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    NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME
    1.
    发明申请
    NOVEL SILICON-CONTAINING ALICYCLIC POLYIMIDE RESIN, POLYAMIC ACID RESIN, AND MANUFACTURING METHOD FOR SAME 有权
    新型含硅聚合物聚酰胺树脂，聚酰胺树脂及其制造方法

    公开(公告)号：US20130158225A1

    公开(公告)日：2013-06-20

    申请号：US13583727

    申请日：2011-04-13

    申请人： Tooru Kikuchi ,  Toshihiko Takasaki ,  Katsuyuki Masuda

    发明人： Tooru Kikuchi ,  Toshihiko Takasaki ,  Katsuyuki Masuda

    IPC分类号： C08G73/10 ,  C08G69/42

    CPC分类号： C08G73/106 ,  C08G69/42 ,  C08G73/105 ,  C08G73/1075 ,  C08G73/1078 ,  C08G77/455

    摘要： A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.

    摘要翻译： 包含由式（1）表示的重复单元的聚酰亚胺树脂：其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数， 与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型，和包含由式（2）表示的重复单元的聚酰胺酸树脂：其中R是二胺残基; m为2〜30的整数， 与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的酰胺基和羧基中的任一个相对于降冰片烷环具有外部构型。 聚酰亚胺树脂可溶于通用溶剂，透明度高，分子量高，机械性能优异，拉伸强度和伸长率优异。

    NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF
    2.
    发明申请
    NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF 有权
    新型液体四羧酸二糖及其制备方法

    公开(公告)号：US20110301362A1

    公开(公告)日：2011-12-08

    申请号：US13202067

    申请日：2009-12-08

    申请人： Tooru Kikuchi ,  Hayato Kotani ,  Katsuyuki Masuda ,  Toshihiko Takasaki

    发明人： Tooru Kikuchi ,  Hayato Kotani ,  Katsuyuki Masuda ,  Toshihiko Takasaki

    IPC分类号： C07D307/77

    CPC分类号： C07F7/0838

    摘要： The invention relates to a tetracarboxylic dianhydride represented by the following formula (1). [In formula (1) R1, R2, R3 and R4 each independently represent an alkyl group having from 1 to 5 carbon atoms, m represents a number from 1 to 30, all of the silicon atoms bonding to the norbornane rings are in an exo-configuration with respect to the norbornane rings, and all of the dicarboxylic anhydride groups bonding to the norbornane rings are in an exo-configuration with respect to the norbornane rings.]

    摘要翻译： 本发明涉及由下式（1）表示的四羧酸二酐。 [式（1）中，R 1，R 2，R 3和R 4各自独立地表示碳原子数1〜5的烷基，m表示1〜30的数，与降冰片烷环结合的全部硅原子为外 - 关于降冰片烷环的结构，并且与降冰片烷环结合的所有二羧酸酐基都相对于降冰片烷环具有外部构型。

    Liquid tetracarboxylic dianhydrides and process for the preparation thereof
    3.
    发明授权
    Liquid tetracarboxylic dianhydrides and process for the preparation thereof 有权
    液体四羧酸二酐及其制备方法

    公开(公告)号：US08524921B2

    公开(公告)日：2013-09-03

    申请号：US13202067

    申请日：2009-12-08

    申请人： Tooru Kikuchi ,  Hayato Kotani ,  Katsuyuki Masuda ,  Toshihiko Takasaki

    发明人： Tooru Kikuchi ,  Hayato Kotani ,  Katsuyuki Masuda ,  Toshihiko Takasaki

    IPC分类号： C07D493/00 ,  C07D307/77 ,  C07F7/08

    CPC分类号： C07F7/0838

    摘要： The invention relates to a tetracarboxylic dianhydride represented by the following formula (1). [In formula (1) R1, R2, R3 and R4 each independently represent an alkyl group having from 1 to 5 carbon atoms, m represents a number from 1 to 30, all of the silicon atoms bonding to the norbornane rings are in an exo-configuration with respect to the norbornane rings, and all of the dicarboxylic anhydride groups bonding to the norbornane rings are in an exo-configuration with respect to the norbornane rings.]

    摘要翻译： 本发明涉及由下式（1）表示的四羧酸二酐。 [式（1）中，R 1，R 2，R 3和R 4各自独立地表示碳原子数1〜5的烷基，m表示1〜30的数，与降冰片烷环结合的全部硅原子为外 - 关于降冰片烷环的结构，并且与降冰片烷环结合的所有二羧酸酐基都相对于降冰片烷环具有外部构型。

    Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same
    4.
    发明授权
    Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same 有权
    含硅脂环族聚酰亚胺树脂，聚酰胺酸树脂及其制造方法

