公开(公告)号：US10147619B2

公开(公告)日：2018-12-04

申请号：US15244087

申请日：2016-08-23

Applicant: Toshiba Memory Corporation

Inventor： Katsuhiro Sato ,  Kaori Deura ,  Yoshinori Kitamura ,  Takahiro Terada ,  Yoshihiro Ogawa ,  Yuji Hashimoto ,  Masaaki Hirakawa ,  Yukako Murakami ,  Hideaki Hirabayashi

IPC: H01L21/306 ,  H01L21/67 ,  H01L21/311

Abstract: A substrate treatment apparatus according to an embodiment includes a treatment part, a cyclic path, a heater, and a first injector. The treatment part is supplied with an etchant containing phosphoric acid and a silica deposition suppressor, and brings a substrate having a silicon nitride film on a surface thereof into contact with the etchant to remove the silicon nitride film from the substrate. The cyclic path circulates the etchant in the treatment part. The heater heats the etchant. The first injector is provided on the cyclic path, and injects the silica deposition suppressor into the etchant.

公开(公告)号：US11171020B2

公开(公告)日：2021-11-09

申请号：US16548263

申请日：2019-08-22

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Satoshi Nakaoka ,  Katsuhiro Sato ,  Hiroaki Ashidate ,  Shinsuke Muraki ,  Yuji Hashimoto

IPC: H01L21/67 ,  H01L21/311

Abstract: A substrate treatment apparatus according to an embodiment includes a treatment tank, a container, a measuring instrument, and a controller. The treatment tank stores a chemical solution to treat a substrate. The container contains a liquid including ammonia from which a gas discharged from the treatment tank is gas-liquid separated. The measuring instrument measures an amount of the ammonia included in the liquid over time. The controller controls the treatment of the substrate based on the amount of the ammonia.

公开(公告)号：US10910236B2

公开(公告)日：2021-02-02

申请号：US16294978

申请日：2019-03-07

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Shinsuke Muraki ,  Hiroaki Yamada ,  Yuji Hashimoto

IPC: H01L21/67 ,  H01L21/306

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a liquid supplier configured to supply liquid to a film on a substrate and cause a substance to dissolve from the film in the liquid. The apparatus further includes a first channel configured to recover the liquid supplied to the film and feed the liquid again to the liquid supplier, and a second channel configured to drain the liquid supplied to the film. The apparatus further includes a first switching module configured to switch a discharge destination of the liquid supplied to the film between the first and second channels, and a second switching module configured to switch between supplementing and not supplementing the first channel with new liquid. The apparatus further includes a controller configured to control the first and second switching modules to adjust concentration of the substance in the liquid to be supplied to the film.