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公开(公告)号：US20080303111A1
公开(公告)日：2008-12-11
申请号：US12156901
申请日：2008-06-05
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L23/24 , H01L31/18 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention discloses a sensor package and a method for fabricating the same. The sensor package includes: a substrate with an opening; a sensor chip disposed in the opening and electrically connected to the substrate; an encapsulant filling spacing between the sensor chip and the opening so as to secure the sensor chip to the substrate; and a transparent cover attached to the substrate via an adhesive layer, wherein the adhesive layer covers the sensor chip and bonding wires and is formed with an opening for exposing sensor region of the sensor chip. Securing the sensor chip in the opening of the substrate reduces the height of the sensor package, and meanwhile the process cost is reduced by eliminating the need of formation of conductive bumps on the sensor chip or the transparent cover and eliminating the need of specially designed substrate.
摘要翻译： 本发明公开了一种传感器封装及其制造方法。 传感器封装包括：具有开口的基板; 传感器芯片，其布置在所述开口中并电连接到所述基板; 传感器芯片和开口之间的密封剂填充间隔，以将传感器芯片固定到基板上; 以及通过粘合剂层附着到基板的透明盖，其中粘合剂层覆盖传感器芯片和接合线，并且形成有用于暴露传感器芯片的传感器区域的开口。 将传感器芯片固定在基板的开口中，降低传感器封装的高度，同时通过消除在传感器芯片或透明盖上形成导电凸块的需要降低工艺成本，并且不需要特别设计的基板 。
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公开(公告)号：US20080197438A1
公开(公告)日：2008-08-21
申请号：US12070003
申请日：2008-02-14
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L21/78 , H01L27/14618 , H01L27/14687 , H01L2224/94
摘要： This invention discloses a sensor semiconductor device and a manufacturing method thereof, including: providing a wafer having a plurality of sensor chips, forming a plurality of grooves between bond pads on active surfaces of the adjacent sensor chips; forming conductive traces in the grooves for electrically connecting the bond pads; mounting a transparent medium on the wafer for covering sensing areas of the sensor chips; thinning the sensor chips from the non-active surfaces down to the grooves, thereby exposing the conductive traces; cutting the wafer to separate the sensor chips; mounting the sensor chips on a substrate module having a plurality of substrates, electrically connecting the conductive traces to the substrates; providing an insulation material on the substrate module and between the sensor chips so as to encapsulate the sensor chips but expose the transparent medium; and cutting the substrate module to separate a plurality of resultant sensor semiconductor devices.
摘要翻译： 本发明公开了一种传感器半导体器件及其制造方法，包括：提供具有多个传感器芯片的晶片，在相邻传感器芯片的有源表面上的接合焊盘之间形成多个沟槽; 在沟槽中形成导电迹线以电连接接合焊盘; 在所述晶片上安装透明介质以覆盖所述传感器芯片的感测区域; 将传感器芯片从非活性表面减薄到凹槽，从而暴露导电迹线; 切割晶片以分离传感器芯片; 将传感器芯片安装在具有多个基板的基板模块上，将导电迹线电连接到基板; 在衬底模块上和传感器芯片之间提供绝缘材料，以封装传感器芯片，但暴露透明介质; 以及切割所述基板模块以分离多个所得传感器半导体器件。
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公开(公告)号：US20080079105A1
公开(公告)日：2008-04-03
申请号：US11904648
申请日：2007-09-27
IPC分类号： H01L31/0203 , H01L21/02
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/16195 , H01L2224/85 , H01L2924/00014
摘要： A sensor-type package and a fabrication method thereof are provided. A sensor-type chip is mounted on a substrate and is electrically connected to the substrate via bonding wires. A light-pervious body is attached to the sensor-type chip, and has one surface covered with a covering layer and another surface formed with an adhesive layer. An encapsulant encapsulates the light-pervious body. As an adhesive force between the covering layer and the encapsulant is greater than that between the covering layer and the light-pervious body, the covering layer and a portion of the encapsulant located on the covering layer can be concurrently removed, such that the light-pervious body is exposed and light can pass through the light-pervious body to be captured by the sensor-type chip. The above arrangement eliminates the need of using a dam structure as in the prior art and provides a compact sensor-type package with improved fabrication reliability.
摘要翻译： 提供了传感器型封装及其制造方法。 传感器型芯片安装在基板上，并通过接合线与基板电连接。 透光体附着在传感器型芯片上，其一个表面被覆盖层和形成有粘合剂层的另一表面覆盖。 密封剂封装透光体。 由于覆盖层和密封剂之间的粘合力大于覆盖层和透光体之间的粘合力，所以可以同时去除位于覆盖层上的覆盖层和密封剂的一部分， 透光体被曝光，光可以通过透光体，由传感器型芯片捕获。 上述布置消除了如现有技术中使用坝结构的需要，并且提供了具有改进的制造可靠性的紧凑型传感器型封装。
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公开(公告)号：US20080105941A1
公开(公告)日：2008-05-08
申请号：US11982514
申请日：2007-11-02
IPC分类号： H01L31/0203 , H01L21/00
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15311 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.
摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。
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公开(公告)号：US20090039527A1
公开(公告)日：2009-02-12
申请号：US12221725
申请日：2008-08-06
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/05001 , H01L2224/056 , H01L2224/13 , H01L2224/13025 , H01L2224/16146 , H01L2224/94 , H01L2224/97 , H01L2924/19104 , H01L2924/19105 , H01L2924/00014 , H01L2224/81 , H01L2224/83
摘要： A sensor-type package and a method for fabricating the same are provided. A wafer having a plurality of semiconductor chips is provided, wherein a plurality of holes are formed on a first surface of each of the semiconductor chips, and a plurality of metallic pillars formed in the holes and a plurality of bond pads connected to the metallic pillars form through silicon vias (TSVs). A groove is formed on a second surface of each of the semiconductor chips to expose the metallic pillars. A plurality of sensor chips having TSVs are stacked in the grooves of the semiconductor chips and electrically connected to the exposed metallic pillars. A transparent cover is mounted onto the second surfaces of the semiconductor chips to cover the grooves. A plurality of conductive components are implanted on the bond pads of the semiconductor chips. The wafer is cut along borders among the semiconductor chips.
摘要翻译： 提供了一种传感器型封装及其制造方法。 提供具有多个半导体芯片的晶片，其中在每个半导体芯片的第一表面上形成多个孔，并且形成在孔中的多个金属柱和连接到金属柱的多个接合焊盘 通过硅通孔（TSV）形成。 在每个半导体芯片的第二表面上形成凹槽以暴露金属柱。 具有TSV的多个传感器芯片堆叠在半导体芯片的凹槽中并电连接到暴露的金属柱。 透明盖安装在半导体芯片的第二表面上以覆盖凹槽。 在半导体芯片的接合焊盘上注入多个导电元件。 在半导体芯片之间沿着边缘切割晶片。
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公开(公告)号：US20080105942A1
公开(公告)日：2008-05-08
申请号：US11982516
申请日：2007-11-02
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48247 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00012
摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.
摘要翻译： 提供了一种传感器型半导体封装及其制造方法。 传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。
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公开(公告)号：US07858446B2
公开(公告)日：2010-12-28
申请号：US11982516
申请日：2007-11-02
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48247 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00012
摘要： A sensor-type semiconductor package and a fabrication method thereof are provided. The fabrication method of the sensor-type semiconductor package includes steps of: providing a wafer having sensor chips; attaching light-permeable bodies to the sensor chips, wherein each light-permeable body has a covering layer and an adhesive layer; singulating the wafer so as to obtain a plurality of separated sensor chips with the light-permeable bodies attached thereon; attaching and electrically connecting the separated sensor chips to a substrate module having substrates, forming an encapsulant encapsulating the sensor chips and the light-permeable bodies; cutting the encapsulant along edges of the light-permeable bodies to a depth at least corresponding the bottom edges of the covering layers; removing the covering layers with the encapsulant mounted thereon to expose the light-permeable bodies; and cutting between the substrates to obtain a plurality of sensor-type semiconductor packages.
摘要翻译： 提供了一种传感器型半导体封装及其制造方法。 传感器型半导体封装的制造方法包括以下步骤：提供具有传感器芯片的晶片; 将透光体附接到传感器芯片，其中每个透光体具有覆盖层和粘合剂层; 分离晶片，以便获得多个分离的传感器芯片，其上安装有透光体; 将分离的传感器芯片附接和电连接到具有基板的基板模块，形成封装传感器芯片和透光体的密封剂; 沿着透光体的边缘切割密封剂至少对应于覆盖层的底部边缘的深度; 用安装在其上的密封剂去除覆盖层以暴露透光体; 并且在基板之间切割以获得多个传感器型半导体封装。
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公开(公告)号：US20090166831A1
公开(公告)日：2009-07-02
申请号：US12344988
申请日：2008-12-29
CPC分类号： H01L27/14618 , H01L24/45 , H01L24/48 , H01L24/97 , H01L27/14683 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/8592 , H01L2224/97 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： This invention provides a sensor semiconductor package and a method for fabricating the same. The method includes: mounting on a substrate a sensor chip having a sensor area; electrically connecting the sensor chip and the substrate by means of bonding wires; forming on a transparent member an adhesive layer with an opening corresponding in position to the sensor area; and mounting the transparent member on the substrate via the adhesive layer while heating the substrate, such that the adhesive layer melts, to thereby encapsulate the periphery of the sensor chip and the bonding wires while exposing the sensor area from the adhesive layer. Thus, the sensor area is sealed by the transparent member cooperative with the adhesive layer, making the sensor semiconductor package thus-obtained dam-free, light, thin, and compact, and incurs low process costs. Also, the product reliability is enhanced since the bonding wires are encapsulated by the adhesive layer without severing concern.
