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公开(公告)号:US07128255B2
公开(公告)日:2006-10-31
申请号:US10445027
申请日:2003-05-27
申请人: Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
发明人: Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
IPC分类号: B23K1/06
CPC分类号: G11B5/4853 , G11B5/4826 , Y10T29/49027 , Y10T29/4903
摘要: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.
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公开(公告)号:US06751061B2
公开(公告)日:2004-06-15
申请号:US10417168
申请日:2003-04-17
申请人: Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
发明人: Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
IPC分类号: G11B560
CPC分类号: G11B5/4853 , G11B5/4826 , Y10T29/49027 , Y10T29/4903
摘要: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.
摘要翻译: 本发明提供一种磁头结构,连接方法和连接装置,通过该磁头结构,连接方法和连接装置,可以通过使用背负式系统的磁头中的挠性件上的芯电极和基板接合面之间进行优良的电连接。 为了达到感兴趣的目的,在本发明中,在芯部和挠曲部之间设置微调致动器, 在所述芯部设置有从所述挠曲部观察时从所述微调节致动器突出的突出部; 在所述弯曲部上对应于所述突出部设置孔, 只有芯部由通过孔部分提供的支撑部分和夹紧销固定,而不对微调致动器施加任何负载; 并且在保持该固定状态的同时,用导线将电极和基板焊盘彼此接合。
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公开(公告)号:US06600630B2
公开(公告)日:2003-07-29
申请号:US09767228
申请日:2001-01-23
申请人: Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
发明人: Toru Mizuno , Kouji Tanaka , Satoshi Yamaguchi
IPC分类号: G11B560
CPC分类号: G11B5/4853 , G11B5/4826 , Y10T29/49027 , Y10T29/4903
摘要: The present invention provides a magnetic head construction, a connection method and a connecting device by which excellent electrical connection can be carried out between a core electrode and a substrate land face on a flexure in a magnetic head employing the piggy back system. In order to attain the object of interest, in the present invention, a fine adjustment actuator is arranged between a core and a flexure; a projection portion which is projected from the fine adjustment actuator when viewed from the flexure is provided in the core; a hole is provided in the position, on the flexure, corresponding to the projection portion; only the core is fixed by a support portion provided through the hole portion and a clamp pin without applying any load to the fine adjustment actuator; and while maintaining this fixing state, an electrode and a substrate land are bonded to each other with a wire.
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公开(公告)号:US07276673B2
公开(公告)日:2007-10-02
申请号:US10947294
申请日:2004-09-23
申请人: Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人: Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号: B23K26/00
CPC分类号: H05K3/3494 , B23K1/0056 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K2203/041 , H05K2203/107
摘要: A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
摘要翻译: 提供焊料接合方法和焊接接合装置,其中焊料熔化,并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热,使得电极部分之间的温度差 并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。 焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。 在熔融之前将焊料供应到电极部分之后,激光照射到焊料和焊料周围的电极部分。 焊料熔化,电极部分被加热。 因此焊料相对于电极部的润湿性提高,可以提高电极部之间的电连接的可靠性。
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公开(公告)号:US07164097B2
公开(公告)日:2007-01-16
申请号:US10936747
申请日:2004-09-09
申请人: Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
发明人: Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
IPC分类号: B23K1/005
CPC分类号: B23K1/0056 , B23K1/0016 , B23K3/0623 , B23K2101/36 , H01L2224/11003 , H01L2224/11334 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要: Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.
摘要翻译: 提供了一种焊球接合方法和焊球接合装置,用于通过熔化焊球进行形成在待接合物体上的多个电极部分的接合。 通过使用跟随待接合物体的电极部分的多个吸嘴来吸引焊球,并将其输送到电极部分上。 然后,在吸引喷嘴上方的激光照射部分沿吸引喷嘴排列的方向移动,同时通过使用激光照射部分通过吸嘴的吸入口的激光照射焊球。 因此,可以仅使用单个激光照射部来熔化电极部上的多个焊球。
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公开(公告)号:US07357295B2
公开(公告)日:2008-04-15
申请号:US10933389
申请日:2004-09-03
申请人: Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
发明人: Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
CPC分类号: B23K3/0623 , H05K3/3478
摘要: After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.
摘要翻译: 在将料斗中的焊球引入球分离器的接收孔中之后,球分离器在块之间滑动,并将焊球送出到块外部的部分。 通过在焊球被放入接收孔中并且包围已经被引入到接收孔中的焊球的滚动轨迹时,从位于接收孔内部的下部块上的投影区域内吸入焊球 接收孔,焊球被强制引入接收孔。
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公开(公告)号:US20050051521A1
公开(公告)日:2005-03-10
申请号:US10936747
申请日:2004-09-09
申请人: Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
发明人: Osamu Shindo , Toru Mizuno , Youichi Andoh , Satoshi Yamaguchi
IPC分类号: B23K1/00 , B23K1/005 , B23K3/00 , B23K3/06 , B23K31/02 , B23K101/36 , G11B5/60 , G11B21/21 , H01L21/60 , H05K3/34
CPC分类号: B23K1/0056 , B23K1/0016 , B23K3/0623 , B23K2101/36 , H01L2224/11003 , H01L2224/11334 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要: Provided are a solder ball bonding method and a solder ball bonding device for performing bonding of a plurality of electrode portions formed on objects to be bonded by melting solder balls. The solder balls are suctioned by using a plurality of suction nozzles that follow the electrode portions of the objects to be bonded, and conveyed onto the electrode portions. A laser irradiation portion that is positioned above the suction nozzles is then moved in a direction along which the suction nozzles are arranged, while the solder balls are irradiated with laser light passing through suction openings of the suction nozzles by using the laser irradiation portion. Accordingly, it is possible to melt the plurality of solder balls on the electrode portions by using only a single laser irradiation portion.
