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    Semiconductor integrated circuit device
    2.
    发明授权
    Semiconductor integrated circuit device 失效
    半导体集成电路器件

    公开(公告)号：US5619055A

    公开(公告)日：1997-04-08

    申请号：US429882

    申请日：1995-04-27

    申请人： Satoshi Meguro ,  Kiyofumi Uchibori ,  Norio Suzuki ,  Makoto Motoyoshi ,  Atsuyoshi Koike ,  Toshiaki Yamanaka ,  Yoshio Sakai ,  Toru Kaga ,  Naotaka Hashimoto ,  Takashi Hashimoto ,  Shigeru Honjou ,  Osamu Minato

    发明人： Satoshi Meguro ,  Kiyofumi Uchibori ,  Norio Suzuki ,  Makoto Motoyoshi ,  Atsuyoshi Koike ,  Toshiaki Yamanaka ,  Yoshio Sakai ,  Toru Kaga ,  Naotaka Hashimoto ,  Takashi Hashimoto ,  Shigeru Honjou ,  Osamu Minato

    IPC分类号： H01L21/8244 ,  H01L27/11 ,  H01L29/76

    CPC分类号： H01L27/1104 ,  H01L27/11 ,  H01L27/1108 ,  Y10S257/903 ,  Y10S257/904

    摘要： A memory cell of the type employing a pair of cross-coupled CMOS inverters of a SRAM is disclosed in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETs. Each load MISFET of a memory cell consists of a source, drain and channel region formed of a semiconductor strip, such as a polycrystalline silicon film strip, and a gate electrode consisting of a different layer conductive film than that of the drive MISFETs. In a memory cell having such a stacked arrangement, the source region and gate electrode of each load MISFET thereof are patterned to have a widely overlapping relationship with each other to form a capacitor element thereacross such that an increase in the overall capacitance associated with each of the memory cell storage nodes is effected thereby decreasing occurrence of soft error. The overlapping relationship for effecting the large capacitor element across the source and gate of the respective load MISFETs is provided by an ion implanting scheme of a p-type impurity into the semiconductor strip. A separate mask for ion-implantation for the formation of the source region of the load MISFET is added followed by the addition of the gate electrode thereof in a manner so as to have a widely overlapping relationship with that of the source region.

    摘要翻译： 公开了采用SRAM的一对交叉耦合CMOS反相器的类型的存储单元，其中负载MISFET堆叠在半导体衬底之上和驱动MISFET之上。 存储单元的每个负载MISFET由诸如多晶硅膜条的半导体条形成的源极，漏极和沟道区域以及由不同于导电膜的驱动MISFET组成的栅电极构成。 在具有这种堆叠布置的存储器单元中，每个负载MISFET的源极区域和栅电极被图案化以具有彼此广泛重叠的关系，以形成电容器元件，使得与每个负载MISFET相关联的总体电容的增加 存储单元存储节点被实现，从而减少软错误的发生。 通过p型杂质离子注入到半导体条中的方式来提供跨越各个负载MISFET的源极和栅极的大电容器元件的重叠关系。 添加用于形成负载MISFET的源极区域的离子注入的单独的掩模，然后以与源极区域具有广泛重叠的关系的方式添加其栅电极。

    Semiconductor integrated circuit device
    3.
    发明授权
    Semiconductor integrated circuit device 失效
    半导体集成电路器件

    公开(公告)号：US5700705A

    公开(公告)日：1997-12-23

    申请号：US470452

    申请日：1995-06-06

    申请人： Satoshi Meguro ,  Kiyofumi Uchibori ,  Norio Suzuki ,  Makoto Motoyoshi ,  Atsuyoshi Koike ,  Toshiaki Yamanaka ,  Yoshio Sakai ,  Toru Kaga ,  Naotaka Hashimoto ,  Takashi Hashimoto ,  Shigeru Honjou ,  Osamu Minato

    发明人： Satoshi Meguro ,  Kiyofumi Uchibori ,  Norio Suzuki ,  Makoto Motoyoshi ,  Atsuyoshi Koike ,  Toshiaki Yamanaka ,  Yoshio Sakai ,  Toru Kaga ,  Naotaka Hashimoto ,  Takashi Hashimoto ,  Shigeru Honjou ,  Osamu Minato

