摘要:
A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
摘要:
Provided are carbon-fiber-reinforced polyimide resin compositions having excellent mechanical strength. The compositions are formed of (a) 5-50 parts by weight of carbon fibers, which have been obtained by coating starting carbon fibers at surfaces thereof with an aromatic polysulfone resin and then heating the thus-coated carbon fibers at 300.degree.-400.degree. C., and (b) 95-50 parts by weight of a polyimide resin which perferably have recurring units of following formula: ##STR1## wherein X represents a specific divalent radical and R represents a particular tetra-valent radical.
摘要:
Integrated circuit sockets for use in a burn-in test are disclosed. The IC sockets are produced by injection molding of a specific polyimide having an inherent viscosity of 0.35 to 0.65 dl/g and essentially consisting of recurring units represented by the formula (I): ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon having from 1 to 10 carbon atoms, etc. and R is a tetravalent radical selected from the group consisting of an aliphatic radical having two or more carbon atoms, cycloaliphatic radical, monoaromatic radical etc.
摘要:
A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
摘要:
Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, in impact strength, flexibility and high-temperature stability.
摘要:
This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following formula: ##STR1## wherein Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetravalent radical of aliphatic radical having at least 2 carbons, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, or noncondensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function and from 5 to 100 parts by weight of fluororesin. The resin composition can provide molded products which are excellent in high-temperature stability, dimensional stability and mechanical strength and moreover have a low friction coefficient and good wear resistance. Therefore, the composition is useful as the material for electric and electronic devices, precision instrument parts etc.Polyimide of this invention can be prepared from aromatic diamines and tetracarboxylic acid dianydrides. Suitable aromatic diamines are 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, bis[4-(3aminophenoxy)phenyl] sulfide etc. Suitable tetracarboxylic acid dianhydrides are pyromellitic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride.Representative fluororesin which can be used in this invention is polytetrafluoroethylene.
摘要:
Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, impact strength, flexibility and high-temperature stability.
摘要:
This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following general formula (I): ##STR1## where Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetra-valent radical of aliphatic radical having 2 or more carbons, cyclic aliphatic radical, monocyclic aromatic radical, fused polycyclic radical and polycyclic aromatic radical wherein the aromatic radicals are linked to one another directly or via bridged member, and from 5 to 100 parts by weight of fibrous reinforcing materials such as glass fibres, carbon fibres, potassium titanate fibres and aromatic polyamide fibres. The resin composition can provide molded products having excellent high-temperature stability, dimensional stability and mechanical strength, and is useful as the material for electric and electronic devices, precision instrument parts etc.Polyimide of this invention can be prepared from aromatic etherdiamined and taetracarboxylic acid dianhydrides. The aromatic etherdiamines are 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfide, etc. The tetracarboxylic acid dianhydrides are pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, etc.
摘要:
Disclosed are novel alkenylphenylmaleimide derivatives having the general formula ##STR1## where R is an alkenyl radical of from 3 to 12 carbon atoms, R' is a hydrogen atom, a halogen atom, or a straight-chain or branched alkyl radical of from 1 to 4 carbon atoms, and n is a whole number of from 1 to 4, and linear dimers thereof as well as a process for the preparation of such maleimide compounds.
摘要:
Disclosed is a curable resin composition comprising (a) at least one maleimide compound selected from the group consisting of N-(alkenylphenyl)maleimide derivatives, and dimers and polymers thereof and (b) one or more kinds of epoxy resins, each having at least one epoxy group in the unit molecule thereof. The resin composition may contain, besides the above two components, an amino compound as a further component (c). The resin composition may comprise a prepolymer of any two components among the three components (a), (b) and (c) and the remaining component. The resin compositions are useful as molding materials, for the fabrication of laminates, and as varnishes, including insulation varnishes and impregnating varnishes.