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公开(公告)号:US11985762B2
公开(公告)日:2024-05-14
申请号:US17157695
申请日:2021-01-25
申请人: UBE EXSYMO CO., LTD.
发明人: Eisuke Tachibana , Taro Suzuki , Makoto Totani , Kouji Kondoh , Eijirou Miyagawa , Junya Kasahara , Takao Arima
IPC分类号: B32B15/08 , B29C43/48 , B29C48/88 , B32B3/08 , B32B7/04 , B32B7/06 , B32B15/088 , B32B15/09 , B32B15/098 , B32B15/18 , B32B15/20 , B32B27/28 , B32B27/36 , B32B27/42 , B32B37/06 , B32B37/08 , B32B37/10 , H05K1/03 , H05K1/09 , H05K1/11 , H05K3/02 , H05K3/46 , B65G15/12 , H05K3/06 , H05K3/22
CPC分类号: H05K1/0393 , B29C48/9145 , B32B3/08 , B32B7/04 , B32B7/06 , B32B15/08 , B32B15/088 , B32B15/09 , B32B15/098 , B32B15/18 , B32B15/20 , B32B27/28 , B32B27/281 , B32B27/283 , B32B27/36 , B32B27/42 , B32B37/06 , B32B37/08 , B32B37/10 , B32B37/1027 , H05K1/09 , H05K1/115 , H05K3/022 , H05K3/4655 , B29C43/48 , B32B2250/02 , B32B2250/03 , B32B2250/40 , B32B2307/30 , B32B2307/302 , B32B2307/306 , B32B2307/50 , B32B2307/538 , B32B2307/546 , B32B2307/732 , B32B2307/734 , B32B2307/748 , B32B2309/02 , B32B2309/04 , B32B2405/00 , B32B2457/08 , B32B2457/20 , B65G15/12 , H05K3/067 , H05K3/227 , H05K2201/0141 , H05K2201/0191 , H05K2201/068 , H05K2203/066 , H05K2203/1194 , H05K2203/1545
摘要: A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45° C. lower than the melting point of the liquid crystal polymer to a temperature that is 5° C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235° C. lower than the melting point of the liquid crystal polymer to a temperature that is 100° C. lower than the melting point.