    公开(公告)号：US08592546B2

    公开(公告)日：2013-11-26

    申请号：US13583727

    申请日：2011-04-13

    申请人： Tooru Kikuchi ,  Toshihiko Takasaki ,  Katsuyuki Masuda

    发明人： Tooru Kikuchi ,  Toshihiko Takasaki ,  Katsuyuki Masuda

    IPC分类号： C08G77/452

    CPC分类号： C08G73/106 ,  C08G69/42 ,  C08G73/105 ,  C08G73/1075 ,  C08G73/1078 ,  C08G77/455

    摘要： A polyimide resin including repeating units represented by formula (1): wherein R is a diamine residue or a diisocyanate residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of imide rings bonded to the norbornane rings is in exo configuration with respect to the norbornane rings, and a polyamic acid resin including repeating units represented by formula (2): wherein R is a diamine residue; m is an integer of 2 to 30; any of silicon atoms bonded to norbornane rings is in exo configuration with respect to the norbornane rings; and any of amide groups and carboxyl groups bonded to the norbornane rings is in exo configuration with respect to the norbornane rings. The polyimide resin is soluble in general-purpose solvents, has a good transparency and a high molecular weight, and is excellent in mechanical properties, such as tensile strength and elongation.

    摘要翻译： 包含由式（1）表示的重复单元的聚酰亚胺树脂：其中R是二胺残基或二异氰酸酯残基; m为2〜30的整数， 与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 并且与降冰片烷环结合的任何酰亚胺环相对于降冰片烷环为外部构型，和包含由式（2）表示的重复单元的聚酰胺酸树脂：其中R是二胺残基; m为2〜30的整数， 与降冰片烷环结合的任何硅原子相对于降冰片烷环都处于外部构型; 与降冰片烷环结合的酰胺基和羧基中的任何一个相对于降冰片烷环都处于外部构型。 聚酰亚胺树脂可溶于通用溶剂，透明度高，分子量高，机械性能优异，拉伸强度和伸长率优异。

    Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, and photosensitive resin cured product
    5.
    发明授权
    Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, and photosensitive resin cured product 失效
    感光树脂组合物，感光性树脂清漆，感光性树脂膜，感光性树脂固化物

    公开(公告)号：US08604096B2

    公开(公告)日：2013-12-10

    申请号：US13512713

    申请日：2010-11-29

    申请人： Kouji Suzumura ,  Ikue Mitani ,  Toshihiko Takasaki ,  Ikuo Mukai ,  Masami Ochiai

    发明人： Kouji Suzumura ,  Ikue Mitani ,  Toshihiko Takasaki ,  Ikuo Mukai ,  Masami Ochiai

    IPC分类号： C08F2/46 ,  C08F2/50 ,  C08B37/00 ,  B29C71/04 ,  C08J3/28 ,  C08G61/04

    CPC分类号： G02B1/10 ,  C08L63/10 ,  C09D7/48 ,  G03F7/027 ,  G03F7/029

    摘要： Provided are a photosensitive resin composition capable of being quickly cured by light and providing an optically cured product which is excellent in a transparency in a visible light of 400 to 780 nm and a heat resistant reliability, a photosensitive resin varnish, a photosensitive resin film and a photosensitive resin cured product.The photosensitive resin composition comprises (A) a polymerizable compound, (B) a polymerization initiator and (C) a hindered phenol base antioxidant, wherein (B-1) at least one selected from α-hydroxyacetophenone base photoinitiator and a glyoxy ester base photoinitiator and (B-2) a phosphine oxide base photoinitiator are contained as the component (B); the component (C) is a hindered phenol base antioxidant having in a molecule, at least one phenol group having each one group of a methyl group and a t-butyl group on the same aromatic ring; a content of the component (B) is 0.02 to 4.0 parts by mass based on 100 parts by mass of the component (A); and a content of the component (C) is 0.01 to 1 part by mass based on 100 parts by mass of the component (A).

    摘要翻译： 本发明提供能够快速固化的光敏树脂组合物，并提供在400〜780nm的可见光和耐热可靠性的透明性优异的光固化物中，感光性树脂清漆，感光性树脂膜和 感光性树脂固化物。 感光性树脂组合物包含（A）可聚合化合物，（B）聚合引发剂和（C）受阻酚基抗氧化剂，其中（B-1）选自α-羟基苯乙酮基光引发剂和糖基酯基光引发剂中的至少一种 和（B-2）作为组分（B）的氧化膦基光引发剂; 成分（C）是在同一芳环上具有分子中至少一个具有甲基和叔丁基一个基团的至少一个苯酚基的受阻酚基抗氧化剂; 相对于成分（A）100质量份，成分（B）的含量为0.02〜4.0质量份。 相对于100质量份的成分（A），成分（C）的含量为0.01〜1质量份。

    RESIN COMPOSITION FOR FORMING OPTICAL WAVEGUIDE, RESIN FILM FOR FORMING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE
    6.
    发明申请
    RESIN COMPOSITION FOR FORMING OPTICAL WAVEGUIDE, RESIN FILM FOR FORMING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE 失效
    形成光波导的树脂组合物，形成光波导的树脂膜和光波导

