DRIVE CURRENT ADJUSTMENT FOR TRANSISTORS FORMED IN THE SAME ACTIVE REGION BY LOCALLY INDUCING DIFFERENT LATERAL STRAIN LEVELS IN THE ACTIVE REGION
    7.
    发明申请
    DRIVE CURRENT ADJUSTMENT FOR TRANSISTORS FORMED IN THE SAME ACTIVE REGION BY LOCALLY INDUCING DIFFERENT LATERAL STRAIN LEVELS IN THE ACTIVE REGION 审中-公开
    通过局部诱导活跃区域中不同的侧向应变水平在同一活跃区域形成的晶体管的驱动电流调整

    公开(公告)号:US20090294868A1

    公开(公告)日:2009-12-03

    申请号:US12424095

    申请日:2009-04-15

    IPC分类号: H01L27/092 H01L21/8238

    摘要: The drive current capability of a pull-down transistor and a pass transistor formed in a common active region may be adjusted on the basis of a strain-inducing mechanism, such as a stressed dielectric material and a stress memorization technique, thereby providing a simplified overall geometric configuration of the active region. Hence, static RAM cells may be formed on the basis of a minimum channel length with a simplified configuration of the active region, thereby avoiding significant yield losses as may be observed in sophisticated devices in which a pronounced variation of the transistor width may be used to adjust the ratio of the drive current capabilities for the pull-down transistor and the pass transistor.

    摘要翻译: 形成在公共有源区域中的下拉晶体管和传输晶体管的驱动电流能力可以基于诸如应力介电材料和应力记忆技术之类的应变诱导机构来调节,从而提供简化的总体 活动区域的几何配置。 因此,可以基于具有有源区域的简化配置的最小沟道长度形成静态RAM单元,从而避免了在可以使用晶体管宽度的显着变化的复杂器件中可观察到的显着的产量损失 调整下拉晶体管和传输晶体管的驱动电流能力的比值。

    SOI semiconductor device comprising substrate diodes having a topography tolerant contact structure
    8.
    发明授权
    SOI semiconductor device comprising substrate diodes having a topography tolerant contact structure 有权
    SOI半导体器件包括具有地形容忍接触结构的衬底二极管

    公开(公告)号:US08436425B2

    公开(公告)日:2013-05-07

    申请号:US12915168

    申请日:2010-10-29

    IPC分类号: H01L27/12

    摘要: In an SOI semiconductor device, substrate diodes may be formed on the basis of a superior design of the contact level and the metallization layer, thereby avoiding the presence of metal lines connecting to both diode electrodes in the critical substrate diode area. To this end, contact trenches may be provided so as to locally connect one type of diode electrodes within the contact level. Consequently, additional process steps for planarizing the surface topography upon forming the contact level may be avoided.

    摘要翻译: 在SOI半导体器件中,可以基于接触电平和金属化层的优良设计来形成衬底二极管,从而避免在关键衬底二极管区域中存在连接到二极管电极的金属线。 为此,可以提供接触沟槽,以便在接触电平内局部连接一种类型的二极管电极。 因此,可以避免在形成接触电平时使表面形貌平坦化的附加工艺步骤。

    Contacts and vias of a semiconductor device formed by a hard mask and double exposure
    9.
    发明授权
    Contacts and vias of a semiconductor device formed by a hard mask and double exposure 有权
    通过硬掩模和双重曝光形成的半导体器件的触点和通孔

    公开(公告)号:US08318598B2

    公开(公告)日:2012-11-27

    申请号:US12537321

    申请日:2009-08-07

    IPC分类号: H01L21/4763

    摘要: A contact element may be formed on the basis of a hard mask, which may be patterned on the basis of a first resist mask and on the basis of a second resist mask, to define an appropriate intersection area which may represent the final design dimensions of the contact element. Consequently, each of the resist masks may be formed on the basis of a photolithography process with less restrictive constraints, since at least one of the lateral dimensions may be selected as a non-critical dimension in each of the two resist masks.

    摘要翻译: 可以基于硬掩模形成接触元件,硬掩模可以基于第一抗蚀剂掩模并且基于第二抗蚀剂掩模来图案化,以限定适当的交叉区域,其可以表示最终的设计尺寸 接触元件。 因此,可以基于具有较少限制性约束的光刻工艺来形成每个抗蚀剂掩模,因为在两个抗蚀剂掩模中的每一个中可以选择至少一个横向尺寸作为非临界尺寸。

    SOI semiconductor device with reduced topography above a substrate window area
    10.
    发明授权
    SOI semiconductor device with reduced topography above a substrate window area 有权
    SOI衬底窗口区域上方的图形减小的SOI半导体器件

    公开(公告)号:US08048726B2

    公开(公告)日:2011-11-01

    申请号:US12914663

    申请日:2010-10-28

    CPC分类号: H01L21/84 H01L27/1207

    摘要: In sophisticated SOI devices, circuit elements, such as substrate diodes, may be formed in the crystalline substrate material on the basis of a substrate window, wherein the pronounced surface topography may be compensated for or at least reduced by performing additional planarization processes, such as the deposition of a planarization material, and a subsequent etch process when forming the contact level of the semiconductor device.

    摘要翻译: 在复杂的SOI器件中,可以在衬底窗口的基础上在晶体衬底材料中形成诸如衬底二极管之类的电路元件,其中可以通过执行附加的平坦化工艺来补偿或至少减少显着的表面形貌,例如 平坦化材料的沉积,以及当形成半导体器件的接触电平时的后续蚀刻工艺。