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公开(公告)号：US20080251193A1
公开(公告)日：2008-10-16
申请号：US10595157
申请日：2005-09-30
IPC分类号： B32B37/14
CPC分类号： H05K3/4652 , H05K3/4069 , H05K3/4614 , H05K2201/0355 , H05K2201/068 , H05K2203/068 , Y10T29/49126
摘要： A method of manufacturing a multi-layer circuit board having the following steps: preparing a laminated member formed of a core circuit board having a circuit pattern thereon and a prepreg sheet having a through-hole filled with conductive paste; forming a laminated structure in a manner that the laminated member is sandwiched by lamination plates; and applying heat and pressure to the laminated structure. According to the method, selecting a lamination plate so as to have thermal expansion coefficient equivalent to that of a core circuit board can protect conductive paste from distortion, thereby offering a high-quality multi-layer circuit board with reliable connection resistance.
摘要翻译： 一种制造多层电路板的方法，具有以下步骤：制备由其上具有电路图案的芯线电路板形成的层压件和具有填充有导电浆料的通孔的预浸料片; 以叠层构件夹持层压板的方式形成层压结构; 并向叠层结构施加热和压力。 根据该方法，选择层压板以使其具有与芯电路板的热膨胀系数相当的热膨胀系数可以保护导电膏不发生变形，从而提供具有可靠连接电阻的高品质多层电路板。
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公开(公告)号：US08007629B2
公开(公告)日：2011-08-30
申请号：US10595157
申请日：2005-09-30
CPC分类号： H05K3/4652 , H05K3/4069 , H05K3/4614 , H05K2201/0355 , H05K2201/068 , H05K2203/068 , Y10T29/49126
摘要： A method of manufacturing a multi-layer circuit board including preparing a laminated member formed of (i) a core circuit board having a circuit pattern thereon and (ii) a prepreg sheet having a through-hole filled with conductive paste, forming a laminated structure such that the laminated member is sandwiched by lamination plates, and applying heat and pressure to the laminated structure. According to this method, selecting a lamination plate that has a thermal expansion coefficient that is equivalent to that of a core circuit board will protect the conductive paste from distortion, thereby offering a high-quality multi-layer circuit board having a reliable connection resistance.
摘要翻译： 一种制造多层电路板的方法，包括制备由（i）其上具有电路图案的芯线电路板和（ii）具有填充有导电浆料的通孔的预浸料片形成的层叠构件，形成层压结构 使得层压构件被层压板夹持，并且对层压结构施加热和压力。 根据该方法，选择具有与核心电路基板的热膨胀系数相当的热膨胀系数的层叠板将保护导电膏不发生变形，从而提供具有可靠连接电阻的高品质多层电路板。
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公开(公告)号：US07281325B2
公开(公告)日：2007-10-16
申请号：US10535158
申请日：2004-11-30
IPC分类号： H01K3/10
CPC分类号： H05K3/022 , B32B3/266 , B32B5/022 , B32B15/14 , B32B15/20 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/0261 , B32B2307/202 , B32B2457/08 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/0355 , H05K2203/068 , H05K2203/1461 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A pre-preg sheet includes a substrate and a resin impregnated in the substrate. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filing a through-hole in the pre-preg sheet to be compressed at a small rate.
摘要翻译： 预浸片包括基材和浸渍在基材中的树脂。 将第一金属箔放置在预浸片上以提供层压体。 将层叠体放入温度保持在接近树脂的软化温度的温度的加热装置中。 层压体在预定压力的温度下被压缩。 将第一金属箔接合到层压体的预浸片材上并硬化树脂，从而提供电路板。 该方法提供了在预处理片材中以小的速率填充通孔的导电糊剂的稳定电阻以被压缩。
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公开(公告)号：US20060064871A1
公开(公告)日：2006-03-30
申请号：US10535158
申请日：2004-11-30
IPC分类号： H01R43/00
CPC分类号： H05K3/022 , B32B3/266 , B32B5/022 , B32B15/14 , B32B15/20 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/0261 , B32B2307/202 , B32B2457/08 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/0355 , H05K2203/068 , H05K2203/1461 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A pre-preg sheet including a substrate and a resin impregnated in the substrate is provided. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filling a through-hole in the pre-preg sheet to be compressed at a small rate.
摘要翻译： 提供了包括基材和浸渍在基材中的树脂的预浸片。 将第一金属箔放置在预浸片上以提供层压体。 将层叠体放入温度保持在接近树脂的软化温度的温度的加热装置中。 层压体在预定压力的温度下被压缩。 将第一金属箔接合到层压体的预浸片材上并硬化树脂，从而提供电路板。 该方法提供了在预处理片材中填充要以小速率压缩的通孔的导电浆料的稳定电阻。
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公开(公告)号：US5928979A
公开(公告)日：1999-07-27
申请号：US16297
申请日：1998-01-30
申请人： Tsutomu Inuzuka , Shinji Harada , Yuji Mido , Tadashi Tojyo , Satoshi Tomioka
发明人： Tsutomu Inuzuka , Shinji Harada , Yuji Mido , Tadashi Tojyo , Satoshi Tomioka
IPC分类号： C04B35/622 , C04B35/111 , C04B35/117 , C04B35/18 , C04B35/65 , C04B35/74 , C04B35/053 , C04B35/185
CPC分类号： C04B35/65 , C04B35/117 , C04B35/18
摘要： The present invention relates to ceramics and a method for making ceramics having very little dimensional change after sintering and high dimensional accuracies, so that the characteristics of inorganic functional material are fully maintained and utilized. The ceramics of the present invention comprise grains of inorganic functional material and grains of complex oxide. The pores existing between said grains of inorganic functional material are filled with said grains of complex oxide produced by a sintering reaction between an oxidized metal and an inorganic compound.
摘要翻译： 本发明涉及陶瓷和烧结后尺寸变化很小，尺寸精度高的陶瓷的制造方法，无机功能材料的特性得到充分保持和利用。 本发明的陶瓷包含无机功能材料颗粒和复合氧化物颗粒。 存在于所述无机功能材料颗粒之间的孔隙填充有通过氧化金属和无机化合物之间的烧结反应生成的复合氧化物晶粒。
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公开(公告)号：US5639704A
公开(公告)日：1997-06-17
申请号：US386052
申请日：1995-02-07
申请人： Tsutomu Inuzuka , Shinji Harada , Yuji Mido , Tadashi Tojyo , Satoshi Tomioka
发明人： Tsutomu Inuzuka , Shinji Harada , Yuji Mido , Tadashi Tojyo , Satoshi Tomioka
IPC分类号： C04B35/622 , C04B35/111 , C04B35/117 , C04B35/18 , C04B35/65 , C04B35/74
CPC分类号： C04B35/65 , C04B35/117 , C04B35/18
摘要： The present invention relates to ceramics and a method for making ceramics having very little dimensional change after sintering and high dimensional accuracies, so that the characteristics of inorganic functional material are fully maintained and utilized. The ceramics of the present invention comprise grains of inorganic functional material and grains of complex oxide. The pores existing between said grains of inorganic functional material are filled with said grains of complex oxide produced by a sintering reaction between an oxidized metal and an inorganic compound.
摘要翻译： 本发明涉及陶瓷和烧结后尺寸变化很小，尺寸精度高的陶瓷的制造方法，无机功能材料的特性得到充分保持和利用。 本发明的陶瓷包含无机功能材料颗粒和复合氧化物颗粒。 存在于所述无机功能材料颗粒之间的孔隙填充有通过氧化金属和无机化合物之间的烧结反应生成的复合氧化物晶粒。
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