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公开(公告)号:US11499209B2
公开(公告)日:2022-11-15
申请号:US15517518
申请日:2015-10-08
申请人: UACJ Corporation
发明人: Tomoyuki Kudo , Yoshifumi Shinzato , Ryo Kuramoto
IPC分类号: C22C21/06 , B22D11/00 , C22F1/047 , C22C21/00 , B22D11/124 , B22D11/049 , C22F1/00 , C21D8/02
摘要: The present disclosure shows a superplastic-forming aluminum alloy plate that has excellent properties for superplastic-forming, such as blow forming, and that has excellent surface properties after forming. Shown is a superplastic-forming aluminum alloy plate and a production method therefor, the superplastic-forming aluminum alloy plate being characterized by comprising an aluminum alloy which contains 2.0 to 6.0 mass % Mg, 0.5 to 1.8 mass % Mn and 0.40 mass % or less Cr and in which the balance consists of Al and unavoidable impurities, wherein the unavoidable impurities are restricted to have 0.20 mass % or less Fe and 0.20 mass % or less Si, the 0.2% proof stress is 340 MPa or more, and the density of intermetallic compounds having an equivalent circular diameter of 5 to 15 μm at the RD-TD plane which extends along the center of the plate cross-section is 50 to 400 pieces/mm2.
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公开(公告)号:US11459642B2
公开(公告)日:2022-10-04
申请号:US15517518
申请日:2015-10-08
申请人: UACJ Corporation
发明人: Tomoyuki Kudo , Yoshifumi Shinzato , Ryo Kuramoto
IPC分类号: C22C21/06 , B22D11/00 , C22F1/047 , C22C21/00 , B22D11/124 , B22D11/049 , C22F1/00 , C21D8/02
摘要: The present disclosure shows a superplastic-forming aluminum alloy plate that has excellent properties for superplastic-forming, such as blow forming, and that has excellent surface properties after forming. Shown is a superplastic-forming aluminum alloy plate and a production method therefor, the superplastic-forming aluminum alloy plate being characterized by comprising an aluminum alloy which contains 2.0 to 6.0 mass % Mg, 0.5 to 1.8 mass % Mn and 0.40 mass % or less Cr and in which the balance consists of Al and unavoidable impurities, wherein the unavoidable impurities are restricted to have 0.20 mass % or less Fe and 0.20 mass % or less Si, the 0.2% proof stress is 340 MPa or more, and the density of intermetallic compounds having an equivalent circular diameter of 5 to 15 μm at the RD-TD plane which extends along the center of the plate cross-section is 50 to 400 pieces/mm2.
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公开(公告)号:US10907241B2
公开(公告)日:2021-02-02
申请号:US14411229
申请日:2013-06-26
发明人: Tomoyuki Kudo , Makoto Saga
IPC分类号: C22C21/08 , C22F1/05 , C22F1/043 , C22F1/00 , C22C21/00 , C22F1/04 , C22C21/02 , C22C21/04 , C22F1/047
摘要: Provided is an aluminum alloy plate for blow molding comprising: 0.3% by mass or more and 1.8% by mass or less of Mg; 0.6% by mass or more and 1.6% by mass or less of Si; and 0.2% by mass or more and 1.2% by mass or less of Mn; wherein, in at least one surface of the aluminum alloy plate for blow molding, X and Y satisfy the following relations: 0.10≤X, and, Y≥−8.0X+10.8; wherein X represents the ratio of regions whose valley depth in a roughness curve is 0.3 μm or more; and Y represents the yield stress upon deformation of the aluminum alloy plate for blow molding under predetermined conditions.
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公开(公告)号:US20150152536A1
公开(公告)日:2015-06-04
申请号:US14411229
申请日:2013-06-26
申请人: UACJ CORPORATION
发明人: Tomoyuki Kudo , Makoto Saga
CPC分类号: C22F1/043 , C22C21/00 , C22C21/02 , C22C21/04 , C22C21/08 , C22F1/00 , C22F1/04 , C22F1/047 , C22F1/05
摘要: Provided is an aluminum alloy plate for blow molding comprising: 0.3% by mass or more and 1.8% by mass or less of Mg; 0.6% by mass or more and 1.6% by mass or less of Si; and 0.2% by mass or more and 1.2% by mass or less of Mn; wherein, in at least one surface of the aluminum alloy plate for blow molding, X and Y satisfy the following relations: 0.10≦X, and, Y≦−8.0X+10.8; wherein X represents the ratio of regions whose valley depth in a roughness curve is 0.3 μm or more; and Y represents the yield stress upon deformation of the aluminum alloy plate for blow molding under predetermined conditions.
