公开(公告)号：US07985643B2

公开(公告)日：2011-07-26

申请号：US12052855

申请日：2008-03-21

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven J. Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven J. Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  William Robert Tonti

IPC分类号： H01L21/8238

CPC分类号： H01L21/76897 ,  H01L21/28052 ,  H01L21/28061 ,  H01L21/28114

摘要： A semiconductor structure. The structure includes (a) a semiconductor layer including a channel region disposed between first and second S/D regions; (b) a gate dielectric region on the channel region; (c) a gate region on the gate dielectric region and electrically insulated from the channel region by the gate dielectric region; (d) a protection umbrella region on the gate region, wherein the protection umbrella region comprises a first dielectric material, and wherein the gate region is completely in a shadow of the protection umbrella region; and (e) a filled contact hole (i) directly above and electrically connected to the second S/D region and (ii) aligned with an edge of the protection umbrella region, wherein the contact hole is physically isolated from the gate region by an inter-level dielectric (ILD) layer which comprises a second dielectric material different from the first dielectric material.

摘要翻译： 半导体结构。 该结构包括（a）包括设置在第一和第二S / D区之间的沟道区的半导体层; （b）沟道区上的栅介质区; （c）栅极电介质区域上的栅极区域，并且通过栅极电介质区域与沟道区域电绝缘; （d）栅极区域上的保护伞区域，其中保护伞区域包括第一介电材料，并且其中栅极区域完全处于保护伞区域的阴影中; 和（e）直接在第二S / D区域上方并电连接到第二S / D区域的填充接触孔（i）和（ii）与保护伞区域的边缘对准，其中接触孔通过一个 层间介电层（ILD）层，其包括不同于第一介电材料的第二电介质材料。

公开(公告)号：US20080166863A1

公开(公告)日：2008-07-10

申请号：US12052855

申请日：2008-03-21

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven J. Holmes ,  David Vaclav Horak ,  Charles William Koburger ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  Steven J. Holmes ,  David Vaclav Horak ,  Charles William Koburger ,  William Robert Tonti

IPC分类号： H01L21/28

CPC分类号： H01L21/76897 ,  H01L21/28052 ,  H01L21/28061 ,  H01L21/28114

摘要： A semiconductor structure. The structure includes (a) a semiconductor layer including a channel region disposed between first and second S/D regions; (b) a gate dielectric region on the channel region; (c) a gate region on the gate dielectric region and electrically insulated from the channel region by the gate dielectric region; (d) a protection umbrella region on the gate region, wherein the protection umbrella region comprises a first dielectric material, and wherein the gate region is completely in a shadow of the protection umbrella region; and (e) a filled contact hole (i) directly above and electrically connected to the second S/D region and (ii) aligned with an edge of the protection umbrella region, wherein the contact hole is physically isolated from the gate region by an inter-level dielectric (ILD) layer which comprises a second dielectric material different from the first dielectric material.

摘要翻译： 半导体结构。 该结构包括（a）包括设置在第一和第二S / D区之间的沟道区的半导体层; （b）沟道区上的栅介质区; （c）栅极电介质区域上的栅极区域，并且通过栅极电介质区域与沟道区域电绝缘; （d）栅极区域上的保护伞区域，其中保护伞区域包括第一介电材料，并且其中栅极区域完全处于保护伞区域的阴影中; 和（e）直接在第二S / D区域上方并电连接到第二S / D区域的填充接触孔（i）和（ii）与保护伞区域的边缘对准，其中接触孔通过一个 层间介电层（ILD）层，其包括不同于第一介电材料的第二电介质材料。

公开(公告)号：US07737504B2

公开(公告)日：2010-06-15

申请号：US11759981

申请日：2007-06-08

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L29/772

CPC分类号： H01L21/823892 ,  H01L21/76229 ,  H01L21/823878 ,  H01L27/11

摘要： A well isolation trenches for a CMOS device and the method for forming the same. The CMOS device includes (a) a semiconductor substrate, (b) a P well and an N well in the semiconductor substrate, (c) a well isolation region sandwiched between and in direct physical contact with the P well and the N well. The P well comprises a first shallow trench isolation (STI) region, and the N well comprises a second STI region. A bottom surface of the well isolation region is at a lower level than bottom surfaces of the first and second STI regions. When going from top to bottom of the well isolation region, an area of a horizontal cross section of the well isolation region is an essentially continuous function.

