公开(公告)号：US20050198369A1

公开(公告)日：2005-09-08

申请号：US10757789

申请日：2004-01-15

申请人： Troy Armstrong ,  Thomas Crowley ,  Kenneth Linn ,  James Naylor ,  Joseph Writz

发明人： Troy Armstrong ,  Thomas Crowley ,  Kenneth Linn ,  James Naylor ,  Joseph Writz

IPC分类号： G06F13/10 ,  G06F15/173

CPC分类号： G06F13/102

摘要： An apparatus, program product and method for managing a number of physical connections to a peripheral device. A multipath driver provides a logical connection interface to a client. This interface allows the client to efficiently access the peripheral device over one or more of the physical connections. In so doing, the logical connection interface associates connections with a primary connection, deletes inactive connections from memory, as well as updates and uses a list of active connections to seamlessly route data to the peripheral device.

摘要翻译： 一种用于管理到外围设备的多个物理连接的装置，程序产品和方法。 多路径驱动程序为客户端提供逻辑连接接口。 该接口允许客户端通过一个或多个物理连接有效地访问外围设备。 这样做，逻辑连接接口将连接与主连接相关联，从内存中删除非活动连接，并更新并使用活动连接列表将数据无缝路由到外围设备。

公开(公告)号：US20080054461A1

公开(公告)日：2008-03-06

申请号：US11847512

申请日：2007-08-30

申请人： Dennis Lang ,  Sonbol Vaziri ,  James Naylor ,  Eric Woolsey ,  Chung-Lin Wu ,  Mike Gruenhagen ,  Neill Thornton

发明人： Dennis Lang ,  Sonbol Vaziri ,  James Naylor ,  Eric Woolsey ,  Chung-Lin Wu ,  Mike Gruenhagen ,  Neill Thornton

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L24/05 ,  H01L23/3114 ,  H01L23/3192 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A wafer level chip scale package (WLCSP) includes a packaged semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions, and encapsulation material surrounding the semiconductor die except for at least a portion of each of the solder bumps.

摘要翻译： 晶片级芯片级封装（WLCSP）包括具有多个焊料凸块焊盘的封装半导体器件，每个焊料凸块焊盘上方的图案化钝化区域，每个焊料凸块焊盘上的图案化凸块下金属化（UBM）区域，以及 钝化区域，UBM区域和钝化区域的一部分上的聚酰亚胺区域，形成在每个UBM区域上的焊料凸块以及围绕半导体管芯的封装材料，除了每个焊料凸块的至少一部分之外。

公开(公告)号：US5524704A

公开(公告)日：1996-06-11

申请号：US383734

申请日：1995-02-06

申请人： Francois Stouvenot ,  Christian Gatellier ,  Florence Bertrand ,  James Naylor

发明人： Francois Stouvenot ,  Christian Gatellier ,  Florence Bertrand ,  James Naylor

IPC分类号： B22D11/01 ,  B22D11/00 ,  B22D11/06

CPC分类号： B22D11/062 ,  B22D11/005 ,  B22D11/064

摘要： The subject of the invention is a process for the continuous casting of very small-diameter wires directly from liquid metal, according to which said liquid metal is made to flow out of a heated and pressurized container made of refractory material, forming a jet of liquid. metal having a diameter equal to or slightly greater than that of the wire to be cast, and said jet is made to solidify by making it penetrate into a layer of moving cooling liquid deposited on the internal wall of a drum rotating about a horizontal axis, wherein said container is fed, continuously or intermittently, with solid metal without interrupting casting and wherein said solid metal is melted inside said container.The subject of the invention is also a device for the continuous casting of very small-diameter wires directly from liquid metal, allowing this process to be implemented.Figure for the abstract: Single figure

摘要翻译： 本发明的主题是直接从液态金属连续铸造非常小直径的线的方法，根据该方法，使所述液态金属从由耐火材料制成的加热和加压容器中流出，形成液体射流 。 金属的直径等于或略大于要铸造的线材的直径，并且所述射流通过使其渗透到沉积在围绕水平轴线旋转的滚筒的内壁上的移动冷却液层中而固化， 其中所述容器连续地或间歇地以固体金属进料，而不中断铸造，并且其中所述固体金属在所述容器内熔化。 本发明的主题也是用于从液态金属直接连续铸造非常小直径的电线的装置，允许实现该过程。 摘要图：单身人物