    IPC分类号： H01L21/8244 ,  H01L27/11

    CPC分类号： H01L27/1104 ,  H01L27/11 ,  H01L27/1108 ,  Y10S257/903 ,  Y10S257/904

    摘要： The manufacture of a memory cell of the type employing a pair of cross-coupled CMOS inverters of a SRAM is disclosed in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETs. The manufacture of each load MISFET consists of forming source, drain and channel regions within the same polycrystalline silicon film, and a gate electrode consisting of a different layer conductive film, such as a polycrystalline film, than that of the drive MISFETs. The manufacture of the memory cell having such a stacked arrangement, facilitates the patterning of the source (drain) region and gate electrode of each load MISFET thereof to have an overlapping relationship with each other so as to increase the effective capacitance associated with each of the memory cell storage nodes. The gate electrodes of both the drive and load MISFETs are formed of n-type or of n-type and p-type polycrystalline silicon films, respectively, and electrical connections are formed between the drain regions of the first and second p-channel load MISFETs with that of the drain regions of the first and second n-channel drive MISFETs through separate polycrystalline silicon films, respectively. Also, there are formed electrical connections between the polycrystalline silicon gate electrodes of the first and second load MISFETs with that of drain regions of the second and first drive MISFETs, through the poly-Si gate electrodes of the first and second drive MISFETs, in each memory cell of the SRAM, respectively, furthermore.

    摘要翻译： 公开了采用SRAM的一对交叉耦合CMOS反相器的类型的存储单元的制造，其中负载MISFET堆叠在半导体衬底上方和驱动MISFET上方。 每个负载MISFET的制造包括在同一多晶硅膜内形成源极，漏极和沟道区域，以及由不同层导电膜（例如多晶膜）组成的栅电极，而不是驱动MISFET。 具有这种堆叠布置的存储单元的制造有助于其每个负载MISFET的源极（漏极）区域和栅极电极的图案化，以使得彼此之间具有重叠关系，从而增加与每个负载MISFET相关联的有效电容 存储单元存储节点。 驱动和负载MISFET的栅电极分别由n型或n型和p型多晶硅膜形成，并且在第一和第二p沟道负载MISFET的漏极区之间形成电连接 与第一和第二n沟道驱动MISFET的漏极区分别通过分离的多晶硅膜。 此外，通过第一和第二驱动MISFET的多晶硅栅电极，在第一和第二负载MISFET的多晶硅栅电极与第二和第一驱动MISFET的漏极区域之间形成电连接 此外，SRAM的存储单元分别。

    Semiconductor integrated circuit device
    6.
    发明授权
    Semiconductor integrated circuit device 失效
    半导体集成电路器件

    公开(公告)号：US5646423A

    公开(公告)日：1997-07-08

    申请号：US470451

    申请日：1995-06-06

    申请人： Satoshi Meguro ,  Kiyofumi Uchibori ,  Norio Suzuki ,  Makoto Motoyoshi ,  Atsuyoshi Koike ,  Toshiaki Yamanaka ,  Yoshio Sakai ,  Toru Kaga ,  Naotaka Hashimoto ,  Takashi Hashimoto ,  Shigeru Honjou ,  Osamu Minato

    发明人： Satoshi Meguro ,  Kiyofumi Uchibori ,  Norio Suzuki ,  Makoto Motoyoshi ,  Atsuyoshi Koike ,  Toshiaki Yamanaka ,  Yoshio Sakai ,  Toru Kaga ,  Naotaka Hashimoto ,  Takashi Hashimoto ,  Shigeru Honjou ,  Osamu Minato

    IPC分类号： H01L21/8244 ,  H01L27/11 ,  H01L29/04 ,  H01L31/036

    CPC分类号： H01L27/1104 ,  H01L27/11 ,  H01L27/1108 ,  Y10S257/903 ,  Y10S257/904

    摘要： A memory cell of the type a pair of cross-coupled CMOS inverters of a SRAM is disclosed in which the load MISFETs are stacked above the semiconductor substrate and over the drive MISFETS. Each load MISFET of a memory cell consists of a source, drain and channel region formed within the same polycrystalline silicon film, and a gate electrode consisting of a different layer conductive film than that of the drive MISFETs. In a memory cell having such a stacked arrangement, the source (drain) region and gate electrode of each load MISFET thereof are patterned to have an overlapping relationship with each other so as to increase the effective capacitance associated with each of the memory cell storage nodes. The gate electrodes of both the drive and load MISFETs are formed of n-type and p-type polycrystalline silicon films, respectively, and the drain regions of the first and second p-channel load MISFETs are electrically connected to the drain regions of the first and second n-channel drive MISFETs through separate polycrystalline silicon films, respectively. The polycrystalline silicon gate electrodes of the first and second load MISFETs are respectively electrically connected to the drain regions of the second and first drive MISFETs in each memory cell of the SRAM, furthermore.

