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公开(公告)号：US20080303111A1
公开(公告)日：2008-12-11
申请号：US12156901
申请日：2008-06-05
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L23/24 , H01L31/18 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention discloses a sensor package and a method for fabricating the same. The sensor package includes: a substrate with an opening; a sensor chip disposed in the opening and electrically connected to the substrate; an encapsulant filling spacing between the sensor chip and the opening so as to secure the sensor chip to the substrate; and a transparent cover attached to the substrate via an adhesive layer, wherein the adhesive layer covers the sensor chip and bonding wires and is formed with an opening for exposing sensor region of the sensor chip. Securing the sensor chip in the opening of the substrate reduces the height of the sensor package, and meanwhile the process cost is reduced by eliminating the need of formation of conductive bumps on the sensor chip or the transparent cover and eliminating the need of specially designed substrate.
摘要翻译： 本发明公开了一种传感器封装及其制造方法。 传感器封装包括：具有开口的基板; 传感器芯片，其布置在所述开口中并电连接到所述基板; 传感器芯片和开口之间的密封剂填充间隔，以将传感器芯片固定到基板上; 以及通过粘合剂层附着到基板的透明盖，其中粘合剂层覆盖传感器芯片和接合线，并且形成有用于暴露传感器芯片的传感器区域的开口。 将传感器芯片固定在基板的开口中，降低传感器封装的高度，同时通过消除在传感器芯片或透明盖上形成导电凸块的需要降低工艺成本，并且不需要特别设计的基板 。
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公开(公告)号：US20080197438A1
公开(公告)日：2008-08-21
申请号：US12070003
申请日：2008-02-14
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L21/78 , H01L27/14618 , H01L27/14687 , H01L2224/94
摘要： This invention discloses a sensor semiconductor device and a manufacturing method thereof, including: providing a wafer having a plurality of sensor chips, forming a plurality of grooves between bond pads on active surfaces of the adjacent sensor chips; forming conductive traces in the grooves for electrically connecting the bond pads; mounting a transparent medium on the wafer for covering sensing areas of the sensor chips; thinning the sensor chips from the non-active surfaces down to the grooves, thereby exposing the conductive traces; cutting the wafer to separate the sensor chips; mounting the sensor chips on a substrate module having a plurality of substrates, electrically connecting the conductive traces to the substrates; providing an insulation material on the substrate module and between the sensor chips so as to encapsulate the sensor chips but expose the transparent medium; and cutting the substrate module to separate a plurality of resultant sensor semiconductor devices.
摘要翻译： 本发明公开了一种传感器半导体器件及其制造方法，包括：提供具有多个传感器芯片的晶片，在相邻传感器芯片的有源表面上的接合焊盘之间形成多个沟槽; 在沟槽中形成导电迹线以电连接接合焊盘; 在所述晶片上安装透明介质以覆盖所述传感器芯片的感测区域; 将传感器芯片从非活性表面减薄到凹槽，从而暴露导电迹线; 切割晶片以分离传感器芯片; 将传感器芯片安装在具有多个基板的基板模块上，将导电迹线电连接到基板; 在衬底模块上和传感器芯片之间提供绝缘材料，以封装传感器芯片，但暴露透明介质; 以及切割所述基板模块以分离多个所得传感器半导体器件。
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公开(公告)号：US20080079105A1
公开(公告)日：2008-04-03
申请号：US11904648
申请日：2007-09-27
IPC分类号： H01L31/0203 , H01L21/02
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/16195 , H01L2224/85 , H01L2924/00014
摘要： A sensor-type package and a fabrication method thereof are provided. A sensor-type chip is mounted on a substrate and is electrically connected to the substrate via bonding wires. A light-pervious body is attached to the sensor-type chip, and has one surface covered with a covering layer and another surface formed with an adhesive layer. An encapsulant encapsulates the light-pervious body. As an adhesive force between the covering layer and the encapsulant is greater than that between the covering layer and the light-pervious body, the covering layer and a portion of the encapsulant located on the covering layer can be concurrently removed, such that the light-pervious body is exposed and light can pass through the light-pervious body to be captured by the sensor-type chip. The above arrangement eliminates the need of using a dam structure as in the prior art and provides a compact sensor-type package with improved fabrication reliability.