摘要翻译: 提供了一种焊球接合方法和焊球接合装置,用于通过熔化焊球进行形成在待接合物体上的多个电极部分的接合。 通过使用跟随待接合物体的电极部分的多个吸嘴来吸引焊球,并将其输送到电极部分上。 然后,在吸引喷嘴上方的激光照射部分沿吸引喷嘴排列的方向移动,同时通过使用激光照射部分通过吸嘴的吸入口的激光照射焊球。 因此,可以仅使用单个激光照射部来熔化电极部上的多个焊球。
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8.
公开(公告)号:US07649152B2
公开(公告)日:2010-01-19
申请号:US11233090
申请日:2005-09-23
申请人: Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人: Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
CPC分类号: B23K3/0623 , B23K1/0056 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要: The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.
摘要翻译: 本发明提供一种焊球接合方法和焊球接合装置,其可以提高接合处理的效率,并且通过熔化焊球将形成在待接合物体上的多个电极彼此接合。 在本发明中,焊球由具有对应于待接合物体上的电极区域的多个拾取开口的拾取喷嘴拾取,并且焊球在电极区域上传送。 独立于拾取喷嘴上方设置的激光辐射单元沿着拾取开口的排列方向移动,并且来自激光辐射单元的激光束通过拾取喷嘴的透明构件照射到焊球上, 通过拾取喷嘴的拾取开口,从而熔化电极区域上的焊球。
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9.
公开(公告)号:US20060065641A1
公开(公告)日:2006-03-30
申请号:US11233090
申请日:2005-09-23
申请人: Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人: Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
IPC分类号: B23K26/20
CPC分类号: B23K3/0623 , B23K1/0056 , H01L2224/742 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2203/0195 , H05K2203/041 , H05K2203/082 , H05K2203/107
摘要: The present invention provides a solder ball bonding method and a solder ball bonding apparatus, which can enhance efficiency of bonding processing and in which plural electrodes formed on objects to be bonded are bonded to each other by melting a solder ball. In the present invention, the solder balls are picked up by a pick-up nozzle having a plurality of pick-up openings corresponding to electrode areas on the objects to be bonded and the solder balls are conveyed on the electrode areas. A laser radiating unit disposed independently above the pick-up nozzle is shifted along an arrangement direction of the pick-up openings and a laser beam from the laser radiating unit is irradiated onto the solder ball through a transparent member of the pick-up nozzle and through the pick-up opening of the pick-up nozzle, thereby melting the solder ball on the electrode area.
摘要翻译: 本发明提供一种焊球接合方法和焊球接合装置,其可以提高接合处理的效率,并且通过熔化焊球将形成在待接合物体上的多个电极彼此接合。 在本发明中,焊球由具有对应于待接合物体上的电极区域的多个拾取开口的拾取喷嘴拾取,并且焊球在电极区域上传送。 独立于拾取喷嘴上方设置的激光辐射单元沿着拾取开口的排列方向移动,并且来自激光辐射单元的激光束通过拾取喷嘴的透明构件照射到焊球上, 通过拾取喷嘴的拾取开口,从而熔化电极区域上的焊球。
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公开(公告)号:US20050067395A1
公开(公告)日:2005-03-31
申请号:US10947294
申请日:2004-09-23
申请人: Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
发明人: Osamu Shindo , Toru Mizuno , Satoshi Yamaguchi
CPC分类号: H05K3/3494 , B23K1/0056 , H01L2224/11003 , H01L2224/742 , H05K3/3442 , H05K2203/041 , H05K2203/107
摘要: A solder bonding method and a solder bonding device are provided, in which solder is melted, and heating of electrode portions is performed by irradiating laser light to an inner side of a region where electrodes portions are provided, making the temperature difference between the electrode portions and the melted solder smaller to improve the wettability of the solder and increase bonding reliability. The solder bonding method and the solder bonding device perform bonding of the electrode portions that are formed on an object to be bonded by melting the solder. After supplying the solder onto the electrode portions before melting, a laser is irradiated to the solder and to the electrode portions in the periphery of the solder. The solder melts, and the electrode portions are heated. The wettability of the solder with respect to the electrode portions thus improves, and the reliability of an electrical connection between the electrode portions can be increased.
摘要翻译: 提供焊料接合方法和焊接接合装置,其中焊料熔化,并且通过向设置有电极部分的区域的内侧照射激光来进行电极部分的加热,使得电极部分之间的温度差 并且熔化的焊料更小以改善焊料的润湿性并增加焊接可靠性。 焊接接合方法和焊接接合装置通过熔化焊料进行形成在待接合物体上的电极部分的接合。 在熔融之前将焊料供应到电极部分之后,激光照射到焊料和焊料周围的电极部分。 焊料熔化,电极部分被加热。 因此焊料相对于电极部的润湿性提高,可以提高电极部之间的电连接的可靠性。
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