Positive-working photoresist composition for thick film formation
    3.
    发明授权
    Positive-working photoresist composition for thick film formation 有权
    用于厚膜形成的正性光致抗蚀剂组合物

    公开(公告)号:US09436084B2

    公开(公告)日:2016-09-06

    申请号:US11792752

    申请日:2006-03-22

    摘要: The invention provides a chemical-amplification positive-working photoresist composition suitable for forming a resist film of a relatively large thickness on a substrate in addition to other advantages. The inventive composition contains (A) a photoacid-generating agent, (B) an alkali-insoluble resin capable of being imparted with increased alkali-solubility by interaction with an acid, (C) an alkali-soluble resin and (D) an organic solvent, wherein the component (C) is (C1) a polyhydroxystyrene or a copolymer having at least 80% by mass of the hydroxystyrene units in an amount not exceeding 15 parts by mass relative to 100 parts by mass of the total amount of the components (B) and (C).

    摘要翻译: 本发明提供了除了其它优点之外,还适用于在基片上形成厚度相对较大的抗蚀剂膜的化学放大正性光致抗蚀剂组合物。 本发明的组合物含有(A)光致酸产生剂,(B)能够通过与酸相互作用而赋予碱溶性增加的碱不溶性树脂,(C)碱溶性树脂和(D)有机 溶剂,其中组分(C)为(C1)聚羟基苯乙烯或共聚物,相对于100质量份的组分的总量,相对于100质量份,羟基苯乙烯单元的至少80质量%的量不超过15质量份 (B)和(C)。

    Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
    4.
    发明申请
    Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal 有权
    化学扩增用于厚膜,厚膜光致抗蚀剂层压产品的正性光致抗蚀剂组合物,厚膜抗蚀剂图案的制造方法和连接端子的制造方法

    公开(公告)号:US20060141388A1

    公开(公告)日:2006-06-29

    申请号:US11025833

    申请日:2004-12-29

    IPC分类号: G03C1/76

    CPC分类号: G03F7/0397

    摘要: A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) comprises a resin containing a structural unit (b1) with a specific structure, and another resin containing a structural unit (b2) with a specific structure.

    摘要翻译: 一种用于厚膜的化学放大型正性光致抗蚀剂组合物,其用于在载体上形成膜厚度为10至150μm的厚膜光致抗蚀剂层,包括(A)在用活性光照射时产生酸的化合物或 (B)包含具有特定结构的结构单元(b1)的树脂和含有结构单元(b2)的树脂,(B)含有结构单元(b2)的树脂, 具体结构。

    Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
    5.
    发明授权
    Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal 有权
    化学扩增用于厚膜,厚膜光致抗蚀剂层压产品的正性光致抗蚀剂组合物,厚膜抗蚀剂图案的制造方法和连接端子的制造方法

    公开(公告)号:US07951522B2

    公开(公告)日:2011-05-31

    申请号:US11025591

    申请日:2004-12-29

    IPC分类号: G03C1/00 G03F7/00

    摘要: A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, comprising (A) a compound that generates acid on irradiation with active light or radiation, (B) a resin that displays increased alkali solubility under the action of acid, and (C) an alkali-soluble resin, wherein the component (B) comprises a resin formed from a copolymer containing a structural unit (b1) with a specific structure.

    摘要翻译: 一种用于厚膜的化学放大型正性光致抗蚀剂组合物,其用于在支撑体顶部上形成膜厚度为10至150μm的厚膜光致抗蚀剂层,其包含(A)在活性光照射下产生酸的化合物或 辐射,(B)在酸的作用下显示增加的碱溶性的树脂,和(C)碱溶性树脂,其中组分(B)包含由含有结构单元(b1)的共聚物形成的树脂, 具体结构。

    Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal
    6.
    发明授权
    Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminal 有权
    化学扩增用于厚膜,厚膜光致抗蚀剂层压产品的正性光致抗蚀剂组合物,厚膜抗蚀剂图案的制造方法和连接端子的制造方法

    公开(公告)号:US07927778B2

    公开(公告)日:2011-04-19

    申请号:US11025833

    申请日:2004-12-29

    IPC分类号: G03C1/00 G03F7/00

    CPC分类号: G03F7/0397

    摘要: A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) comprises a resin containing a structural unit (b1) with a specific structure, and another resin containing a structural unit (b2) with a specific structure.

