S:.ltoreq.0.030%, Ni: 0.50 to 4.00%, Cr: 0.50 to 2.50%, Mo: 0.25 to 4.00% and V:.ltoreq.0.30%, said Si, Mn and P being fulfilled with relationship of Si+Mn+20P.ltoreq.0.30%, the remainder comprising Fe and unavoidable impurities, the prior austenite crystal grain size being in excess of 4 of ASTM crystal grain size number.

    摘要翻译: 本发明涉及低合金钢,特别涉及镍铬钼钢。 具有优异的耐应力腐蚀开裂性的低合金钢含有C:<0.40%,Si:0.15%,Mn:<0.20%,P:0.010%,S:0.030% ,Ni:0.50〜4.00%,Cr:0.50〜2.50%,Mo:0.25〜4.00%,V:<0.30%,所述Si,Mn和P的关系满足Si + Mn +20P≤0.30 %,其余为Fe和不可避免的杂质,原奥氏体晶粒尺寸超过ASTM晶粒尺寸数的4。