摘要翻译： CMOS器件的良好隔离沟槽及其形成方法。 CMOS器件包括（a）半导体衬底，（b）半导体衬底中的P阱和N阱，（c）夹在P阱和N阱之间并与P阱和N阱直接物理接触的阱隔离区域。 P阱包括第一浅沟槽隔离（STI）区域，并且N阱包括第二STI区域。 阱隔离区域的底表面处于比第一和第二STI区域的底表面更低的水平面。 当从隔离区域的顶部到底部进行时，阱隔离区域的水平横截面的区域是基本上连续的函数。

公开(公告)号：US07651902B2

公开(公告)日：2010-01-26

申请号：US11737989

申请日：2007-04-20

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L21/338 ,  H01L23/62

CPC分类号： H01L21/76243 ,  H01L21/76251 ,  H01L21/823807 ,  H01L21/823878 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/1207

摘要： Hybrid substrates characterized by semiconductor islands of different crystal orientations and methods of forming such hybrid substrates. The methods involve using a SIMOX process to form an insulating layer. The insulating layer may divide the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.

摘要翻译： 以不同晶体取向的半导体岛为特征的混合基板和形成这种混合基板的方法。 该方法涉及使用SIMOX工艺来形成绝缘层。 绝缘层可以将不同晶体取向中的至少一个的岛分成相互排列的器件和体区。 身体区域可以相对于装置区域电浮动。

公开(公告)号：US07750406B2

公开(公告)日：2010-07-06

申请号：US11877871

申请日：2007-10-24

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L23/62 ,  H01L29/94

CPC分类号： H01L21/76264

摘要： Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design in which the design structure includes devices formed in a hybrid substrate characterized by semiconductor islands of different crystal orientations. An insulating layer divides the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.

摘要翻译： 设计结构体现在机器可读介质中，用于设计，制造或测试设计，其中设计结构包括以混合衬底形成的器件，其特征在于具有不同晶体取向的半导体岛。 绝缘层将至少一个不同晶体取向的岛分成相互排列的器件和体区。 身体区域可以相对于装置区域电浮动。

公开(公告)号：US07268028B1

公开(公告)日：2007-09-11

申请号：US11279962

申请日：2006-04-17

申请人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger, III ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L21/336 ,  H01L21/8234 ,  H01L21/8238 ,  H01L21/8249 ,  H01L21/8244 ,  H01L21/8242

CPC分类号： H01L21/823892 ,  H01L21/76229 ,  H01L21/823878 ,  H01L27/11

摘要： A well isolation trenches for a CMOS device and the method for forming the same. The CMOS device includes (a) a semiconductor substrate, (b) a P well and an N well in the semiconductor substrate, (c) a well isolation region sandwiched between and in direct physical contact with the P well and the N well. The P well comprises a first shallow trench isolation (STI) region, and the N well comprises a second STI region. A bottom surface of the well isolation region is at a lower level than bottom surfaces of the first and second STI regions. When going from top to bottom of the well isolation region, an area of a horizontal cross section of the well isolation region is an essentially continuous function.

摘要翻译： CMOS器件的良好隔离沟槽及其形成方法。 CMOS器件包括（a）半导体衬底，（b）半导体衬底中的P阱和N阱，（c）夹在P阱和N阱之间并与P阱和N阱直接物理接触的阱隔离区域。 P阱包括第一浅沟槽隔离（STI）区域，并且N阱包括第二STI区域。 阱隔离区域的底表面处于比第一和第二STI区域的底表面更低的水平面。 当从隔离区域的顶部到底部进行时，阱隔离区域的水平横截面的区域是基本上连续的函数。

公开(公告)号：US20080258181A1

公开(公告)日：2008-10-23

申请号：US11737989

申请日：2007-04-20

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L27/092 ,  H01L21/8238

CPC分类号： H01L21/76243 ,  H01L21/76251 ,  H01L21/823807 ,  H01L21/823878 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/1207

摘要： Hybrid substrates characterized by semiconductor islands of different crystal orientations and methods of forming such hybrid substrates. The methods involve using a SIMOX process to form an insulating layer. The insulating layer may divide the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.

