公开(公告)号：US09662741B2

公开(公告)日：2017-05-30

申请号：US14361811

申请日：2012-11-20

Applicant: UACJ CORPORATION

Inventor： Tomoyuki Kudo ,  Takashi Murase ,  Takeshi Koshio

IPC: B23K37/00 ,  B23K37/04 ,  B23K31/00 ,  B23K31/02 ,  B23K20/02 ,  B21D26/023 ,  B21D26/055 ,  B23K20/16 ,  B23K1/20 ,  B23K20/00 ,  B21D26/021 ,  B23K20/24 ,  B23K20/14 ,  B23K20/233 ,  B21D37/16 ,  B23K101/04 ,  B23K103/10 ,  B23K103/14

CPC classification number: B23K20/023 ,  B21D26/021 ,  B21D26/023 ,  B21D26/055 ,  B21D37/16 ,  B23K1/203 ,  B23K20/008 ,  B23K20/14 ,  B23K20/16 ,  B23K20/233 ,  B23K20/2333 ,  B23K20/2336 ,  B23K20/24 ,  B23K2101/04 ,  B23K2103/10 ,  B23K2103/14 ,  Y10T403/478

Abstract: The metal forming method includes deforming a member to be formed (2) that includes a second metal and that has been heated and bringing the member into contact with a member to be bonded (3) that includes a first metal and that has been heated, in which the temperature of the member to be bonded (3) is a temperature at which a liquid phase percentage in the member to be bonded (3) is from 5 to 35%.

公开(公告)号：US20140376996A1

公开(公告)日：2014-12-25

申请号：US14361811

申请日：2012-11-20

Applicant: UACJ CORPORATION

Inventor： Tomoyuki Kudo ,  Takashi Murase ,  Takeshi Koshio

IPC: B23K20/02 ,  B23K1/20 ,  B21D26/021 ,  B23K20/14 ,  B23K20/233

CPC classification number: B23K20/023 ,  B21D26/021 ,  B21D26/023 ,  B21D26/055 ,  B21D37/16 ,  B23K1/203 ,  B23K20/008 ,  B23K20/14 ,  B23K20/16 ,  B23K20/233 ,  B23K20/2333 ,  B23K20/2336 ,  B23K20/24 ,  B23K2101/04 ,  B23K2103/10 ,  B23K2103/14 ,  Y10T403/478

Abstract: The metal forming method includes deforming a member to be formed (2) that includes a second metal and that has been heated and bringing the member into contact with a member to be bonded (3) that includes a first metal and that has been heated, in which the temperature of the member to be bonded (3) is a temperature at which a liquid phase ratio in the member to be bonded (3) is from 5 to 35%.

Abstract translation: 金属成形方法包括使包括第二金属并且被加热的构件（2）变形并使构件与包括第一金属并被加热的待粘合构件（3）接触， 其中待结合部件（3）的温度为待接合部件（3）的液相率为5〜35％的温度。