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31 条记录 (耗时 0.027 秒)

    Composite polymer electrolyte membrane
    1.
    发明授权
    Composite polymer electrolyte membrane 失效
    复合高分子电解质膜

    公开(公告)号：US5858264A

    公开(公告)日：1999-01-12

    申请号：US824864

    申请日：1997-03-26

    申请人： Toshihiro Ichino ,  Yukitoshi Takeshita ,  Fumio Yamamoto ,  Hiroshi Kato ,  Naofumi Mushiake ,  Takayuki Wani

    发明人： Toshihiro Ichino ,  Yukitoshi Takeshita ,  Fumio Yamamoto ,  Hiroshi Kato ,  Naofumi Mushiake ,  Takayuki Wani

    IPC分类号： H01M6/18 ,  H01M10/05 ,  H01M10/0565 ,  H01M10/0566 ,  H01M10/40

    CPC分类号： H01M10/052 ,  H01M10/0565

    摘要： A composite polymer electrolyte membrane which includes an ion-conductive polymer gel contained and supported by a matrix material formed of a porous polytetrafluoroethylene membrane. The porous polytetrafluoroethylene membrane has an internal structure which defines a three-dimensional network of interconnected passages and pathways throughout the membrane. The composite polymer electrolyte membrane has a tensile break strength of at least 10 MPa in at least two orthogonal planar directions, ion conductivity of at least 1 mS/cm, and is useful as a separator between electrodes of a lithium secondary cell.

    摘要翻译： 一种复合聚合物电解质膜，其包含由多孔聚四氟乙烯膜形成的基质材料所包含并负载的离子传导性聚合物凝胶。 多孔聚四氟乙烯膜具有内部结构，其限定了贯穿整个膜的互连通道和通路的三维网络。 复合高分子电解质膜在至少两个正交的平面方向上的拉伸断裂强度为至少10MPa，离子电导率为1mS / cm以上，可用作锂二次电池的电极之间的隔膜。

    Polyol composition of the two-part system for foam grindstone, two-part curable composition for foam grindstone, foam grindstone, and process for production thereof
    3.
    发明申请
    Polyol composition of the two-part system for foam grindstone, two-part curable composition for foam grindstone, foam grindstone, and process for production thereof 有权
    泡沫磨石两部分系统的多元醇组合物，泡沫磨石的两部分可固化组合物，泡沫磨石及其生产方法

    公开(公告)号：US20060122287A1

    公开(公告)日：2006-06-08

    申请号：US10538873

    申请日：2003-12-16

    申请人： Fumio Yamamoto ,  Katsuhide Nishimura

    发明人： Fumio Yamamoto ,  Katsuhide Nishimura

    IPC分类号： C08G18/00 ,  C09K3/14

    CPC分类号： C08G18/6685 ,  B24B37/24 ,  B24D3/28 ,  C08G18/3814 ,  C08G2101/0083

    摘要： A polyol composition contains a polyaminochlorophenylmethane mixture (A) and a polyol (B), in which the component (A) is uniformly dissolved in the component (A) in a weight ratio of 30/70 to 60/40. The component (A) includes 50 to 70% by weight of a specific binuclear polyaminochlorophenylmethane compound, 20 to 40% by weight of a specific trinuclear polyaminochlorophenylmethane compound and 5 to 10% by weight of a specific tetranuclear or higher polyaminochlorophenylmethane compound. The polyol composition exhibits excellent miscibility and dissolution stability, is liquid and enables molding of a foamed article for abrasive in a simple two-component mixing casting machine. According to the present invention, water serving as a foaming agent can be added to the polyol composition containing MBOCA, and the composition for a two-component curable abrasive foam can be held to a temperature equal to or lower than the boiling point of water, thus avoiding water from evaporating upon molding. The resulting abrasive foam has a uniform density distribution and exhibits excellent mechanical properties. A method for satisfactorily producing such an abrasive foam is also provided.

    摘要翻译： 多元醇组合物含有组分（A）以30/70至60/40的重量比均匀溶解于组分（A）中的聚氨基氯苯基甲烷混合物（A）和多元醇（B）。 组分（A）包括50至70重量％的特定双核聚氨基氯苯基甲烷化合物，20至40重量％的特定三核聚氨基氯苯基甲烷化合物和5至10重量％的特定四核或更高的聚氨基氯苯基甲烷化合物。 多元醇组合物表现出优异的混溶性和溶解稳定性，是液体，并且能够在简单的双组分混合浇铸机中模制用于研磨的发泡制品。 根据本发明，作为发泡剂的水可以添加到含有MBOCA的多元醇组合物中，双成分可固化研磨剂的组合物可以保持在水的沸点以下， 从而避免水在成型时蒸发。 所得的研磨泡沫具有均匀的密度分布并且表现出优异的机械性能。 还提供了令人满意地生产这种研磨性泡沫的方法。

    Optical measuring apparatus and measuring method of the same
    4.
    发明授权
    Optical measuring apparatus and measuring method of the same 失效
    光学测量装置及其测量方法

    公开(公告)号：US5576832A

    公开(公告)日：1996-11-19

    申请号：US498248

    申请日：1995-06-29

    申请人： Fumio Yamamoto

    发明人： Fumio Yamamoto

    IPC分类号： G01B11/00 ,  G01B9/08 ,  G01B11/24

    CPC分类号： G01B9/08

    摘要： An optical measuring apparatus and a method of the same wherein any two points, inside and outside of an optical picture image of a measuring object mounted on the table and projected by an optical system, are designated on a screen by a cursor and then the table and the optical system are moved relatively so that a line segment between the designated two points is detected to thereby take measurements for the measuring object.