    摘要翻译： 公开了SRAM的一对交叉耦合CMOS反相器的类型的存储单元，其中负载MISFET堆叠在半导体衬底之上和驱动MISFETS之上。 存储单元的每个负载MISFET由形成在同一多晶硅膜内的源极，漏极和沟道区域以及由与驱动MISFET不同的导电膜构成的栅电极组成。 在具有这种堆叠布置的存储单元中，其每个负载MISFET的源极（漏极）区域和栅电极被图案化以具有彼此重叠的关系，从而增加与每个存储单元存储节点相关联的有效电容 。 驱动和负载MISFET两者的栅电极分别由n型和p型多晶硅膜形成，并且第一和第二p沟道负载MISFET的漏极区域电连接到第一 和第二n沟道驱动MISFET分别通过单独的多晶硅膜。 此外，第一和第二负载MISFET的多晶硅栅电极分别电连接到SRAM的每个存储单元中的第二和第一驱动MISFET的漏极区。

    Semiconductor integrated circuit device and method of fabricating the same
    8.
    发明授权
    Semiconductor integrated circuit device and method of fabricating the same 失效
    半导体集成电路器件及其制造方法

    公开(公告)号：US06838374B2

    公开(公告)日：2005-01-04

    申请号：US10170359

    申请日：2002-06-14

    申请人： Toshiya Uenishi ,  Satoshi Meguro ,  Masaharu Kubo ,  Masataka Kato ,  Hideo Miura ,  Norio Suzuki

    发明人： Toshiya Uenishi ,  Satoshi Meguro ,  Masaharu Kubo ,  Masataka Kato ,  Hideo Miura ,  Norio Suzuki

    IPC分类号： H01L21/76 ,  H01L21/762 ,  H01L21/8238 ,  H01L27/08 ,  H01L27/092 ,  H01L21/4763

    CPC分类号： H01L21/76237

    摘要： To suppress oxidation of the inner walls of element isolation grooves otherwise occurring during thermal oxidation processes, a nitrogen introducing layer, that has a lower diffusion coefficient relative to an oxidizing agent, is formed at the surface portion of a silicon oxide film buried within an element isolation groove. This nitrogen introduced layer functions as a barrier layer for precluding the oxidizer (such as oxygen, water or the like) in vapor phase from diffusing into the silicon oxide film during thermal processing steps. The nitrogen introduced layer is formed by performing nitrogen ion implantation into the entire surface of a substrate and subsequently applying thermal processing to the substrate to thereby activate the nitrogen that has been doped.

    摘要翻译： 为了抑制在热氧化过程中发生的元件隔离槽的内壁的氧化，在埋置在元件内的氧化硅膜的表面部分形成有相对于氧化剂具有较低扩散系数的氮导入层 隔离槽。 该氮引入层用作阻止层，用于排除气相中的氧化剂（例如氧，水等）在热处理步骤期间扩散到氧化硅膜中。 通过在衬底的整个表面中进行氮离子注入并随后对衬底进行热处理从而激活掺杂的氮而形成氮引入层。

    Method of manufacturing semiconductor devices
    9.
    发明授权
    Method of manufacturing semiconductor devices 有权
    制造半导体器件的方法

    公开(公告)号：US06204184B1

    公开(公告)日：2001-03-20

    申请号：US09276969

    申请日：1999-03-26

    申请人： Akio Nishida ,  Kikuo Kusukawa ,  Toshiaki Yamanaka ,  Natsuki Yokoyama ,  Shinichiro Kimura ,  Norio Suzuki ,  Osamu Tsuchiya ,  Atsushi Ogishima

    发明人： Akio Nishida ,  Kikuo Kusukawa ,  Toshiaki Yamanaka ,  Natsuki Yokoyama ,  Shinichiro Kimura ,  Norio Suzuki ,  Osamu Tsuchiya ,  Atsushi Ogishima