摘要翻译: 本发明提供一种吹塑成型用铝合金板,其特征在于,含有0.3质量%以上且1.8质量%以下的Mg, 0.6质量%以上且1.6质量%以下的Si; 和0.2质量%以上且1.2质量%以下的Mn; 其中,在用于吹塑的铝合金板的至少一个表面中,X和Y满足以下关系:0.10≦̸ X,Y≦̸ -8.0X + 10.8; 其中X表示粗糙度曲线中的谷深度为0.3μm以上的区域的比率; Y表示在规定条件下用于吹塑的铝合金板的变形时的屈服应力。
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公开(公告)号:US20140376996A1
公开(公告)日:2014-12-25
申请号:US14361811
申请日:2012-11-20
申请人: UACJ CORPORATION
发明人: Tomoyuki Kudo , Takashi Murase , Takeshi Koshio
IPC分类号: B23K20/02 , B23K1/20 , B21D26/021 , B23K20/14 , B23K20/233
CPC分类号: B23K20/023 , B21D26/021 , B21D26/023 , B21D26/055 , B21D37/16 , B23K1/203 , B23K20/008 , B23K20/14 , B23K20/16 , B23K20/233 , B23K20/2333 , B23K20/2336 , B23K20/24 , B23K2101/04 , B23K2103/10 , B23K2103/14 , Y10T403/478
摘要: The metal forming method includes deforming a member to be formed (2) that includes a second metal and that has been heated and bringing the member into contact with a member to be bonded (3) that includes a first metal and that has been heated, in which the temperature of the member to be bonded (3) is a temperature at which a liquid phase ratio in the member to be bonded (3) is from 5 to 35%.
摘要翻译: 金属成形方法包括使包括第二金属并且被加热的构件(2)变形并使构件与包括第一金属并被加热的待粘合构件(3)接触, 其中待结合部件(3)的温度为待接合部件(3)的液相率为5〜35%的温度。
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公开(公告)号:US20170247781A1
公开(公告)日:2017-08-31
申请号:US15442128
申请日:2017-02-24
申请人: UACJ CORPORATION
发明人: Yoshifumi Shinzato , Tomoyuki Kudo
IPC分类号: C22F1/043 , B22D21/00 , B21D26/021 , C22C21/02
CPC分类号: C22F1/043 , B21D26/021 , B22D21/007 , C22C21/02
摘要: The present invention provides an Al—Mg—Si-based hot forming aluminum alloy plate which has not only high age-hardening property but also a high m value in a high strain rate range and excellent surface properties after forming and which is suitable for hot forming. The hot forming aluminum alloy plate comprises an aluminum alloy comprising 0.3 to 1.8 mass % Mg, 0.6 to 2.0 mass % Si and 0.04 to 0.20 mass % Fe. In the aluminum alloy, Mn content is restricted to 0.030 mass % or less, and Cr content is restricted to 0.030 mass % or less, and a balance comprises Al and unavoidable impurities. The hot forming aluminum alloy plate has an electrical conductivity of 60% or less according to IACS %. A production method of the hot forming aluminum alloy plate is also provided.
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公开(公告)号:US09662741B2
公开(公告)日:2017-05-30
申请号:US14361811
申请日:2012-11-20
申请人: UACJ CORPORATION
发明人: Tomoyuki Kudo , Takashi Murase , Takeshi Koshio
IPC分类号: B23K37/00 , B23K37/04 , B23K31/00 , B23K31/02 , B23K20/02 , B21D26/023 , B21D26/055 , B23K20/16 , B23K1/20 , B23K20/00 , B21D26/021 , B23K20/24 , B23K20/14 , B23K20/233 , B21D37/16 , B23K101/04 , B23K103/10 , B23K103/14
CPC分类号: B23K20/023 , B21D26/021 , B21D26/023 , B21D26/055 , B21D37/16 , B23K1/203 , B23K20/008 , B23K20/14 , B23K20/16 , B23K20/233 , B23K20/2333 , B23K20/2336 , B23K20/24 , B23K2101/04 , B23K2103/10 , B23K2103/14 , Y10T403/478
摘要: The metal forming method includes deforming a member to be formed (2) that includes a second metal and that has been heated and bringing the member into contact with a member to be bonded (3) that includes a first metal and that has been heated, in which the temperature of the member to be bonded (3) is a temperature at which a liquid phase percentage in the member to be bonded (3) is from 5 to 35%.
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