摘要:
An insulating film-coated metal foil having on one or both surfaces thereof an organic-inorganic hybrid layer containing dimethylsiloxane and a metalloxane comprising a metal other than Si. Relative to the concentration [Si]1/4t of the Si at a depth of ¼t from the surface of the organic-inorganic hybrid layer in the thickness direction of the hybrid layer, the concentration [Si]3/4t of the Si at a depth of ¾t from the surface of the organic-inorganic hybrid layer in the thickness direction of the hybrid layer satisfies [Si]1/4t
摘要:
An insulating film-coated metal foil having on one or both surfaces thereof an organic-inorganic hybrid layer containing dimethylsiloxane and a metalloxane comprising a metal other than Si. Relative to the concentration [Si]1/4t of the Si at a depth of ¼t from the surface of the organic-inorganic hybrid layer in the thickness direction of the hybrid layer, the concentration [Si]3/4t of the Si at a depth of ¾t from the surface of the organic-inorganic hybrid layer in the thickness direction of the hybrid layer satisfies [Si]1/4t
摘要:
A coating solution for forming a flat-surface insulating film, which is a coating solution obtained by dissolving a poly(diorgano)siloxane A having a mass average molecular weight of 900 to 10,000 and a metal alkoxide B in an organic solvent C and further adding water, wherein the molar ratio A/B of the poly(diorgano)siloxane A to 1 mol of the metal alkoxide B is from 0.05 to 1.5, the organic solvent C has a hydroxyl group, the solubility of water in 100 g of the organic solvent C is from 3 to 20 g, and the molar ratio C/A of the organic solvent C to 1 mol of the poly(diorgano)siloxane A is from 0.05 to 100. This coating solution for forming a flat-surface insulating film ensures that an organic modified silicate composed of a poly(diorgano)siloxane and a metal alkoxide can be formed as a thick film having 1 μm or more and can be an organic modified silicate insulating film causing no irregularities due to phase separation and having a low Young's modulus and flexibility high enough to follow the deformation of a substrate board, as well as high film surface flatness allowing for mounting of microcomponents of an electronic device or the like.
摘要:
The present invention provides stainless steel foil for flexible display use which enables fabrication of a TFT substrate for display use which is superior in shape recovery after being rolled up or bent and which is high in surface flatness and is characterized by having a thickness of 20 μm to 200 μm, a surface roughness Ra of 50 nm or less, and a shape recovery of a distortion angle of 10° or less after being wound around a 30 mm diameter cylinder.
摘要:
The present invention provides stainless steel foil for flexible display use which enables fabrication of a TFT substrate for display use which is superior in shape recovery after being rolled up or bent and which is high in surface flatness and is characterized by having a thickness of 20 μm to 200 μm, a surface roughness Ra of 50 nm or less, and a shape recovery of a distortion angle of 10° or less after being wound around a 30 mm diameter cylinder.
摘要:
A coating solution for forming a flat-surface insulating film, which is a coating solution obtained by dissolving a poly(diorgano)siloxane A having a mass average molecular weight of 900 to 10,000 and a metal alkoxide B in an organic solvent C and further adding water, wherein the molar ratio A/B of the poly(diorgano)siloxane A to 1 mol of the metal alkoxide B is from 0.05 to 1.5, the organic solvent C has a hydroxyl group, the solubility of water in 100 g of the organic solvent C is from 3 to 20 g, and the molar ratio C/A of the organic solvent C to 1 mol of the poly(diorgano)siloxane A is from 0.05 to 100. This coating solution for forming a flat-surface insulating film ensures that an organic modified silicate composed of a poly(diorgano)siloxane and a metal alkoxide can be formed as a thick film having 1 μm or more and can be an organic modified silicate insulating film causing no irregularities due to phase separation and having a low Young's modulus and flexibility high enough to follow the deformation of a substrate board, as well as high film surface flatness allowing for mounting of microcomponents of an electronic device or the like.