    IPC分类号： H01L21302

    CPC分类号： H01L27/10894 ,  H01L21/31053 ,  H01L21/76229 ,  H01L21/823437 ,  H01L21/823481 ,  H01L27/10814

    摘要： In a method of manufacturing a semiconductor device having a memory mat portion in which an active region and a field region are formed densely, after a polishing stopper film is deposited on a semiconductor substrate, there are formed grooves by etching a polishing stopper film of a field region and the semiconductor substrate. Then, after an insulating film is deposited so as to fill the grooves, the insulating film is partly removed from the memory mat portion by etching. Under this state, the insulating film is chemically mechanically polished until the polishing stopper film is exposed. The film thickness of the polishing stopper film on the active region can be reduced, and an electrical element isolation characteristic of the field region can be improved. At the same time, upon chemical mechanical polishing, a silicon substrate can be prevented from being exposed at the central portion of the memory mat portion and the insulating film can be prevented from being left on the silicon nitride film near the outer periphery, thereby making it possible to form elements having uniform electrical characteristics on all active regions of the memory mat portion.

    摘要翻译： 在制造半导体器件的方法中，其具有密集形成有源区和场区的存储垫部分，在半导体衬底上沉积抛光阻挡膜之后，通过蚀刻抛光阻挡膜形成凹槽 场区域和半导体衬底。 然后，在沉积绝缘膜以填充凹槽之后，通过蚀刻将绝缘膜部分地从存储垫部分除去。 在这种状态下，绝缘膜被化学机械抛光直到抛光阻挡膜露出。 能够减少有源区域上的研磨停止膜的膜厚，能够提高场区域的电气元件隔离特性。 同时，在化学机械抛光时，可以防止硅衬底暴露在存储垫部分的中心部分，并且可以防止绝缘膜留在靠近外周的氮化硅膜上，从而使 可以在存储垫部分的所有有效区域上形成具有均匀电特性的元件。

    Method of manufacturing semiconductor devices
    10.
    发明授权
    Method of manufacturing semiconductor devices 失效
    制造半导体器件的方法

    公开(公告)号：US06380085B2

    公开(公告)日：2002-04-30

    申请号：US09750061

    申请日：2000-12-29

    申请人： Akio Nishida ,  Kikuo Kusukawa ,  Toshiaki Yamanaka ,  Natsuki Yokoyama ,  Shinichiro Kimura ,  Norio Suzuki ,  Osamu Tsuchiya ,  Atsushi Ogishima

    发明人： Akio Nishida ,  Kikuo Kusukawa ,  Toshiaki Yamanaka ,  Natsuki Yokoyama ,  Shinichiro Kimura ,  Norio Suzuki ,  Osamu Tsuchiya ,  Atsushi Ogishima

    IPC分类号： H01L21302

    CPC分类号： H01L27/10894 ,  H01L21/31053 ,  H01L21/76229 ,  H01L21/823437 ,  H01L21/823481 ,  H01L27/10814

    摘要： In a method of manufacturing a semiconductor device having a memory mat portion in which an active region and a field region are formed densely, after a polishing stopper film is deposited on a semiconductor substrate, there are formed grooves by etching a polishing stopper film of a field region and the semiconductor substrate. Then, after an insulating film is deposited so as to fill the grooves, then insulating film is partly removed from the memory mat portion by etching. Under this state, the insulating film is chemically mechanically polished until the polishing stopper film is exposed. The film thickness of the polishing stopper film on the active region can be reduced, and an electrical element isolation characteristic of the field region can be improved. At the same time, upon chemical mechanical polishing, a silicon substrate can be prevented from being exposed at the central portion of the memory mat portion and the insulating film can be prevented from being left on the silicon nitride film near the outer periphery, thereby making it possible to form elements having uniform electrical characteristics on all active regions of the memory mat portion.

    摘要翻译： 在制造半导体器件的方法中，其具有密集形成有源区和场区的存储垫部分，在半导体衬底上沉积抛光阻挡膜之后，通过蚀刻抛光阻挡膜形成凹槽 场区域和半导体衬底。 然后，在沉积绝缘膜以填充凹槽之后，通过蚀刻部分地从存储垫部分去除绝缘膜。 在这种状态下，绝缘膜被化学机械抛光直到抛光阻挡膜露出。 能够减少有源区域上的研磨停止膜的膜厚，能够提高场区域的电气元件隔离特性。 同时，在化学机械抛光时，可以防止硅衬底暴露在存储垫部分的中心部分，并且可以防止绝缘膜留在靠近外周的氮化硅膜上，从而使 可以在存储垫部分的所有有效区域上形成具有均匀电特性的元件。