摘要翻译： 提供了传感器型封装及其制造方法。 传感器型芯片安装在基板上，并通过接合线与基板电连接。 透光体附着在传感器型芯片上，其一个表面被覆盖层和形成有粘合剂层的另一表面覆盖。 密封剂封装透光体。 由于覆盖层和密封剂之间的粘合力大于覆盖层和透光体之间的粘合力，所以可以同时去除位于覆盖层上的覆盖层和密封剂的一部分， 透光体被曝光，光可以通过透光体，由传感器型芯片捕获。 上述布置消除了如现有技术中使用坝结构的需要，并且提供了具有改进的制造可靠性的紧凑型传感器型封装。
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公开(公告)号：US20080105941A1
公开(公告)日：2008-05-08
申请号：US11982514
申请日：2007-11-02
IPC分类号： H01L31/0203 , H01L21/00
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15311 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.
摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。
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公开(公告)号：US20090057799A1
公开(公告)日：2009-03-05
申请号：US12229651
申请日：2008-08-26
CPC分类号： H01L31/0203 , H01L31/02164 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A sensor semiconductor device and a method for fabricating the same are provided. At least one sensor chip is mounted and electrically connected to a lead frame. A first and a second encapsulation molding processes are sequentially performed to form a transparent encapsulant for encapsulating the sensor chip and a part of the lead frame and to form a light-impervious encapsulant for encapsulating the transparent encapsulant. The transparent encapsulant has a light-pervious portion formed at a position corresponding to and above a sensor zone of the sensor chip. The light-pervious portion is exposed from the light-impervious encapsulant. Light may penetrate the light-pervious portion, without using an additional cover board, thereby reducing manufacturing steps and costs. The above arrangement avoids prior-art problems of poor reliability caused by a porous encapsulant and poor signal reception caused by interference of ambient light entering into a conventional chip only encapsulated by a transparent encapsulant.
摘要翻译： 提供一种传感器半导体器件及其制造方法。 至少一个传感器芯片被安装并电连接到引线框架。 依次执行第一和第二封装成型工艺以形成用于封装传感器芯片和引线框架的一部分的透明密封剂，并形成用于封装透明密封剂的不透光密封剂。 透明密封剂具有形成在对应于传感器芯片的传感器区域上方的位置处的透光部分。 透光部分从不透光的密封剂暴露出来。 光可以穿透透光部分，而不使用附加的盖板，从而减少制造步骤和成本。 上述布置避免了由多孔密封剂引起的可靠性差的现有技术问题，以及由仅通过透明密封剂封装的传统芯片的环境光的干扰引起的差信号接收。
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公开(公告)号：US20090039527A1
公开(公告)日：2009-02-12
申请号：US12221725
申请日：2008-08-06
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/05001 , H01L2224/056 , H01L2224/13 , H01L2224/13025 , H01L2224/16146 , H01L2224/94 , H01L2224/97 , H01L2924/19104 , H01L2924/19105 , H01L2924/00014 , H01L2224/81 , H01L2224/83
摘要： A sensor-type package and a method for fabricating the same are provided. A wafer having a plurality of semiconductor chips is provided, wherein a plurality of holes are formed on a first surface of each of the semiconductor chips, and a plurality of metallic pillars formed in the holes and a plurality of bond pads connected to the metallic pillars form through silicon vias (TSVs). A groove is formed on a second surface of each of the semiconductor chips to expose the metallic pillars. A plurality of sensor chips having TSVs are stacked in the grooves of the semiconductor chips and electrically connected to the exposed metallic pillars. A transparent cover is mounted onto the second surfaces of the semiconductor chips to cover the grooves. A plurality of conductive components are implanted on the bond pads of the semiconductor chips. The wafer is cut along borders among the semiconductor chips.
