摘要:
A method of etching a mask layer as a protecting layer for metal contact windows uses a victim layer with slopes to avoid undercutting. First, a mask layer is formed on a semiconductor substrate. Next, a photoresist with patterns is formed on the surface of the mask layer. Next, a victim layer is formed on the surface of the photoresist according to the photoresist topography, such that a plurality of slopes is formed on the sidewalls of the photoresist. The photoresist and the victim layer with slopes are used as the etching mask to etch the mask layer to form patterns.
摘要:
An apparatus and method for modifying and improving pointing device operation. The apparatus comprises a signal detector, a signal modifier, and a signal transmitter. The apparatus intercepts pointing device signals before application programs receive them. The signal detector continuously listens for signals generated by a pointing device, or a pointing device program. Responsive to the signal detector detecting a pointing device signal, the signal modifier determines what type of GUI element is located at the current pointer location. Based upon the identified GUI element, the signal modifier modifies the pointing device signal appropriately. The signal transmitter then relays the modified signal to any other programs that would have received the original signal if not for the action of the apparatus.
摘要:
The present disclosure provides a transparent conductive film on P-type layer of GaN-based LED and a fabricating method thereof. The transparent conductive film is fabricated by Ni/ITO, Al/ITO or NiO/ITO. In one embodiment, the thickness of the Ni layer is 5 Å to 30 Å. The thickness of the Al layer is 5 Å to 30 Å. The thickness of the NiO layer is 5 Å to 40 Å. The thickness of the ITO layer is 1000 Å to 3000 Å. In one embodiment, the fabricating method comprises steps of evaporating one of Ni, Al and NiO layers on a P-type GaN layer, heat-treating a wafer on which the Ni or Al layer is evaporated, then evaporating an ITO layer on the surface of Ni, Al or NiO layer, and heat-treating the wafer on which Ni/ITO, Al/ITO or NiO/ITO layers are evaporated. The transparent conductive film can have high light transmittance within the range of visible light and low specific contact resistance.
摘要:
A double-sided display module with two optically functional films includes a double-sided display panels, a lighting module, and a display controller. The double-sides display panel includes two oppositely disposed display panels, a light guide module, and two optically functional films. Each of the optically functional films includes a first transformation layer, a second transformation layer, a diffusion layer, a brightness enhancement layer, and a polarized layer, and each layer of the optically functional film is attached to each other by transfer-coating process. Therefore, the thickness of the optically functional film can be reduced, so that the cost of manufacturing the double-sided display module with the optically functional films is saved and the volume of the double-sided display module is reduced as well without reducing brightness.
摘要:
An optical module includes a protection layer, an optically functional film, and an optical device. The optically functional film can make an external light transmit through it but cannot allow a reflection of the external light reflected by the optical device transmit through it, and the optically functional film can filter a blue ray of the external light.
摘要:
An Operation Modification Program is disclosed that alters the functions performed with a user input device in conjunction with a Drop Down Menu Program. The Drop Down Menu Program provides for the elimination of some manual steps required by a user when employing a user input device for operations involving activation, selection, sorting and scrolling. The Operation Modification Program provides for modification of pointer device functions to eliminate additional manual steps that would be required by a user with the Drop Down Menu Program. The user may configure the modifications or the user may operate using default settings. Five modifications are provided: pointer-over, pointer-over-with-highlighting, pointer-over-with-clicking, pointer-over-with highlighting-and-clicking, and pointer-movement. The five modifications provide for auto-detection, auto-determination, and auto-execution thereby eliminating one or more manual movements by a user. Each of the five modifications can be applied in the areas of activation, selection, scrolling and sorting.
摘要:
The present invention provides a silver alloy material and a method for manufacturing the silver alloy material, the silver alloy material comprising essentially by weight of about 65% to 95% Ag, about 5% to 35% In. The silver alloy material has a solid-liquid coexistence zone. The steps for manufacturing the silver alloy material include mixing, heating in vacuum status, cooling and annealing. The characters of the silver alloy are low yield tensile strength (58 Mpa), high ultimate tensile strength (300 MPa) and high elongation (60%) and anti-tarnishing property. The silver alloy material could be used for optics reflector mirror, silver ornament, brazing materials and very fine silver alloy wire for semiconductor bounding application.
摘要:
The present disclosure relates to set of a ohmic contact electrodes on both P-type and N-type layers of a GaN-based light emitting diode (LED) and a fabricating method thereof. The materials of ohmic contact electrodes on both P-type and N-type layers of a GaN-based LED are a metal combination of Cr/Pd/Au. In one embodiment, the fabricating method comprises etching out an N-type GaN layer on an epitaxial structure on a sapphire substrate, and evaporating a P-type transparent electrode layer on the P-type GaN layer, then positioning patterns of the ohmic contact electrodes on both P-type and N-type layers, and then evaporating a metal combination of a Cr layer 50 Å to 500 Å thick, a Pd layer 300 Å to 1000 Å thick and an Au layer 3000 Å to 20000 Å thick in turn on the P-type transparent electrode layer and N-type GaN layer respectively, and then annealing electrodes of the chip, on which the Cr, Pd and Au layers are evaporated in nitrogen atmosphere for 5 minutes to 20 minutes at a temperature from 200 degrees to 450 degrees. Excellent ohmic contact characteristics and better thermal stability are obtained as well as higher oxidation resistance, thus improving the reliability of diode.