公开(公告)号：US06143423A

公开(公告)日：2000-11-07

申请号：US55301

申请日：1998-04-06

申请人： Toshio Shiobara ,  Satoshi Okuse ,  Takayuki Aoki ,  Hideto Kato

发明人： Toshio Shiobara ,  Satoshi Okuse ,  Takayuki Aoki ,  Hideto Kato

IPC分类号： C08L63/00 ,  H01L23/29 ,  H01L29/12

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528

摘要： An epoxy resin composition contains (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a skeleton having a structure in which two benzene rings are conjugable to each other directly or via an aliphatic unsaturated double bond, carbon atoms having an atomic orbital of SP.sup.2 type accounting for at least 50% of the carbon number, (B) a phenolic resin having a hydroxyl equivalent of at least 160, carbon atoms having an atomic orbital of Sp.sup.2 type accounting for at least 85% of the carbon number, (C) a polyimide resin in an amount of 1-20 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) 70-85% by volume of the entire composition of an inorganic filler. The composition cures into products having flame retardancy and high-temperature reliability even though it is free of bromine compounds and antimony compounds.

摘要翻译： 环氧树脂组合物含有（A）环氧当量至少为185的环氧树脂，其具有两个苯环直接或通过脂族不饱和双键相互结合的结构的骨架，具有原子的碳原子 SP2类型的轨道占碳数的至少50％，（B）羟基当量至少为160的酚醛树脂，具有Sp2类型的原子轨道的碳原子占碳数的至少85％ （C）相对于100重量份组分（A）和（B）组合的量为1-20重量份的聚酰亚胺树脂，和（D）无机填料的整个组合物的70-85体积％ 。 该组合物即使不含溴化合物和锑化合物，也可固化成具有阻燃性和高温可靠性的产品。

公开(公告)号：US5336786A

公开(公告)日：1994-08-09

申请号：US160912

申请日：1993-12-03

申请人： Toshio Shiobara ,  Koji Futatsumori ,  Satoshi Okuse ,  Takayuki Aoki ,  Miyuki Wakao ,  Shigeki Ino

发明人： Toshio Shiobara ,  Koji Futatsumori ,  Satoshi Okuse ,  Takayuki Aoki ,  Miyuki Wakao ,  Shigeki Ino

IPC分类号： C07F7/18 ,  C09C3/12 ,  C07F7/08 ,  C07D303/02

CPC分类号： C07F7/1836

摘要： Novel organic silicon compounds are based on a benzene ring having two epoxy radicals and an alkoxysilane radical. They are useful as resin modifiers, adhesive aids for epoxy resins, and silane coupling agents. Inorganic fillers such as silica surface treated with the compounds are useful in encapsulating resin compositions.

摘要翻译： 新的有机硅化合物基于具有两个环氧基和烷氧基硅烷基的苯环。 它们可用作树脂改性剂，环氧树脂的粘合剂和硅烷偶联剂。 无机填料如用化合物表面处理的二氧化硅可用于封装树脂组合物。

公开(公告)号：US06177489B1

公开(公告)日：2001-01-23

申请号：US09003517

申请日：1998-01-06

申请人： Satoshi Okuse ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Takayuki Aoki ,  Eiichi Asano ,  Shigeki Ino

发明人： Satoshi Okuse ,  Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Takayuki Aoki ,  Eiichi Asano ,  Shigeki Ino

IPC分类号： C08L6302

CPC分类号： H01L23/295 ,  C08G59/245 ,  C08G59/621 ,  C08K3/36 ,  C08K5/20 ,  C08K5/5397 ,  C08K5/54 ,  C08L63/00 ,  C09K21/14 ,  H01L2924/0002 ,  C08L83/00 ,  C08L2666/22 ,  H01L2924/00

摘要： A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.

摘要翻译： 适用于半导体封装的阻燃性环氧树脂组合物含有（A）30重量％间甲酚溶液在25℃时粘度低于80厘泊的结晶环氧树脂，（B）具有至少两个 酚羟基和（C）二氧化硅。 组合物任选地含有（D）有机聚硅氧烷，（E）有机氧化膦，（F）含酰胺基的脱模剂和/或（G）硅烷偶联剂。 固化的组合物获得UL-94V-0的阻燃等级，而不需要阻燃剂并在高温下保持稳定。

公开(公告)号：US6027812A

公开(公告)日：2000-02-22

申请号：US6868

申请日：1998-01-14

申请人： Toshio Shiobara ,  Takayuki Aoki ,  Shigeki Ino ,  Eiichi Asano ,  Satoshi Okuse ,  Kazutoshi Tomiyoshi

发明人： Toshio Shiobara ,  Takayuki Aoki ,  Shigeki Ino ,  Eiichi Asano ,  Satoshi Okuse ,  Kazutoshi Tomiyoshi

IPC分类号： C08G59/62 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  B32B27/38 ,  C08K3/36 ,  C08L63/02

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511

摘要： An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.

摘要翻译： 包含结晶环氧树脂，酚醛树脂和无机填料的环氧树脂组合物通过预先使酚醛树脂上的酚羟基与环氧基上的环氧基团反应形成反应产物，将反应产物 在组合中。 该组合物可在无空隙和电线流动的半导体器件上成型。 因此，封装的半导体器件保持可靠。