    摘要翻译： 一种光学测量装置及其方法，其中通过光标在屏幕上指定安装在桌子上并由光学系统投影的测量对象的光学图像的内部和外部的任何两个点，然后由该表 并且相对地移动光学系统，使得检测到指定的两个点之间的线段，从而对测量对象进行测量。

    High-frequency hermetically-sealed circuit package
    6.
    发明授权
    High-frequency hermetically-sealed circuit package 有权
    高频气密电路封装

    公开(公告)号：US07838990B2

    公开(公告)日：2010-11-23

    申请号：US12353100

    申请日：2009-01-13

    申请人： Fumio Yamamoto

    发明人： Fumio Yamamoto

    IPC分类号： H01L23/04

    CPC分类号： H05K9/0056 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/48195 ,  H01L2924/15192 ,  H01L2924/16195

    摘要： A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements, and which includes an opening at an end thereof at the side of the base substrate; and a connector substrate which is provided on the base substrate in a manner that the connector substrate closes the opening, which includes a first high-frequency signal line in an area located inside the covering member for a first surface, and which includes a second high-frequency signal line on a second surface being a surface on the opposite side of the first surface, the second high-frequency signal line being electrically connected to the first high-frequency signal line; wherein the base substrate is formed in a manner that the base substrate is located away from the second high-frequency signal line.

    摘要翻译： 半导体封装包括其上设置有半导体元件的基底基板; 覆盖部件，其设置在覆盖所述半导体元件的所述基底基板上，所述覆盖部件在所述基底侧的一端具有开口部; 以及连接器基板，其以连接器基板封闭开口的方式设置在基底基板上，该开口在位于第一表面的覆盖部件内的区域中包括第一高频信号线，并且包括第二高度 所述第二高频信号线与所述第一高频信号线电连接，所述第二高频信号线与所述第一高频信号线电连接。 其特征在于，所述基底基板以所述基底基板位于远离所述第二高频信号线的方式形成。

    SEMICONDUCTOR PACKAGE
    7.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开
    半导体封装

    公开(公告)号：US20070230145A1

    公开(公告)日：2007-10-04

    申请号：US11535311

    申请日：2006-09-26

    申请人： Fumio Yamamoto

    发明人： Fumio Yamamoto

    IPC分类号： H05K7/00

    CPC分类号： H05K9/0056 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/48195 ,  H01L2924/15192 ,  H01L2924/16195

    摘要： A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements, and which includes an opening at an end thereof at the side of the base substrate; and a connector substrate which is provided on the base substrate in a manner that the connector substrate closes the opening, which includes a first high-frequency signal line in an area located inside the covering member for a first surface, and which includes a second high-frequency signal line on a second surface being a surface on the opposite side of the first surface, the second high-frequency signal line being electrically connected to the first high-frequency signal line; wherein the base substrate is formed in a manner that the base substrate is located away from the second high-frequency signal line.

    摘要翻译： 半导体封装包括其上设置有半导体元件的基底基板; 覆盖部件，其设置在覆盖所述半导体元件的所述基底基板上，所述覆盖部件在所述基底侧的一端具有开口部; 以及连接器基板，其以连接器基板封闭开口的方式设置在基底基板上，该开口在位于第一表面的覆盖部件内的区域中包括第一高频信号线，并且包括第二高度 所述第二高频信号线与所述第一高频信号线电连接，所述第二高频信号线与所述第一高频信号线电连接。 其特征在于，所述基底基板以所述基底基板位于远离所述第二高频信号线的方式形成。

    Numerical controller
    9.
    发明授权
    Numerical controller 失效
    数控机

    公开(公告)号：US5477118A

    公开(公告)日：1995-12-19

    申请号：US658581

    申请日：1991-02-21

    申请人： Takao Yoneda ,  Fumio Yamamoto ,  Yasuji Sakakibara ,  Naoki Arimoto ,  Yoji Yoshida ,  Chisato Banno

    发明人： Takao Yoneda ,  Fumio Yamamoto ,  Yasuji Sakakibara ,  Naoki Arimoto ,  Yoji Yoshida ,  Chisato Banno

    IPC分类号： G05B19/408 ,  G05B19/416 ,  G05B19/18

    CPC分类号： G05B19/408 ,  G05B19/4166 ,  G05B2219/33268 ,  G05B2219/35312 ,  G05B2219/37345 ,  G05B2219/37617 ,  G05B2219/41362

    摘要： A numerical controller for a grinding machine, wherein one of plural reference sizing points is selected according to the contents of a numerical control program. Measured analog data indicating the diameter of a workpiece is received continuously to determine if the size of the machined workpiece coincides with the selected reference sizing point. Upon the coincidence of the size of the machined workpiece with the reference sizing point, a sizing signal is provided, and then machining control is changed in response to the sizing signal. An analog signal provided by a measuring device is sampled at a predetermined interval in a predetermined time. The analog signal is tested to see if the analog signal is in a predetermined range, which is decided based upon the temperature variation or vibrations of the grinding machine. And the result of the test is displayed to facilitate checking the output characteristics of the measuring device. The analog signal is compared with a predetermined reference value, and then the result of the comparison is displayed together with a predetermined reference value.

    摘要翻译： 一种用于研磨机的数值控制器，其中根据数字控制程序的内容选择多个参考尺寸点中的一个。 连续接收指示工件直径的测量模拟数据，以确定加工的工件的尺寸是否与选定的参考上浆点重合。 当加工的工件的尺寸与参考尺寸点重合时，提供尺寸信号，然后响应于尺寸信号改变加工控制。 在预定时间内以预定间隔对由测量装置提供的模拟信号进行采样。 测试模拟信号以查看模拟信号是否在基于磨机的温度变化或振动的预定范围内。 并且显示测试结果以便于检查测量装置的输出特性。 将模拟信号与预定的参考值进行比较，然后将比较结果与预定的参考值一起显示。