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    WATER-BASED INK COMPOSITION FOR BALLPOINT PEN
    1.
    发明申请
    WATER-BASED INK COMPOSITION FOR BALLPOINT PEN 审中-公开
    水壶笔水基墨水组合物

    公开(公告)号：US20130087070A1

    公开(公告)日：2013-04-11

    申请号：US13704115

    申请日：2010-06-18

    申请人： Hiroyuki Itou ,  Yoshihiro Kawakita

    发明人： Hiroyuki Itou ,  Yoshihiro Kawakita

    IPC分类号： C09D11/18

    CPC分类号： C09D11/18

    摘要： Provided is a novel ink composition for a ballpoint pen such that the ink composition combines the strength of water-based ink for ballpoint pens and oil-based ink for ballpoint pens. Specifically provided is a water-based ink composition for ballpoint pens, wherein an oily phase containing an oily solution obtained by dissolving a dye in an organic solvent is contained, as an oil-in-water emulsion, in an aqueous phase comprising a pigment dispersant.

    摘要翻译： 提供了一种用于圆珠笔的新型油墨组合物，使得该油墨组合物将用于圆珠笔的水性油墨的强度和用于圆珠笔的油性油墨相结合。 具体提供了一种用于圆珠笔的水性油墨组合物，其中含有通过将染料溶解在有机溶剂中而获得的油性溶液的油相作为水包油乳液在含有颜料分散剂的水相中包含 。

    INTERMEDIATE MATERIAL FOR MANUFACTURING CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING SUCH INTERMEDIATE MATERIAL
    3.
    发明申请
    INTERMEDIATE MATERIAL FOR MANUFACTURING CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING SUCH INTERMEDIATE MATERIAL 失效
    用于制造电路板的中间材料和使用这种中间材料制造电路板的方法

    公开(公告)号：US20090114338A1

    公开(公告)日：2009-05-07

    申请号：US12088203

    申请日：2006-12-06

    申请人： Yoshihiro Kawakita ,  Toshiaki Takenaka

    发明人： Yoshihiro Kawakita ,  Toshiaki Takenaka

    IPC分类号： B32B38/10 ,  B32B3/10

    CPC分类号： H05K3/4069 ,  H05K3/0032 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T156/1059 ,  Y10T428/14 ,  Y10T428/24322 ,  Y10T428/31522

    摘要： An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness t1 of the prepreg sheet, the minimum diameter rmin of the through-hole, the thickness tf1 of the first film, the diameter rf1 of the first hole, the thickness tf2 of the second film, the diameter rf2 of the second hole satisfy a relation: rf1/tf1≧3, rf2/tf2≧3, and rmin/(t1+tf1+tf2)≦1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.

    摘要翻译： 适用于制造电路板的中间材料包括其中设置有通孔的预浸料片，设置在预浸料片表面上并具有与通孔连通的第一孔的第一膜，设置有第二膜 在所述预浸料片的另一表面上具有与所述通孔连通的第二孔，以及填充所述通孔，所述第一孔和所述第二孔的导电糊。 预浸片的厚度t1，通孔的最小直径rmin，第一膜的厚度tf1，第一孔的直径rf1，第二膜的厚度tf2，第二孔的直径rf2满足 关系：rf1 / tf1> = 3，rf2 / tf2> = 3，rmin /（t1 + tf1 + tf2）<= 1.5。 该中间材料提供了具有连接到金属箔的细通孔导体的电路板，并且稳定而稳定。

    Circuit board having an interstitial inner via hole structure
    8.
    发明授权
    Circuit board having an interstitial inner via hole structure 失效
    具有间隙内通孔结构的电路板

    公开(公告)号：US06734375B2

    公开(公告)日：2004-05-11

    申请号：US09956205

    申请日：2001-09-18

    申请人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

    发明人： Yoshihiro Kawakita ,  Daizo Andoh ,  Fumio Echigo ,  Tadashi Nakamura

    IPC分类号： H05K111

    CPC分类号： H05K3/4626 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4658 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/249953 ,  Y10T428/249996

    摘要： A circuit board including a desired number of electrically insulating layers and wiring layers laminated alternately, and an inner via hole for securing an electrical connection between the wiring layers by compressing and hardening a conductive paste including a conductive particle and a resin. In the electrically insulating layer, a porous sheet is provided a resin sheet at least one surface, and the porous sheet is not impregnated with a resin at least at a central portion. A through hole penetrating the electrically insulating layer in the direction of the thickness of the electrically insulating layer is filled with a conductive paste including a conductive particle and a resin, and pores that are present inside the porous sheet are filled with laminated resin. The average hole diameter of the pores inside the porous sheet may be smaller than the average particle size of the conductive particle. Thereby, it is possible to make the insulating layer of the circuit board securing the interlayer electrically connection by an inner via hole including a conductive paste to be homogenized and ultra-thin and improve the reliability of the connection of the inner via hole.

    摘要翻译： 包括所需数量的电绝缘层和交替层叠的布线层的电路板，以及用于通过压缩和硬化包括导电颗粒和树脂的导电膏来固定布线层之间的电连接的内通孔。 在电绝缘层中，多孔片材至少在一个表面上设置有树脂片，多孔片材至少在中心部分不浸渍树脂。 在电绝缘层的厚度方向贯通电绝缘层的贯通孔填充有包含导电性粒子和树脂的导电性糊剂，并且在多孔质片材内存在的孔填充有层叠树脂。 多孔片内的孔的平均孔径可以小于导电性粒子的平均粒径。 由此，可以使电路基板的绝缘层通过包含导电性糊剂的内部通路孔进行层间电连接，使其均匀化，超薄化，提高内部通孔连接的可靠性。