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    ADHESIVE SHEET FOR WATER JET LASER DICING
    1.
    发明申请
    ADHESIVE SHEET FOR WATER JET LASER DICING 审中-公开
    水喷射激光胶粘剂表

    公开(公告)号：US20080182095A1

    公开(公告)日：2008-07-31

    申请号：US11931168

    申请日：2007-10-31

    申请人： Fumiteru Asai ,  Takatoshi Sasaki ,  Tsubasa Miki ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

    发明人： Fumiteru Asai ,  Takatoshi Sasaki ,  Tsubasa Miki ,  Tomokazu Takahashi ,  Toshio Shintani ,  Akiyoshi Yamamoto

    IPC分类号： B32B5/02 ,  B32B7/10 ,  B32B3/10

    CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  C09J7/21 ,  C09J2203/326 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/249962

    摘要： The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film, wherein the base film is composed of mesh formed by a fiber. According to the adhesive sheet for water jet laser dicing in the present invention, a film composed of mesh is used as the base film to ensure that the perforation size and opening area are relatively larger than in nonwoven fabric and perforated sheets, thus making it possible to maintain stable permeability to liquids originating in the liquid stream during water jet laser dicing and to provide an adhesive sheet that allows extremely thin semiconductor wafers or materials to be processed while preventing die fly-off or defects such as cracking and chipping in IC components, chips, or the like.

    摘要翻译： 本发明提供了一种水射流激光切割用粘合片，其特征在于，包括层叠在基膜上的粘合剂层，其中，所述基膜由纤维形成的网构成。 根据本发明的喷水激光切割用粘合片，使用由网状构成的膜作为基膜，以确保穿孔尺寸和开口面积比无纺布和穿孔片材相对大，从而使其成为可能 在喷水激光切割期间保持对源自液体流的液体的稳定的渗透性，并且提供允许极薄的半导体晶片或材料被加工同时防止芯片脱落或缺陷如IC部件中的破裂和碎裂的粘合片， 芯片等。

    ADHESIVE SHEET FOR WATER JET LASER DICING
    5.
    发明申请
    ADHESIVE SHEET FOR WATER JET LASER DICING 审中-公开
    水喷射激光胶粘剂表

    公开(公告)号：US20080108262A1

    公开(公告)日：2008-05-08

    申请号：US11931124

    申请日：2007-10-31

    申请人： Fumiteru Asai ,  Takatoshi Sasaki ,  Toshio Shintani ,  Tomokazu Takahashi ,  Tsubasa Miki ,  Akiyoshi Yamamoto

    发明人： Fumiteru Asai ,  Takatoshi Sasaki ,  Toshio Shintani ,  Tomokazu Takahashi ,  Tsubasa Miki ,  Akiyoshi Yamamoto

    IPC分类号： D03D9/00 ,  B32B7/00

    CPC分类号： H01L21/6836 ,  B23K26/146 ,  B23K26/40 ,  B23K2103/50 ,  B26F3/004 ,  C09J7/21 ,  C09J7/22 ,  C09J2201/20 ,  C09J2203/326 ,  H01L21/78 ,  H01L2221/68327 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T442/10

    摘要： The present invention provides an adhesive sheet for water jet laser dicing, comprising an adhesive layer laminated on a base film which has a mean opening diameter of 5 μm to 30 μm. According to the adhesive sheet of the invention, a base film having a mean opening diameter of a certain size is used, thus ensuring better permeability to liquids originating in a liquid stream, and preventing the material that is being processed from being separated by the liquids from the adhesive sheet. In addition, the relatively low mean opening diameter makes it possible to control rippling on the surface of the base film and kept the surface flat, resulting in better adhesion to the material being processed and ensuring that the material being processed is secured during the dicing stage. The ability to improve the adhesion between the base film and the adhesive layer also makes it possible to prevent the separation of the adhesive form the base film and the adhesion of the adhesion on the material being processed when picked up after dicing.

    摘要翻译： 本发明提供一种水喷射激光切割用粘合片，其特征在于，具有层叠在平均开口直径为5〜30μm的基底膜上的粘合剂层。 根据本发明的粘合片，使用具有一定尺寸的平均开口直径的基膜，从而确保对来自液体流的液体的更好的渗透性，并且防止被处理的材料被液体分离 从粘合片。 另外，相对低的平均开口直径使得可以控制基膜的表面上的波纹并保持表面平坦，导致对被处理材料的更好的附着力，并确保在切割阶段期间确保正在加工的材料 。 提高基膜和粘合剂层之间的粘合力的能力也使得可以防止粘合剂从基膜剥离，以及在切割后拾取时对待处理材料的粘合的粘附。

    ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES
    10.
    发明申请
    ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES 审中-公开
    用于加工半导体波导和/或基板的粘合片

    公开(公告)号：US20080118764A1

    公开(公告)日：2008-05-22

    申请号：US11875169

    申请日：2007-10-19

    申请人： Toshio SHINTANI ,  Akiyoshi Yamamoto ,  Fumiteru Asai ,  Kouichi Hashimoto

    发明人： Toshio SHINTANI ,  Akiyoshi Yamamoto ,  Fumiteru Asai ,  Kouichi Hashimoto

    IPC分类号： B32B27/00

    CPC分类号： C09J11/06 ,  C09J7/38 ,  C09J11/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/67005 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  Y10T428/31855

    摘要： An adhesive sheet for processing semiconductor wafers and/or substrates comprises a UV- and/or radiation-transmittable base film and an adhesive layer that undergoes a polymerization curing reaction by means of UV rays and/or radiation, wherein the adhesive layer comprises at least a tackifier and a surfactant. The adhesive sheet of the present invention can be to lower the adhesive strength to the optimal level during pick up or the like after irradiation with UV rays and/or radiation, while maintaining adhesion with adherends before irradiation with UV rays and/or radiation by ensuring that, regardless of the texture on the surface of adherends such as semiconductor wafers and/or substrates, the adhering surface favorably conforms to the texture with preserving enough adhesive and cohesive strength.

    摘要翻译： 用于处理半导体晶片和/或基板的粘合片包括通过UV射线和/或辐射进行聚合固化反应的UV和/或辐射透射性底膜和粘合剂层，其中粘合剂层至少包括 增粘剂和表面活性剂。 本发明的粘合片可以在用紫外线和/或辐射照射之后将粘合强度降低到拾取等期间的最佳水平，同时在用紫外线和/或辐射照射之前保持与被粘物的粘附，确保 无论在诸如半导体晶片和/或基板的被粘附体的表面上的纹理如何，粘合表面有利地符合纹理，同时保持足够的粘合力和内聚强度。