公开(公告)号：US20150230343A1

公开(公告)日：2015-08-13

申请号：US14693159

申请日：2015-04-22

Applicant: ULVAC, Inc.

Inventor： Satoru TAKASAWA ,  Shuhei ICHIKAWA ,  Isao SUGIURA ,  Satoru ISHIBASHI ,  Junichi NITTA

IPC: H05K3/16 ,  H05K1/11 ,  H05K3/18 ,  H05K1/03 ,  C23F1/02 ,  H05K3/06

CPC classification number: H05K3/16 ,  C22C9/01 ,  C22C9/06 ,  C23C14/205 ,  C23C14/3414 ,  C23F1/02 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0366 ,  H05K1/115 ,  H05K3/06 ,  H05K3/108 ,  H05K3/188 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/0317 ,  H05K2201/09509 ,  H05K2201/09563 ,  H01L2224/0401

Abstract: A mounting device in which a conductive film that is not separated is formed on a resin substrate. Alloy thin films, which contain more than 50% by atom of Cu, 5% by atom or more and 30% by atom or less of Ni, and 3% by atom or more and 10% by atom or less of Al, are formed on a base consisting of a resin so as to be brought into contact with a surface of the base by sputtering. Conductive films consisting of copper are formed on surfaces of the alloy thin films so as to obtain a wiring film having a two-layer structure and a metal plug filled in a connection hole. The alloy thin films have high adhesion to a resin; and hence, the wiring film and the metal plug are not separated.

Abstract translation: 在树脂基板上形成没有分离的导电膜的安装装置。 含有超过50原子％的Cu，5原子％以上，30原子％以下的Ni，3原子％以上10原子以下的Al的合金薄膜形成为 在由树脂构成的基底上，通过溅射与基底的表面接触。 在合金薄膜的表面上形成由铜组成的导电膜，以获得具有两层结构的布线膜和填充在连接孔中的金属塞。 合金薄膜对树脂的粘附性高; 因此，布线膜和金属插塞不分离。