摘要翻译： 以不同晶体取向的半导体岛为特征的混合基板和形成这种混合基板的方法。 该方法涉及使用SIMOX工艺来形成绝缘层。 绝缘层可以将不同晶体取向中的至少一个的岛分成相互排列的器件和体区。 身体区域可以相对于装置区域电浮动。

公开(公告)号：US20080258222A1

公开(公告)日：2008-10-23

申请号：US11877871

申请日：2007-10-24

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  John Gerard Gaudiello ,  Mark Charles Hakey ,  Steven John Holmes ,  David Vaclav Horak ,  Charles William Koburger ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L27/12

CPC分类号： H01L21/76264

摘要： Design structure embodied in a machine readable medium for designing, manufacturing, or testing a design in which the design structure includes devices formed in a hybrid substrate characterized by semiconductor islands of different crystal orientations. An insulating layer divides the islands of at least one of the different crystal orientations into mutually aligned device and body regions. The body regions may be electrically floating relative to the device regions.

摘要翻译： 设计结构体现在机器可读介质中，用于设计，制造或测试设计，其中设计结构包括以混合衬底形成的器件，其特征在于具有不同晶体取向的半导体岛。 绝缘层将至少一个不同晶体取向的岛分成相互排列的器件和体区。 身体区域可以相对于装置区域电浮动。

公开(公告)号：US20080242016A1

公开(公告)日：2008-10-02

申请号：US12117232

申请日：2008-05-08

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger ,  Jimmy Konstantinos Kontos ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger ,  Jimmy Konstantinos Kontos ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L21/8238

CPC分类号： H01L27/0921 ,  H01L21/76229 ,  H01L21/823878

摘要： Semiconductor methods and device structures for suppressing latch-up in bulk CMOS devices. The method comprises forming a trench in the semiconductor material of the substrate with first sidewalls disposed between a pair of doped wells, also defined in the semiconductor material of the substrate. The method further comprises forming an etch mask in the trench to partially mask the base of the trench, followed by removing the semiconductor material of the substrate exposed across the partially masked base to define narrowed second sidewalls that deepen the trench. The deepened trench is filled with a dielectric material to define a trench isolation region for devices built in the doped wells. The dielectric material filling the deepened extension of the trench enhances latch-up suppression.

摘要翻译： 用于抑制大量CMOS器件中的闩锁的半导体方法和器件结构。 该方法包括在衬底的半导体材料中形成沟槽，其第一侧壁设置在也在衬底的半导体材料中定义的一对掺杂阱之间。 该方法还包括在沟槽中形成蚀刻掩模以部分地掩蔽沟槽的基底，随后去除暴露在部分屏蔽的基底上的衬底的半导体材料，以限定加深沟槽的变窄的第二侧壁。 加深的沟槽填充有介电材料以限定用于内置于掺杂阱中的器件的沟槽隔离区域。 填充沟槽加深的介质材料增强了闩锁抑制。

公开(公告)号：US20080203492A1

公开(公告)日：2008-08-28

申请号：US12117371

申请日：2008-05-08

申请人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger ,  Jimmy Konstantinos Kontos ,  Jack Allan Mandelman ,  William Robert Tonti

发明人： Ethan Harrison Cannon ,  Toshiharu Furukawa ,  Mark Charles Hakey ,  David Vaclav Horak ,  Charles William Koburger ,  Jimmy Konstantinos Kontos ,  Jack Allan Mandelman ,  William Robert Tonti

IPC分类号： H01L27/092

CPC分类号： H01L27/0921 ,  H01L21/76229 ,  H01L21/823878

摘要： Semiconductor methods and device structures for suppressing latch-up in bulk CMOS devices. The method comprises forming a trench in the semiconductor material of the substrate with first sidewalls disposed between a pair of doped wells, also defined in the semiconductor material of the substrate. The method further comprises forming an etch mask in the trench to partially mask the base of the trench, followed by removing the semiconductor material of the substrate exposed across the partially masked base to define narrowed second sidewalls that deepen the trench. The deepened trench is filled with a dielectric material to define a trench isolation region for devices built in the doped wells. The dielectric material filling the deepened extension of the trench enhances latch-up suppression.