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公开(公告)号:US10370757B2
公开(公告)日:2019-08-06
申请号:US14648226
申请日:2014-01-28
Applicant: ULVAC, Inc.
Inventor: Tetsushi Fujinaga , Masahiro Matsumoto , Makoto Arai , Eriko Mase , Harunori Iwai , Koji Takahashi , Atsuhito Ihori
Abstract: A thin substrate processing device include a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.
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公开(公告)号:US11111577B2
公开(公告)日:2021-09-07
申请号:US15757820
申请日:2017-02-27
Applicant: ULVAC, Inc.
Inventor: Yousuke Kobayashi , Harunori Iwai , Tetsushi Fujinaga , Atsuhito Ihori , Noriaki Tani
Abstract: A film formation apparatus includes a target containing a magnetic material, a support that supports a substrate and locates the substrate in an arrangement region opposing the target, and a magnetic field formation unit located at a side of the arrangement region opposite to the target. The magnetic field formation unit forms a horizontal magnetic field parallel to an oscillation direction, which is one direction extending along the substrate, at a side of the arrangement region where the target is located. The magnetic field formation unit oscillates the horizontal magnetic field in the oscillation direction at least between one end of the arrangement region and another end of the arrangement region in the oscillation direction.
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公开(公告)号:US20240120233A1
公开(公告)日:2024-04-11
申请号:US18263548
申请日:2022-09-26
Applicant: ULVAC, INC.
Inventor: Tetsushi Fujinaga , Yukinobu Numata , Yasuo Ookubo , Daiki Shimada
IPC: H01L21/687 , C23C14/50 , H01L21/683
CPC classification number: H01L21/68742 , C23C14/505 , H01L21/6831
Abstract: A vacuum processing apparatus of this invention having a stage on which is disposed the to-be-processed substrate further has a lifting/rotation mechanism capable of lifting the to-be-processed substrate lying on the stage off from an upper surface of the stage to a predetermined height position so that, at this lifted position, the to-be-processed substrate is capable of rotation about a substrate center by a predetermined rotational angle. The lifting/rotation mechanism has: a driving rod built into the stage so as to be moveable up and down and also be rotatable; and a substrate supporting body having a base end plate part capable of contacting a central region, including the substrate center, of the to-be-processed substrate. The substrate supporting body further has at least two arm plate parts elongated from the base end plate part outward thereof.
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公开(公告)号:US20180355474A1
公开(公告)日:2018-12-13
申请号:US15757820
申请日:2017-02-27
Applicant: ULVAC, Inc.
Inventor: Yousuke Kobayashi , Harunori Iwai , Tetsushi Fujinaga , Atsuhito Ihori , Noriaki Tani
CPC classification number: C23C14/35 , C23C14/06 , C23C14/34 , H01F41/18 , H01J37/3405 , H01J37/3426 , H01J37/3452
Abstract: A film formation apparatus includes a target containing a magnetic material, a support that supports a substrate and locates the substrate in an arrangement region opposing the target, and a magnetic field formation unit located at a side of the arrangement region opposite to the target. The magnetic field formation unit forms a horizontal magnetic field parallel to an oscillation direction, which is one direction extending along the substrate, at a side of the arrangement region where the target is located. The magnetic field formation unit oscillates the horizontal magnetic field in the oscillation direction at least between one end of the arrangement region and another end of the arrangement region in the oscillation direction.
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公开(公告)号:US20160376697A1
公开(公告)日:2016-12-29
申请号:US14648226
申请日:2014-01-28
Applicant: ULVAC, Inc.
Inventor: Tetsushi Fujinaga , Masahiro Matsumoto , Makoto Arai , Eriko Mase , Harunori Iwai , Koji Takahashi , Atsuhito Ihori
CPC classification number: C23C14/541 , C23C14/345 , C23C14/50 , C23C14/568 , H01J37/32009 , H01J37/3244 , H01J37/32697 , H01J37/32715 , H01J37/32724 , H01J37/34 , H01J37/3464 , H01J37/3497 , H01L21/67109 , H01L21/6838
Abstract: A thin substrate processing device includes a substrate processing unit configured to process a thin substrate, and a cooling unit configured to cool the thin substrate when the substrate processing unit is processing the thin substrate.
Abstract translation: 薄基板处理装置包括被配置为处理薄基板的基板处理单元和被配置为当基板处理单元正在处理薄基板时冷却薄基板的冷却单元。
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