    摘要翻译: 一种用于厚膜的化学放大型正性光致抗蚀剂组合物,其用于在载体上形成膜厚度为10至150μm的厚膜光致抗蚀剂层,包括(A)在活性光照射时产生酸的化合物或 (B)包含具有特定结构的结构单元(b1)的树脂和含有结构单元(b2)的树脂,(B)含有结构单元(b2)的树脂, 具体结构。

    CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR THICK FILM, THICK-FILM PHOTORESIST LAMINATED PRODUCT, MANUFACTURING METHOD FOR THICK-FILM RESIST PATTERN, AND MANUFACTURING METHOD FOR CONNECTION TERMINAL
    9.
    发明申请
    CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION FOR THICK FILM, THICK-FILM PHOTORESIST LAMINATED PRODUCT, MANUFACTURING METHOD FOR THICK-FILM RESIST PATTERN, AND MANUFACTURING METHOD FOR CONNECTION TERMINAL 有权
    用于厚膜的化学放大正极光电组合物,厚膜光电陶瓷层压产品,厚膜电阻图案的制造方法和连接端子的制造方法

    公开(公告)号:US20060141389A1

    公开(公告)日:2006-06-29

    申请号:US11025870

    申请日:2004-12-29

    IPC分类号: G03C1/76

    CPC分类号: G03F7/0397 Y10S430/111

    摘要: A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) includes a resin formed from a copolymer containing a structural unit (b1) with a specific structure.

    摘要翻译: 一种用于厚膜的化学放大型正性光致抗蚀剂组合物,其用于在载体上形成膜厚度为10至150μm的厚膜光致抗蚀剂层,包括(A)在用活性光照射时产生酸的化合物或 辐射,(B)在酸的作用下显示增加的碱溶性的树脂,其中组分(B)包括由含有具体结构的结构单元(b1)的共聚物形成的树脂。

    Secondary cell having negative electrode base member
    10.
    发明授权
    Secondary cell having negative electrode base member 有权
    二次电池具有负电极基体

    公开(公告)号:US08551651B2

    公开(公告)日:2013-10-08

    申请号:US12518834

    申请日:2007-12-11

    IPC分类号: H01M4/13

    摘要: The present invention aims to realize a battery having high output voltage, high energy density and excellent charge and discharge cycle characteristics through a constitution different from those of conventional batteries. Specifically, one of the following negative electrode base members is used as a negative electrode base member for lithium ion secondary batteries: a negative electrode base member wherein a metal film is formed on a support having an organic film; such a negative electrode base member wherein the surface layer of the organic film is covered with a metal oxide film; a negative electrode base member wherein a metal film is formed on a support having a composite film formed from a composite film-forming material containing an organic component and an inorganic component; and a negative electrode base member wherein a silica coating is formed, on a support having a photoresist pattern, from a silica film-forming coating liquid and a metal film is formed on the support after removing the photoresist pattern.

    摘要翻译: 本发明旨在通过与传统电池不同的结构实现具有高输出电压,高能量密度和优异的充放电循环特性的电池。 具体而言,使用下列负极基材之一作为锂离子二次电池的负极基材:负极基材,其中金属膜形成在具有有机膜的载体上; 这种负极基材,其中有机膜的表面层被金属氧化物膜覆盖; 负极基材,其中金属膜形成在具有由含有有机成分和无机成分的复合成膜材料形成的复合膜的载体上; 在除去光致抗蚀剂图案之后,在载体上形成二氧化硅被膜,在具有光致抗蚀剂图案的载体上形成二氧化硅被膜,在二氧化硅膜形成用涂布液和金属膜上形成负极基材。