    公开(公告)号：US20120076468A1

    公开(公告)日：2012-03-29

    申请号：US13266857

    申请日：2010-04-28

    申请人： Tatsuya Makino ,  Toshihiko Takasaki ,  Masami Ochiai ,  Atsushi Takahashi

    发明人： Tatsuya Makino ,  Toshihiko Takasaki ,  Masami Ochiai ,  Atsushi Takahashi

    IPC分类号： G02B6/00 ,  C08K5/5397 ,  C08K5/07

    CPC分类号： G02B6/1221 ,  C08F283/065 ,  C08F290/142 ,  C08G59/1461 ,  C08G2261/12 ,  C08G2650/48 ,  C08L63/00 ,  C08L71/00 ,  C08L2205/05 ,  G02B6/138 ,  C08L2666/04 ,  C08L33/08

    摘要： [Problem] Provided include: a resin composition for forming an optical waveguide, the resin composition having high productivity and being capable forming a thick film with high accuracy excellent in transparency, heat resistance and toughness; a resin film for forming an optical waveguide; and an optical waveguide excellent in transparency, environmental reliability and heat resistance.[Means for Solution] A resin composition for forming an optical waveguide, containing (A) a polyhydroxy polyether having an ethylenically unsaturated group on a side chain and an aromatic ring on a main chain, (B) a polymerizable compound having an ethylenically unsaturated group, and (C) a radical polymerization initiator; a resin film for forming an optical waveguide; and an optical waveguide having a core part formed by using the resin film for forming an optical waveguide.

    摘要翻译： [问题]提供了一种用于形成光波导的树脂组合物，该树脂组合物具有高生产率并且能够以高精度形成厚膜，透明度，耐热性和韧性优异; 用于形成光波导的树脂膜; 以及透明性，环境可靠性和耐热性优异的光波导。 [解决方案]一种用于形成光波导的树脂组合物，其包含（A）在侧链上具有烯属不饱和基团的多羟基聚醚和主链上的芳环，（B）具有烯键式不饱和基团的可聚合化合物 ，（C）自由基聚合引发剂; 用于形成光波导的树脂膜; 以及具有通过使用用于形成光波导的树脂膜形成的芯部的光波导。

    PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, AND PHOTOSENSITIVE RESIN CURED PRODUCT
    8.
    发明申请
    PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN VARNISH, PHOTOSENSITIVE RESIN FILM, AND PHOTOSENSITIVE RESIN CURED PRODUCT 失效
    感光树脂组合物，感光树脂变性，感光树脂薄膜和感光树脂固化产品

    公开(公告)号：US20120270963A1

    公开(公告)日：2012-10-25

    申请号：US13512713

    申请日：2010-11-29

    申请人： Kouji Suzumura ,  Ikue Mitani ,  Toshihiko Takasaki ,  Ikuo Mukai ,  Masami Ochiai

    发明人： Kouji Suzumura ,  Ikue Mitani ,  Toshihiko Takasaki ,  Ikuo Mukai ,  Masami Ochiai

    IPC分类号： C08L33/14

    CPC分类号： G02B1/10 ,  C08L63/10 ,  C09D7/48 ,  G03F7/027 ,  G03F7/029

    摘要： Provided are a photosensitive resin composition capable of being quickly cured by light and providing an optically cured product which is excellent in a transparency in a visible light of 400 to 780 nm and a heat resistant reliability, a photosensitive resin varnish, a photosensitive resin film and a photosensitive resin cured product.The photosensitive resin composition comprises (A) a polymerizable compound, (B) a polymerization initiator and (C) a hindered phenol base antioxidant, wherein (B-1) at least one selected from α-hydroxyacetophenone base photoinitiator and a glyoxy ester base photoinitiator and (B-2) a phosphine oxide base photoinitiator are contained as the component (B); the component (C) is a hindered phenol base antioxidant having in a molecule, at least one phenol group having each one group of a methyl group and a t-butyl group on the same aromatic ring; a content of the component (B) is 0.02 to 4.0 parts by mass based on 100 parts by mass of the component (A); and a content of the component (C) is 0.01 to 1 part by mass based on 100 parts by mass of the component (A).

    摘要翻译： 本发明提供能够快速固化的光敏树脂组合物，并提供在400〜780nm的可见光和耐热可靠性的透明性优异的光固化物中，感光性树脂清漆，感光性树脂膜和 感光性树脂固化物。 感光性树脂组合物包含（A）可聚合化合物，（B）聚合引发剂和（C）受阻酚基抗氧化剂，其中（B-1）选自α-羟基苯乙酮基光引发剂和糖基酯基光引发剂中的至少一种 和（B-2）作为组分（B）的氧化膦基光引发剂; 成分（C）是在同一芳环上具有分子中至少一个具有甲基和叔丁基一个基团的至少一个苯酚基的受阻酚基抗氧化剂; 相对于成分（A）100质量份，成分（B）的含量为0.02〜4.0质量份。 相对于100质量份的成分（A），成分（C）的含量为0.01〜1质量份。