公开(公告)号：US07595540B2

公开(公告)日：2009-09-29

申请号：US11488062

申请日：2006-07-18

申请人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

发明人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

IPC分类号： H01L27/14 ,  H01L31/00

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  B81C2203/0109 ,  B81C2203/058 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48997 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.

摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 电连接半导体元件和壁部分之间的导体部分（4）的薄金属线（5），植入在壁部分（9a）之间的空间中的树脂密封材料（7） 诸如盖玻璃（6）的构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）作为支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。

公开(公告)号：US20070018301A1

公开(公告)日：2007-01-25

申请号：US11488062

申请日：2006-07-18

申请人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

发明人： Toshiyuki Fukuda ,  Eizou Fujii ,  Yutaka Fukai ,  Yutaka Harada ,  Kiyokazu Itoi

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  B81B7/0077 ,  B81C2203/0109 ,  B81C2203/058 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48997 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/16788 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device including a package (2) having a plurality of wall portions (9a) and a plurality of conductor portions (4), a semiconductor element such as a solid-state image pickup device (1) mounted in an internal space of the base, thin metal wires (5) electrically connecting the semiconductor element and the conductor portions (4) between the wall portions (9a), a resin sealing material (7) implanted in the spaces between the wall portions (9a), and a closing member such as a cover glass (6). The region for connecting the thin metal wires (5) and the wall portion (9a) region overlap each other, so that the device can be reduced in size and in height. The cover glass (6) can not move easily from the correct position because the wall portions (9a) serve as supporting columns, thereby improving the yield.

摘要翻译： 一种半导体器件，包括具有多个壁部分（9a）和多个导体部分（4）的封装（2），诸如固态图像拾取器件（1）的半导体元件，其安装在 所述底座，将所述半导体元件与所述壁部（9a）之间的所述导体部（4）电连接的薄金属线（5），植入在所述壁部（9a）之间的空间中的树脂密封材料（7） 以及诸如盖玻璃（6）的封闭构件。 用于连接细金属丝（5）和壁部（9a）区域的区域彼此重叠，使得该装置的尺寸和高度可以减小。 由于壁部（9a）用作支柱，因此盖玻璃（6）不能容易地从正确的位置移动，从而提高产量。