摘要翻译： 本发明提供一种传感器半导体封装及其制造方法。 该方法包括：在基板上安装具有传感器区域的传感器芯片; 通过接合线电连接传感器芯片和基板; 在透明构件上形成具有对应于传感器区域的位置的开口的粘合剂层; 并且通过粘合剂层将透明构件安装在基板上，同时加热基板，使得粘合剂层熔化，从而在将传感器区域从粘合剂层暴露出来的同时封装传感器芯片和接合线的周边。 因此，传感器区域与透明构件密封，与粘合剂层协作，使得传感器半导体封装得到无阻尼，轻薄，紧凑，并且导致低的工艺成本。 而且，由于接合线被粘合剂层封装而不会被切断，所以产品的可靠性得到提高。
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9.发明申请Compositions Containing Berberine or Analogs Thereof for Treating Rosacea or Red Face Related Skin Disorders 有权包含小檗碱或类似物治疗红斑痤疮或红脸相关皮肤疾病的组合物公开(公告)号：US20120165357A1
公开(公告)日：2012-06-28
申请号：US13379604
申请日：2010-06-30
申请人： Shuen-Iu Hung , Wen-Hung Chung , Tse-Wen Chang
发明人： Shuen-Iu Hung , Wen-Hung Chung , Tse-Wen Chang
IPC分类号： A61K31/4745 , A61P17/10 , A61P31/12 , A61P31/04 , A61P31/10 , A61P29/00 , A61P17/00 , A61P31/00
CPC分类号： A61K9/0014 , A61K31/4375 , A61K45/06
摘要： The invention pertains to topical pharmaceutical formulations of berberine and its biologically equivalent analogues, such as palmatine and coptisine, for the treatment of rosacea and other red face-related skin disorders. The topical pharmaceutical formulations of this invention contain purified berberine as the primary active drug ingredient at concentrations higher than 0.1%. The invention also pertains to methods of treating rosacea and other red face related skin disorders, such as steroid-induced rosacea-like dermatitis, comprising the administration of topical pharmaceutical formulations that contain berberine or its biologically equivalent analogues, such as palmatine.
摘要翻译： 本发明涉及小檗碱及其生物等效类似物如巴马汀和黄连碱的局部药物制剂，用于治疗红斑痤疮和其他与红色面部相关的皮肤疾病。 本发明的局部药物制剂含有浓度高于0.1％的纯化小檗碱作为主要活性药物成分。 本发明还涉及治疗酒渣鼻和其他与红脸相关的皮肤病症如类固醇诱导的红斑痤疮样皮炎的方法，其包括施用含有小檗碱或其生物等效类似物如巴马汀的局部药物制剂。
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10.发明授权公开(公告)号：US07482006B2
公开(公告)日：2009-01-27
申请号：US11404770
申请日：2006-04-17
申请人： Tse-Wen Chang , Jim Jinn-Chyuan Sheu , Lee-Hwa Lo , Nien-Yi Chen , Young-Sun Lin
发明人： Tse-Wen Chang , Jim Jinn-Chyuan Sheu , Lee-Hwa Lo , Nien-Yi Chen , Young-Sun Lin
CPC分类号： C07K16/1009 , A61K2039/505 , C07K2317/21 , C07K2317/52 , C07K2317/622 , C07K2319/00
摘要： Provided is an antibody against enterovirus 71 comprising the amino acid sequence shown in SEQ ID NOS: 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, or 26 or functionally active homologues thereof. Also provided are methods for obtaining the antibody comprising (a) selecting a yeast expressing such an antibody from a yeast library, (b) culturing the yeast under conditions that the antibody is expressed, and (c) recovering the antibody from the culture. Also provided is a process for producing the antibody comprising (a) culturing a host cell under conditions that the antibody is expressed, (b) recovering the antibody from the culture, wherein the host cells are transformed or transfected for expressing the antibody against enterovirus 71. Also provided are pharmaceutical compositions comprising an antibody against enterovirus 71 and a pharmaceutically acceptable carrier or diluent, wherein the antibody has an anti-virus agent or detectable label attached thereto.
摘要翻译： 本发明提供了包含SEQ ID NO：14,15,16,17,18,19,20,21,22,23,24,25或26所示氨基酸序列的肠道病毒71抗体或其功能活性同系物。 还提供了获得抗体的方法，其包括（a）从酵母文库中选择表达这种抗体的酵母，（b）在表达抗体的条件下培养酵母，和（c）从培养物中回收抗体。 还提供了制备抗体的方法，其包括（a）在表达抗体的条件下培养宿主细胞，（b）从培养物中回收抗体，其中宿主细胞被转化或转染用于表达针对肠道病毒的抗体71 还提供了包含针对肠病毒71的抗体和药学上可接受的载体或稀释剂的药物组合物，其中所述抗体具有附着于其上的抗病毒剂或可检测标记。
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