摘要翻译： 提供了一种传感器型封装及其制造方法。 提供具有多个半导体芯片的晶片，其中在每个半导体芯片的第一表面上形成多个孔，并且形成在孔中的多个金属柱和连接到金属柱的多个接合焊盘 通过硅通孔（TSV）形成。 在每个半导体芯片的第二表面上形成凹槽以暴露金属柱。 具有TSV的多个传感器芯片堆叠在半导体芯片的凹槽中并电连接到暴露的金属柱。 透明盖安装在半导体芯片的第二表面上以覆盖凹槽。 在半导体芯片的接合焊盘上注入多个导电元件。 在半导体芯片之间沿着边缘切割晶片。
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公开(公告)号：US20080296716A1
公开(公告)日：2008-12-04
申请号：US12151570
申请日：2008-05-07
CPC分类号： H01L21/56 , H01L23/3114 , H01L27/14618 , H01L27/14683 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A sensor semiconductor device and a manufacturing method thereof are disclosed. The method includes: providing a light-permeable carrier board with a plurality of metallic circuits; electrically connecting the metallic circuits to a plurality of sensor chips through conductive bumps formed on the bond pads of the sensor chips, wherein the sensor chips have been previously subjected to thinning and chip probing; filling a first dielectric layer between the sensor chips to cover the metallic circuits and peripheries of the sensor chips; forming a second dielectric layer on the sensor chips and the first dielectric layer; forming grooves between the sensor chips for exposing the metallic circuits such that a plurality of conductive traces electrically connected to the metallic circuits can be formed on the second dielectric layer; and singulating the sensor chips to form a plurality of sensor semiconductor devices. The present invention overcomes the drawbacks of breakage of trace connection due to a sharp angle formed at joints, poor electrical connection and chip damage due to an alignment error in cutting from the back of the wafer, as well as an increased cost due to multiple sputtering processes for forming traces.
摘要翻译： 公开了一种传感器半导体器件及其制造方法。 该方法包括：提供具有多个金属电路的透光性载板; 通过形成在传感器芯片的接合焊盘上的导电凸块将金属电路电连接到多个传感器芯片，其中传感器芯片已经预先经受了薄化和芯片探测; 在传感器芯片之间填充第一电介质层以覆盖金属电路和传感器芯片的周边; 在所述传感器芯片和所述第一介电层上形成第二电介质层; 在所述传感器芯片之间形成用于暴露所述金属电路的槽，使得可以在所述第二介电层上形成电连接到所述金属电路的多个导电迹线; 并且分离传感器芯片以形成多个传感器半导体器件。 本发明克服了由于在接头处形成的尖角导致的迹线连接断裂的缺点，由于从晶片背面的切割中的对准误差导致的不良电连接和芯片损坏以及由于多次溅射而导致的成本增加 形成痕迹的过程。
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公开(公告)号：US20080237767A1
公开(公告)日：2008-10-02
申请号：US12080002
申请日：2008-03-31
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L27/14618 , B81C1/00888 , B81C2203/0118 , H01L23/3114 , H01L24/11 , H01L27/14683 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05548 , H01L2224/05569 , H01L2224/05644 , H01L2224/05655 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/01023
摘要： A sensor-type semiconductor device and manufacturing method thereof are disclosed. The method includes providing a wafer comprising a plurality of sensor chips; forming concave grooves between the solder pads formed on the active surface of adjacent sensor chips; filling a filling material into the concave grooves and forming first conductive circuits electrically connecting the solder pads of adjacent sensor chips; mounting a light permeable body on the active surface of the wafer and thinning the non-active surface of the wafer to expose the filling material; mounting the wafer on a carrier board with second conductive circuits formed thereon corresponding in position to the filling material; forming first openings by cutting the light permeable body and the wafer to a position at which the second conductive circuits are located; forming metallic layers in the first openings by electroplating, the metallic layers electrically connecting the first and second conductive circuits of adjacent sensor chips; forming second openings by cutting the metallic layers to break the first conductive circuit connections and the second conductive circuit connections of adjacent sensor chips and meanwhile keep the first and second conductive circuits of each sensor chip still electrically connected through the metallic layers; filling a dielectric material into the second openings and removing the carrier board; and separating each of the sensor chips to form a plurality of sensor-type semiconductor devices. The invention overcomes the drawbacks of the prior art such as slanting notches formed on the non-active surface of the wafer, displacement of the notches due to the difficulty in precise alignment, as well as broken joints caused by concentrated stress generated in the slanting notches and exposed circuits.
