LAYER PATTERNING USING DOUBLE EXPOSURE PROCESSES IN A SINGLE PHOTORESIST LAYER
    8.
    发明申请
    LAYER PATTERNING USING DOUBLE EXPOSURE PROCESSES IN A SINGLE PHOTORESIST LAYER 有权
    在单个光电层中使用双重曝光过程的层状图

    公开(公告)号:US20090035708A1

    公开(公告)日:2009-02-05

    申请号:US11831099

    申请日:2007-07-31

    IPC分类号: G03F7/20

    摘要: A structure and a method for forming the same. The method includes providing a structure which includes (a) a to-be-patterned layer, (b) a photoresist layer on top of the to-be-patterned layer wherein the photoresist layer includes a first opening, and (c) a cap region on side walls of the first opening. A first top surface of the to-be-patterned layer is exposed to a surrounding ambient through the first opening. The method further includes performing a first lithography process resulting in a second opening in the photoresist layer. The second opening is different from the first opening. A second top surface of the to-be-patterned layer is exposed to a surrounding ambient through the second opening.

    摘要翻译: 一种结构及其形成方法。 该方法包括提供一种结构,其包括(a)待图案化层,(b)在待图案化层的顶部上的光致抗蚀剂层,其中光致抗蚀剂层包括第一开口,和(c)帽 区域在第一开口的侧壁上。 待图案化层的第一顶表面通过第一开口暴露于周围环境。 该方法还包括执行在光致抗蚀剂层中产生第二开口的第一光刻工艺。 第二个开口与第一个开口不同。 待图案化层的第二顶表面通过第二开口暴露于周围环境。