摘要翻译： 公开了一种传感器型半导体器件及其制造方法。 该方法包括提供包括多个传感器芯片的晶片; 在形成在相邻传感器芯片的有效表面上的焊盘之间形成凹槽; 将填充材料填充到凹槽中并形成电连接相邻传感器芯片的焊盘的第一导电电路; 将透光体安装在晶片的活性表面上并使晶片的非活性表面变薄以暴露填充材料; 将晶片安装在载体板上，其上形成有对应于位于填充材料的第二导电电路; 通过将透光体和晶片切割到第二导电电路所在的位置来形成第一开口; 通过电镀在第一开口中形成金属层，金属层电连接相邻传感器芯片的第一和第二导电电路; 通过切割金属层来形成第二开口，以破坏相邻传感器芯片的第一导电电路连接和第二导电电路连接，同时保持每个传感器芯片的第一和第二导电电路通过金属层电连接; 将电介质材料填充到第二开口中并移除载体板; 并分离每个传感器芯片以形成多个传感器型半导体器件。 本发明克服了现有技术的缺点，例如在晶片的非活性表面上形成的倾斜凹口，由于难以精确对准而导致的凹口位移以及由倾斜凹口产生的集中应力引起的断裂接头 和暴露电路。
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公开(公告)号：US20090166831A1
公开(公告)日：2009-07-02
申请号：US12344988
申请日：2008-12-29
CPC分类号： H01L27/14618 , H01L24/45 , H01L24/48 , H01L24/97 , H01L27/14683 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/8592 , H01L2224/97 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： This invention provides a sensor semiconductor package and a method for fabricating the same. The method includes: mounting on a substrate a sensor chip having a sensor area; electrically connecting the sensor chip and the substrate by means of bonding wires; forming on a transparent member an adhesive layer with an opening corresponding in position to the sensor area; and mounting the transparent member on the substrate via the adhesive layer while heating the substrate, such that the adhesive layer melts, to thereby encapsulate the periphery of the sensor chip and the bonding wires while exposing the sensor area from the adhesive layer. Thus, the sensor area is sealed by the transparent member cooperative with the adhesive layer, making the sensor semiconductor package thus-obtained dam-free, light, thin, and compact, and incurs low process costs. Also, the product reliability is enhanced since the bonding wires are encapsulated by the adhesive layer without severing concern.
摘要翻译： 本发明提供一种传感器半导体封装及其制造方法。 该方法包括：在基板上安装具有传感器区域的传感器芯片; 通过接合线电连接传感器芯片和基板; 在透明构件上形成具有对应于传感器区域的位置的开口的粘合剂层; 并且通过粘合剂层将透明构件安装在基板上，同时加热基板，使得粘合剂层熔化，从而在将传感器区域从粘合剂层暴露出来的同时封装传感器芯片和接合线的周边。 因此，传感器区域与透明构件密封，与粘合剂层协作，使得传感器半导体封装得到无阻尼，轻薄，紧凑，并且导致低的工艺成本。 而且，由于接合线被粘合剂层封装而不会被切断，所以产品的可靠性得到提高。
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10.发明授权Package structure having micro-electromechanical element and fabrication method thereof 有权具有微机电元件的封装结构及其制造方法公开(公告)号：US08198689B2
公开(公告)日：2012-06-12
申请号：US12769041
申请日：2010-04-28
IPC分类号： H01L23/485
CPC分类号： H01L21/02 , B81B7/007 , B81B2207/07 , H01L23/52 , H01L29/84 , H01L2224/02166 , H01L2224/48091 , H01L2224/48465 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.
摘要翻译： 提出具有微机电（MEMS）元件的封装结构，其包括具有多个电连接焊盘和形成在其上的MEMS元件的芯片; 设置在所述芯片上用于覆盖所述MEMS元件的盖; 设置在每个电连接焊盘上的螺柱凸块; 形成在芯片上的密封剂，其中一部分柱状凸块从密封剂暴露出来; 以及金属导电层，形成在密封剂上并连接到凸块上。 本发明的特征在于直接完成晶片上的封装工艺，以便在更短的时间内制造更薄和更便宜的封装结构。 本发明还提供如上所述的用于制造封装结构的方法。
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